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41. 发明授权

US5137461A Separable electrical connection technology 失效
标题翻译：可分离的电气连接技术
公开(公告)号：US5137461A
公开(公告)日：1992-08-11
申请号：US606007
申请日：1990-10-30
申请人： Perminder S. Bindra , Jerome J. Cuomo , Thomas P. Gall , Anthony P. Ingraham , Sung K. Kang , Jungihl Kim , Paul Lauro , David N. Light , Voya R. Markovich , Ekkehard F. Miersch , Jaynal A. Molla , Douglas O. Powell , John J. Ritsko , George J. Saxenmeyer, Jr. , Jack A. Varcoe , George F. Walker
发明人： Perminder S. Bindra , Jerome J. Cuomo , Thomas P. Gall , Anthony P. Ingraham , Sung K. Kang , Jungihl Kim , Paul Lauro , David N. Light , Voya R. Markovich , Ekkehard F. Miersch , Jaynal A. Molla , Douglas O. Powell , John J. Ritsko , George J. Saxenmeyer, Jr. , Jack A. Varcoe , George F. Walker
IPC分类号： H01R4/26 , H01R4/58 , H01R13/22 , H05K3/32
CPC分类号： H01R4/26 , H01L24/83 , H01L24/90 , H01L24/98 , H01R13/22 , H01R4/58 , H05K3/325 , H01L2224/13111 , H01L2224/29111 , H01L2224/2919 , H01L2224/48227 , H01L2224/8319 , H01L2224/838 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , Y10T29/49224
摘要： A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.
摘要翻译：提供一种用于电气设备的可分离和可重新连接的连接件，其适于小型化，其中容纳从平面部分一体地附接和突出的垂直交叉构件，以控制与相对的类似接触件配合时发生的横向位移损坏。通过提供一个或多个共形相对的接触，通过加强涂层和基底加强件以及可变形的涂层来容纳横向应力来避免位移损伤。接触是通过物理和化学过程制造的，包括溅射，正常和脉冲电镀以及化学气相沉积。完成的触点设置有增强刚性的周边固定材料。

42. 发明授权

US08878259B2 Super lattice/quantum well nanowires 有权
标题翻译：超晶格/量子阱纳米线
公开(公告)号：US08878259B2
公开(公告)日：2014-11-04
申请号：US13555383
申请日：2012-07-23
申请人： Harold J. Hovel , Qiang Huang , Xiaoyan Shao , James Vichiconti , George F. Walker
发明人： Harold J. Hovel , Qiang Huang , Xiaoyan Shao , James Vichiconti , George F. Walker
IPC分类号： H01L29/94 , H01L29/76 , H01L31/119 , H01L31/113 , H01L31/062 , H01L31/18 , B82Y10/00 , B82Y30/00 , C30B29/02 , C30B29/06 , C30B29/40 , C30B29/52 , C30B29/60 , C30B33/10 , H01L21/306 , H01L29/06 , H01L29/12 , H01L31/0352 , H01L33/20
CPC分类号： H01L31/18 , B82Y10/00 , B82Y30/00 , C30B29/02 , C30B29/06 , C30B29/40 , C30B29/52 , C30B29/60 , C30B29/605 , C30B33/10 , H01L21/30604 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/125 , H01L31/0352 , H01L33/20
摘要： Segmented semiconductor nanowires are manufactured by removal of material from a layered structure of two or more semiconductor materials in the absence of a template. The removal takes place at some locations on the surface of the layered structure and continues preferentially along the direction of a crystallographic axis, such that nanowires with a segmented structure remain at locations where little or no removal occurs. The interface between different segments can be perpendicular to or at angle with the longitudinal direction of the nanowire.
摘要翻译：在没有模板的情况下通过从两种或更多种半导体材料的层状结构中去除材料来制造分段半导体纳米线。去除在层状结构的表面上的某些位置处发生，并且优选地沿着结晶轴的方向延伸，使得具有分段结构的纳米线保持在很少或不发生去除的位置。不同片段之间的界面可以垂直于纳米线的纵向方向或与之相垂直。

