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    • 4. 发明授权
    • Semiconductor device
    • 半导体器件
    • US06680869B2
    • 2004-01-20
    • US10120447
    • 2002-04-12
    • Takahiro SonodaTakeshi SakataSadayuki MoritaYoshinobu NakagomeHaruko TadokoroOsamu Nagashima
    • Takahiro SonodaTakeshi SakataSadayuki MoritaYoshinobu NakagomeHaruko TadokoroOsamu Nagashima
    • G11C700
    • G11C7/1087G11C7/1066G11C7/1078G11C7/1084G11C8/12
    • A semiconductor memory device of a DDR configuration improved in glitch immunity and the convenience of use is to be provided. It is a dynamic type RAM the operation of whose internal circuit is controlled in synchronism with a clock signal; an input circuit is provided in which a second clock signal inputted when in write operation is used to take in a plurality of write data serially inputted in response to that signal into a plurality of first latch circuits, and said first clock signal is used to take the write data taken into the first latch circuits into the second latch circuit to convey them to an input/output data bus; a logic circuit is provided to mask, in accordance with the logic of the first clock signal and the second clock signal, any noise arising at the end of the second clock signal, and a third clock signal is generated and supplied to the first latch circuits which output the write data to at least the input of the second latch circuits.
    • DDR配置的半导体存储器件提高了毛刺抗扰性,并且提供了使用的便利。 它是一种动态类型的RAM,其内部电路与时钟信号同步地被控制; 提供了一种输入电路,其中在写入操作时输入的第二时钟信号用于将响应于该信号串行输入的多个写数据写入多个第一锁存电路,并且所述第一时钟信号用于采取 写入第一锁存电路的数据进入第二锁存电路,以将它们传送到输入/输出数据总线; 提供逻辑电路,以根据第一时钟信号和第二时钟信号的逻辑屏蔽在第二时钟信号结束时产生的任何噪声,并产生第三时钟信号并将其提供给第一锁存电路 其将写数据输出到至少第二锁存电路的输入。
    • 7. 发明授权
    • Semiconductor wafer, semiconductor chip, and manufacturing method of semiconductor device
    • 半导体晶片,半导体芯片和半导体器件的制造方法
    • US06885599B2
    • 2005-04-26
    • US10764539
    • 2004-01-27
    • Yoshikazu SaitohSadayuki MoritaTakahiro Sonoda
    • Yoshikazu SaitohSadayuki MoritaTakahiro Sonoda
    • G01R31/30G01R31/28G11C29/00G11C29/48H01L21/66G11C7/00
    • G11C29/48
    • By using a small number of needles and contact terminals at burn-in, electric contact check is performed between each needle and each terminal provided in each semiconductor chip, and thereby the yield of assembled products can be improved. A packaging structure in which, for example, a volatile memory chip and a nonvolatile memory chip are formed is assembled in accordance with a production scheme in which burn-in of each memory chip is performed while still under the state of a semiconductor wafer, and by forming the packaged structure using the good volatile memory chip subjected to burn-in and likewise, also, the nonvolatile memory chip. At this burn-in, contact check is performed by bringing a needle, provided in a burn-in board, into contact with, for example, six test-only signal terminals of a test circuit formed on each semiconductor chip.
    • 通过在老化期间使用少量的针和接触端子,在每个针与每个半导体芯片中提供的每个端子之间进行电接触检查,从而可以提高组装产品的产量。 根据其中形成有易失性存储器芯片和非易失性存储器芯片的封装结构,根据在半导体晶片的状态下执行每个存储芯片的老化的生产方案,并且 通过使用经过老化的良好易失性存储器芯片以及类似地,非易失性存储器芯片形成封装结构。 在该老化期间,通过将设置在老化板中的针与例如在每个半导体芯片上形成的测试电路的六个测试信号端子接触来进行接触检查。
    • 10. 发明授权
    • Semiconductor wafer, semiconductor chip, and manufacturing method of semiconductor device
    • 半导体晶片,半导体芯片和半导体器件的制造方法
    • US06711075B2
    • 2004-03-23
    • US09906060
    • 2001-07-17
    • Yoshikazu SaitohSadayuki MoritaTakahiro Sonoda
    • Yoshikazu SaitohSadayuki MoritaTakahiro Sonoda
    • G11C700
    • G11C29/48
    • By using a small number of needles and contact terminals at burn-in, electric contact check is performed between each needle and each terminal provided in each semiconductor chip, and thereby the yield of assembled products can be improved. A packaging structure in which, for example, a volatile memory chip and a nonvolatile memory chip are formed is assembled in accordance with a production scheme in which burn-in of each memory chip is performed while still under the state of a semiconductor wafer, and by forming the packaged structure using the good volatile memory chip subjected to burn-in and likewise, also, the nonvolatile memory chip. At this burn-in, contact check is performed by bringing a needle, provided in a burn-in board, into contact with, for example, six test-only signal terminals of a test circuit formed on each semiconductor chip.
    • 通过在老化期间使用少量的针和接触端子,在每个针与每个半导体芯片中提供的每个端子之间进行电接触检查,从而可以提高组装产品的产量。 根据其中形成有易失性存储器芯片和非易失性存储器芯片的封装结构,根据在半导体晶片的状态下执行每个存储芯片的老化的生产方案,并且 通过使用经过老化的良好易失性存储器芯片以及类似地,非易失性存储器芯片形成封装结构。 在该老化期间,通过将设置在老化板中的针与例如在每个半导体芯片上形成的测试电路的六个测试信号端子接触来进行接触检查。