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    • 3. 发明授权
    • Adhesive layer in multi-level packaging and organic material as a metal
diffusion barrier
    • 多层包装中的粘合层和有机材料作为金属扩散屏障
    • US5326643A
    • 1994-07-05
    • US771929
    • 1991-10-07
    • Eleftherios AdamopoulosJungihl KimKang-Wook LeeTae S. OhTerrence R. O'TooleSampath PurushothamanJohn J. RitskoJane M. ShawAlfred ViehbeckGeorge F. Walker
    • Eleftherios AdamopoulosJungihl KimKang-Wook LeeTae S. OhTerrence R. O'TooleSampath PurushothamanJohn J. RitskoJane M. ShawAlfred ViehbeckGeorge F. Walker
    • B32B7/10B32B15/08B32B15/088B32B27/00C08G73/00C08G73/10H01B3/30H01L21/52H05K1/03H05K3/46B32B9/00
    • C08G73/1089C08G73/1003C08G73/1007C08G73/101H01B3/306Y10S428/901Y10T428/24917Y10T428/31721
    • The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
    • 本公开描述了一种多层制品,其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底,其中与基底相对的粘合剂的表面粘附到聚酰亚胺上,该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中,制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层,或用于在电路中形成电连接的装置,例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 在制造该制品时,可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底,粘合聚酰亚胺膜或聚酰亚胺膜上。 还描述了一种新型粘合聚酰亚胺,其是粘合聚酰亚胺,例如用不饱和杂环单胺如氮杂腺嘌呤,氨基苯并三唑,氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐,氨基乙炔,乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团,作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材(铜,聚合物,玻璃陶瓷)界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。
    • 6. 发明授权
    • Adhesive layer in multi-level packaging and organic material as a metal
diffusion barrier
    • 多层包装中的粘合层和有机材料作为金属扩散屏障
    • US5582858A
    • 1996-12-10
    • US474985
    • 1995-06-07
    • Eleftherios AdamopoulosJungihl KimKang-Wook LeeTae S. OhTerrence R. O'TooleSampath PurushothamanJohn J. RitskoJane M. ShawAlfred ViehbeckGeorge F. Walker
    • Eleftherios AdamopoulosJungihl KimKang-Wook LeeTae S. OhTerrence R. O'TooleSampath PurushothamanJohn J. RitskoJane M. ShawAlfred ViehbeckGeorge F. Walker
    • B32B7/10B32B15/08B32B15/088B32B27/00C08G73/00C08G73/10H01B3/30H01L21/52H05K1/03H05K3/46B05D5/10
    • C08G73/1089C08G73/1003C08G73/1007C08G73/101H01B3/306Y10S428/901Y10T428/24917Y10T428/31721
    • The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
    • 本公开描述了一种多层制品,其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底,其中与基底相对的粘合剂的表面粘附到聚酰亚胺上,该制品进一步的特征在于具有一组或多个交替层 的末端不饱和粘合聚酰亚胺和聚酰亚胺。 在另一个实施方案中,制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层,或用于在电路中形成电连接的装置,例如电路上的金属管道或布线网络 嵌入在陶瓷和/或聚合物基材内。 在制造该制品时,可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底,粘合聚酰亚胺膜或聚酰亚胺膜上。 还描述了一种新型粘合聚酰亚胺,其是粘合聚酰亚胺,例如用不饱和杂环单胺如氮杂腺嘌呤,氨基苯并三唑,氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐,氨基乙炔,乙烯胺或氨基膦封端的ODPA-APB。 新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团,作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。 本发明中的这种新型粘合聚酰亚胺作为聚合物基材(铜,聚合物,玻璃陶瓷)界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。