43. 发明授权

US08641879B2 Charged entities as locomotive to control motion of polymers through a nanochannel 有权
公开(公告)号：US08641879B2
公开(公告)日：2014-02-04
申请号：US13611662
申请日：2012-09-12
申请人： Stefan Harrer , Binquan Luan , Glenn J. Martyna , Hongbo Peng , Stanislav Polonsky , Stephen M. Rossnagel , Ajay K. Royyuru , Gustavo A. Stolovitzky , George F. Walker
发明人： Stefan Harrer , Binquan Luan , Glenn J. Martyna , Hongbo Peng , Stanislav Polonsky , Stephen M. Rossnagel , Ajay K. Royyuru , Gustavo A. Stolovitzky , George F. Walker
IPC分类号： G01N27/26
CPC分类号： B82Y15/00 , C12Q1/6869 , C12Q2565/631
摘要： A technique for controlling the motion of one or more charged entities linked to a polymer through a nanochannel is provided. A first reservoir and a second reservoir are connected by the nanochannel. An array of electrodes is positioned along the nanochannel, where fluid fills the first reservoir, the second reservoir, and the nanochannel. A first electrode is in the first reservoir and a second electrode is in the second reservoir. The first and second electrodes are configured to direct the one or more charged entities linked to the polymer into the nanochannel. An array of electrodes is configured to trap the one or more charged entities in the nanochannel responsive to being controlled for trapping. The array of electrodes is configured to move the one or more charged entities along the nanochannel responsive to being controlled for moving.

44. 发明授权

US07355271B2 Flexible assembly of stacked chips 有权
标题翻译：堆叠芯片的灵活组装
公开(公告)号：US07355271B2
公开(公告)日：2008-04-08
申请号：US10573561
申请日：2003-09-30
申请人： Richard P. Volant , Kevin S. Petrarca , George F. Walker
发明人： Richard P. Volant , Kevin S. Petrarca , George F. Walker
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L21/568 , H01L21/6835 , H01L23/5387 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L25/50 , H01L2221/68359 , H01L2221/68372 , H01L2224/04042 , H01L2224/04105 , H01L2224/05554 , H01L2224/18 , H01L2224/24137 , H01L2224/48091 , H01L2224/48227 , H01L2224/49431 , H01L2224/49433 , H01L2224/73209 , H01L2224/73259 , H01L2224/73267 , H01L2224/82005 , H01L2224/9222 , H01L2225/06524 , H01L2225/06527 , H01L2225/06579 , H01L2225/06589 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/19041 , H01L2924/19042 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要： A three-dimensional package consisting of a plurality of folded integrated circuit chips (100, 110, 120) is described wherein at least one chip provides interconnect pathways for electrical connection to additional chips of the stack, and at least one chip (130) is provided with additional interconnect wiring to a substrate (500), package or printed circuit board. Further described, is a method of providing a flexible arrangement of interconnected chips that are folded over into a three-dimensional arrangements to consume less aerial space when mounted on a substrate, second-level package or printed circuit board.
摘要翻译：描述了由多个折叠集成电路芯片（100,110,120）组成的三维封装，其中至少一个芯片提供用于与堆叠的附加芯片的电连接的互连路径，并且至少一个芯片（130）是提供与衬底（500），封装或印刷电路板的附加互连布线。进一步描述的是提供互连芯片的柔性布置的方法，其被折叠成三维布置以在安装在基板，二级封装或印刷电路板上时消耗较少的空中空间。

45. 发明授权

US07115996B2 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped 有权
公开(公告)号：US07115996B2
公开(公告)日：2006-10-03
申请号：US10852142
申请日：2004-05-25
申请人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
发明人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/76849 , H01L21/2885 , H01L21/76856 , H01L21/76858 , H01L21/76862 , H01L23/53238 , H01L24/11 , H01L2224/0401 , H01L2224/04042 , H01L2224/05546 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/15747 , H05K3/244 , H01L2924/00
摘要： A method to selectively cap interconnects with indium or tin bronzes and copper oxides thereof is provided. The invention also provides the interconnect and copper surfaces so formed.

