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    • 42. 发明授权
    • Semiconductor memory device equipped with dummy cells
    • 装有虚拟电池的半导体存储器件
    • US06683813B2
    • 2004-01-27
    • US10315938
    • 2002-12-11
    • Satoru HanzawaTakeshi Sakata
    • Satoru HanzawaTakeshi Sakata
    • G11C702
    • G11C11/4099G11C7/14
    • There are provided a reference voltage generating method used for reading out operation of a memory cell having amplification ability, and a dummy cell. The memory cell is comprised of a read NMOS transistor, a write transistor, and a coupled-capacitance. The dummy cell is made such that two memory cells are connected in series. The dummy cell is arranged at the most far end of each of the data lines against the sense amplifier. A reference voltage is generated by making a difference in an amount of current flowing in each of the read NMOS transistors of the memory cell and the dummy cell. As a result, DRAM showing a higher speed, a higher integration and a lower electrical power as compared with those of the prior art device can be realized.
    • 提供了用于读出具有放大能力的存储单元的操作的参考电压产生方法和虚拟单元。 存储单元包括读取NMOS晶体管,写入晶体管和耦合电容。 虚拟单元被制成使得两个存储单元串联连接。 每个数据线的最远端布置在相对于读出放大器的虚拟单元。 通过使存储单元的读取NMOS晶体管和虚设单元中的每一个中流动的电流量的差异来产生参考电压。 结果,可以实现与现有技术的装置相比显示更高速度,更高集成度和更低电力的DRAM。
    • 44. 发明授权
    • Phase control circuit, semiconductor device and semiconductor memory
    • 相位控制电路,半导体器件和半导体存储器
    • US06205086B1
    • 2001-03-20
    • US09560724
    • 2000-04-28
    • Satoru HanzawaTakeshi SakataOsamu Nagashima
    • Satoru HanzawaTakeshi SakataOsamu Nagashima
    • G11C800
    • G11C7/1057G11C7/1051G11C7/22G11C7/222
    • A phase control circuit comprises a plurality of fixed delay circuits (200-0 through 200-5) which assign different predetermined delay times to a first clock signal (BDA1) respectively, a detection circuit (201) which receives clock signals outputted from the plurality of fixed delay circuits and a second clock signal (PCLK) different in phase from the first clock signal therein and generates detected signals (202) represented in a plurality of bits each corresponding to the difference in phase between the first clock signal and the second clock signal, and a variable delay circuit (200-6) which gives a delay in the phase difference corresponding to each of the detected signals to a third clock signal (BDA2).
    • 相位控制电路包括分别向第一时钟信号(BDA1)分配不同的预定延迟时间的多个固定延迟电路(200-0至200-5);接收从多个时钟信号输出的时钟信号的检测电路(201) 的固定延迟电路和与其中的第一时钟信号不同的第二时钟信号(PCLK),并产生以多个位表示的检测信号(202),每个位对应于第一时钟信号和第二时钟之间的相位差 信号和可变延迟电路(200-6),其将与每个检测到的信号相对应的相位差延迟到第三时钟信号(BDA2)。
    • 46. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08289764B2
    • 2012-10-16
    • US13139297
    • 2009-12-07
    • Satoru Hanzawa
    • Satoru Hanzawa
    • G11C11/00
    • G11C13/0069G11C7/18G11C8/08G11C13/0004G11C13/0028G11C2013/009G11C2213/71G11C2213/72
    • A highly-reliable, highly-integrated large-capacity phase-change memory is achieved. For this purpose, for example, memory tiles MT0, MT1 are provided respectively at points of intersection of global bit line GBL0 and global word lines GWL00B, GWL01B. Word lines WL000 of MT0, MT1 are commonly connected to an output from a word-line driving circuit WD0 which is controlled by GWL00B, and word lines WL001 of MT0, MT1 are commonly connected to an output from a word-line driving circuit WD1 controlled by GWL01B. For example, when WD0 is activated in accordance with a rewrite operation, an output from WD0 is connected to GBL0 via any one of four memory cells MC00, MC01 connected to WL000 of MT0, MT1.