46. 发明授权

US06924185B2 Fuse structure and method to form the same 失效
标题翻译：保险丝结构和方法形成相同
公开(公告)号：US06924185B2
公开(公告)日：2005-08-02
申请号：US10680618
申请日：2003-10-07
申请人： David K. Anderson , Tien-Jen Cheng , Timothy J. Dalton , Christopher V. Jahnes , Andrew Lu , Chandrasekhar Narayan , Kevin S. Petrarca , Richard P. Volant , George F. Walker
发明人： David K. Anderson , Tien-Jen Cheng , Timothy J. Dalton , Christopher V. Jahnes , Andrew Lu , Chandrasekhar Narayan , Kevin S. Petrarca , Richard P. Volant , George F. Walker
IPC分类号： H01L23/525 , H01L21/336
CPC分类号： H01L23/5256 , H01L2924/0002 , H01L2924/00
摘要： A method and structure for a fuse structure comprises an insulator layer, a plurality of fuse electrodes extending through the insulator layer to an underlying wiring layer, an electroplated fuse element connected to the electrodes, and an interface wall. The fuse element is positioned external to the insulator, with a gap juxtaposed between the insulator and the fuse element. The interface wall further comprises a first side wall, a second side wall, and an inner wall, wherein the inner wall is disposed within the gap. The fuse electrodes are diametrically opposed to one another, and the fuse element is perpendicularly disposed above the fuse electrodes. The fuse element is either electroplatted, electroless plated, or is an ultra thin fuse.
摘要翻译：用于熔丝结构的方法和结构包括绝缘体层，穿过绝缘体层延伸到下面的布线层的多个熔丝电极，连接到电极的电镀熔丝元件和界面壁。保险丝元件位于绝缘体的外部，并且在绝缘体和保险丝元件之间并置有间隙。界面壁还包括第一侧壁，第二侧壁和内壁，其中内壁设置在间隙内。熔丝电极彼此直径相对，并且熔丝元件垂直地设置在熔丝电极的上方。保险丝元件是电镀，无电镀，或是超薄保险丝。

47. 发明授权

US06784088B2 Method to selectively cap interconnects with indium or tin bronzes and/or oxides thereof and the interconnect so capped 有权
标题翻译：选择性地与铟或锡青铜和/或其氧化物覆盖互连的方法以及如此封闭的互连
公开(公告)号：US06784088B2
公开(公告)日：2004-08-31
申请号：US10345288
申请日：2003-01-16
申请人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
发明人： Daniel C. Edelstein , Sung Kwon Kang , Maurice McGlashan-Powell , Eugene J. O'Sullivan , George F. Walker
IPC分类号： H01L2144
CPC分类号： H01L21/76849 , H01L21/2885 , H01L21/76856 , H01L21/76858 , H01L21/76862 , H01L23/53238 , H01L24/11 , H01L2224/0401 , H01L2224/04042 , H01L2224/05546 , H01L2224/13099 , H01L2224/45144 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/15747 , H05K3/244 , H01L2924/00
摘要： A method to selectively cap a cooper BEOL terminal pad with a Cu/Sn/Au alloy. The method includes providing one or more Cu BEOL terminal pads and coating the pads with a Sn coating followed by coating the Sn with a Au coating. The coated pads are then annealed to form the Cu/Sn/Au capping alloy.
摘要翻译：一种用Cu / Sn / Au合金选择性地覆盖铜合金BEOL端子焊盘的方法。该方法包括提供一个或多个Cu BEOL端子焊盘并且用焊锡涂覆Sn涂层，然后用Au涂层涂覆Sn。然后将涂覆的焊盘退火以形成Cu / Sn / Au封盖合金。

48. 发明授权

US06362557B1 Ultrasonic method and actuator for inducing motion of an object 有权
标题翻译：用于诱导物体运动的超声波方法和致动器
公开(公告)号：US06362557B1
公开(公告)日：2002-03-26
申请号：US09649486
申请日：2000-08-28
申请人： Peter A. Gruber , Frederic Maurer , George F. Walker
发明人： Peter A. Gruber , Frederic Maurer , George F. Walker
IPC分类号： H01L4108
CPC分类号： H01L41/0906
摘要： An actuator scaled to macroscopic or microscopic sizes, uses ultrasonic energy to induce motion of an object in a desired direction. The actuator includes one or more pair of piezoelectric transducers connected with a transducer tip. Supplying the piezoelectric transducers with alternating current electrical power causes the tip to vibrate at ultrasonic frequencies. Urging the vibrating tip into contact with a surface on the object at a selected angle of inclination induces the object to move in the desired direction at a rate determined by the inclination angle. Multiple actuators can be used to induce a fall range of movements of variously shaped objects. In microscopic form, the actuator can be used to create a MEMS device. The optional application of a compliant material either on the transducer tip or on the object's surface enhances the movement induced by the actuator.
摘要翻译：按照宏观或微观尺寸的致动器，使用超声波能量来诱导物体沿所需方向的运动。致动器包括与换能器尖端连接的一对或多对压电换能器。为具有交流电功率的压电换能器提供使尖端以超声频率振动。将振动尖端以选定的倾斜角度与物体上的表面接触，使得物体以由倾斜角确定的速率在所需方向上移动。可以使用多个致动器来引起各种形状物体的运动的下降范围。在微观形式中，致动器可用于创建MEMS装置。在换能器尖端或物体表面上可选地应用柔性材料增强了由致动器引起的运动。

49. 发明授权

US5569739A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5569739A
公开(公告)日：1996-10-29
申请号：US197941
申请日：1994-02-17
申请人： Eleftherios Adamopoulos , Kang-Wook Lee , Terrence R. O'Toole , Sampath Purushothaman , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Kang-Wook Lee , Terrence R. O'Toole , Sampath Purushothaman , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , C08F8/34
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。接合操作。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物铜界面的铜扩散阻挡层。

50. 发明授权

US5519193A Method and apparatus for stressing, burning in and reducing leakage current of electronic devices using microwave radiation 失效
标题翻译：使用微波辐射强化，燃烧和减少电子设备泄漏电流的方法和装置
公开(公告)号：US5519193A
公开(公告)日：1996-05-21
申请号：US966960
申请日：1992-10-27
申请人： Peter E. Freiermuth , Kathleen S. Ginn , Jeffrey A. Haley , Susan J. Lamaire , David A. Lewis , Gavin T. Mills , Timothy A. Redmond , Yuk L. Tsang , Joseph J. Van Horn , Alfred Viehbeck , George F. Walker , Jer-Ming Yang , Clarence S. Long
发明人： Peter E. Freiermuth , Kathleen S. Ginn , Jeffrey A. Haley , Susan J. Lamaire , David A. Lewis , Gavin T. Mills , Timothy A. Redmond , Yuk L. Tsang , Joseph J. Van Horn , Alfred Viehbeck , George F. Walker , Jer-Ming Yang , Clarence S. Long
IPC分类号： G01R31/26 , G01R31/28 , G01R31/311 , H01L21/265 , H01L21/268 , H01L21/326 , H01L21/329 , H05B6/80
CPC分类号： G01R31/2881 , G01R31/311 , Y10S148/071
摘要： The described invention is directed to microwave methods for burning-in, electrical stressing, thermal stressing and reducing rectifying junction leakage current in fully processed semiconductor chips individually and at wafer level, as well as burning in and stressing semiconductor chip packaging substrates and the combination of a semiconductor chip mounted onto a semiconductor chip packaging substrate. Microwaves burn-in devices in a substantially shorter period of time than conventional burn-in techniques and avoid the need for special workpiece holders which are required by conventional stress and burn-in techniques. Additionally, microwave methods are described for reducing the leakage current of recitfying junctions, such as PN junctions and Schottky barrier diode junctions of semiconductor devices on fully processed semiconductor chips and wafers.
摘要翻译：所描述的发明涉及在半导体芯片单独和晶圆级别的烧结，电应力，热应力和减少整流结漏电流的微波方法，以及对半导体芯片封装衬底的燃烧和应力的组合安装在半导体芯片封装基板上的半导体芯片。微波老化装置在比传统的老化技术更短的时间内，并且避免了对于常规应力和老化技术所要求的特殊工件支架的需要。此外，描述了微波方法，用于减少重新连接的漏电流，例如半导体器件在完全处理的半导体芯片和晶片上的PN结和肖特基势垒二极管接头。

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