    • 实现了高度可靠,高度集成的大容量相变存储器。 为此,例如,分别在全局位线GBL0和全局字线GWL00B,GWL01B的交点处提供存储器片MT0,MT1。 MT0,MT1的字线WL000通常连接到由GWL00B控制的字线驱动电路WD0的输出,MT0,MT1的字线WL001共同连接到控制了字线驱动电路WD1的输出 由GWL01B。 例如,当根据重写操作激活WD0时,WD0的输出通过连​​接到MT0,MT1的WL000的四个存储单元MC00,MC01中的任一个连接到GBL0。
    • 47. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20120137058A1
    • 2012-05-31
    • US13389260
    • 2010-06-18
    • Satoru Hanzawa
    • Satoru Hanzawa
    • G06F12/00
    • G11C13/0004G11C13/004G11C13/0061G11C13/0069G11C13/0097
    • A high-speed large-capacity phase-change memory is achieved. A semiconductor device according to the present invention includes: a plurality of memory planes MP; a plurality of storage information register groups SDRBK paired with the plurality of memory planes; and a chip control circuit CPCTL. The plurality of memory planes include a plurality of memory cells. Also, the plurality of storage information register groups temporarily retain information to be stored in the plurality of memory planes. Further, the chip control circuit includes a register which temporarily stores a value indicating volume of the storage information, and a first storage information volume is smaller than a second storage information volume. When the first storage information volume is written, the plurality of memory planes and the plurality of storage information register groups are activated during a first period. When the second storage information volume is written, the plurality of memory planes and the plurality of storage information register groups are activated during a second period. By such a structure, the first period is shorter than the second period.
    • 实现了高速大容量相变存储器。 根据本发明的半导体器件包括:多个存储器平面MP; 与多个存储器平面配对的多个存储信息寄存器组SDRBK; 和芯片控制电路CPCTL。 多个存储器平面包括多个存储单元。 此外,多个存储信息寄存器组临时保留要存储在多个存储器平面中的信息。 此外,芯片控制电路包括临时存储指示存储信息的卷的值的寄存器,并且第一存储信息量小于第二存储信息量。 当第一存储信息量被写入时,多个存储器平面和多个存储信息寄存器组在第一时段期间被激活。 当第二存储信息量被写入时,多个存储器平面和多个存储信息寄存器组在第二时段期间被激活。 通过这种结构,第一周期比第二周期短。
    • 49. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20110273927A1
    • 2011-11-10
    • US13104005
    • 2011-05-09
    • Satoru HanzawaYoshitska Sasago
    • Satoru HanzawaYoshitska Sasago
    • G11C11/00
    • G11C13/003G11C13/0004G11C13/0026G11C13/0028G11C2213/71G11C2213/72G11C2213/75G11C2213/78H01L27/2454H01L27/2472H01L27/2481H01L45/06H01L45/124H01L45/144
    • A semiconductor device has multiple memory cell groups arranged at intersections between multiple word lines and multiple bit lines intersecting the word lines. The memory cell groups each have first and second memory cells connected in series. Each of the first and the second memory cells has a select transistor and a resistive storage device connected in parallel. The gate electrode of the select transistor in the first memory cell is connected with a first gate line, and the gate electrode of the select transistor in the second memory cell is connected to a second gate line. A first circuit block for driving the word lines (word driver group WDBK) is arranged between a second circuit block for driving the first and second gate lines (phase-change-type chain cell control circuit PCCCTL) and multiple memory cell groups (memory cell array MA).
    • 半导体器件具有布置在多个字线和与字线相交的多个位线之间的交叉处的多个存储单元组。 存储单元组各自具有串联连接的第一和第二存储器单元。 第一和第二存储单元中的每一个具有并联连接的选择晶体管和电阻存储装置。 第一存储单元中的选择晶体管的栅电极与第一栅极线连接,第二存储单元中的选择晶体管的栅电极连接到第二栅极线。 用于驱动字线的第一电路块(字驱动器组WDBK)被布置在用于驱动第一和第二栅极线(相变型链单元控制电路PCCCTL)的第二电路块和多个存储单元组 阵列MA)。