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    • 41. 发明授权
    • ESD protection during GMR head fabrication
    • GMR头制造期间的ESD保护
    • US06470566B2
    • 2002-10-29
    • US09754139
    • 2001-01-03
    • Richard HsiaoEdward Hin Pong LeeTimothy J. MoranJoseph Francis SmythHoward Gordon Zolla
    • Richard HsiaoEdward Hin Pong LeeTimothy J. MoranJoseph Francis SmythHoward Gordon Zolla
    • G11B5127
    • G11B5/3903G11B5/3163G11B5/3173G11B5/40Y10T29/49032Y10T29/49043
    • To protect the MR read head element from ESD damage during wafer level manufacturing, a lead from the MR element is electrically connected to one or both of the read head element shields during manufacturing. In a preferred embodiment of the present invention, the electrical connection is fabricated in the kerf area between adjacent magnetic heads as they are fabricated upon a wafer substrate. Thereafter, when the magnetic heads are separated by saw cutting through the kerf areas, the electrical connections are thereby removed, such that the MR element electrical leads and the shields are electrically isolated. In an alternative embodiment, one or more of the shields, as well as the MR element leads can also be electrically connected to the substrate upon which the magnetic head is fabricated. In further alternative embodiments, the electrical connection between one or more of the shields and the MR element electrical lead can be fabricated within the magnetic head area, rather than in the kerf area, and a suitable resistance is fabricated into the interconnecting circuit. In this embodiment, the electrical interconnection between the MR element electrical lead and one or more of the shields has a pre-designed electrical resistance and it remains in the magnetic head following fabrication.
    • 为了在晶片级制造期间保护MR读取头元件免受ESD损坏,来自MR元件的引线在制造期间电连接到读头元件屏蔽中的一个或两个。 在本发明的优选实施例中,当在晶片衬底上制造时,在相邻磁头之间的切口区域中制造电连接。 此后,当通过锯切通过切口区域分离磁头时,由此去除电连接,使得MR元件电引线和屏蔽件电隔离。 在替代实施例中,一个或多个屏蔽件以及MR元件引线也可以电连接到其上制造磁头的基板。 在另外的替代实施例中,一个或多个屏蔽件和MR元件电引线之间的电连接可以制造在磁头区域内,而不是在切口区域中,并且在互连电路中制造合适的电阻。 在该实施例中,MR元件电引线与一个或多个屏蔽之间的电互连具有预先设计的电阻,并且在制造之后它保持在磁头中。
    • 47. 发明授权
    • Methods and systems for using resistivity of sensor film in an element shunt
    • 在元件分流中使用传感器膜电阻率的方法和系统
    • US08274762B2
    • 2012-09-25
    • US12130389
    • 2008-05-30
    • Satoru ArakiYing HongEdward Hin Pong LeeTsann LinDavid John Seagle
    • Satoru ArakiYing HongEdward Hin Pong LeeTsann LinDavid John Seagle
    • G11B5/33
    • G01R33/18G01R33/0023G11B5/3929
    • A system in one approach includes a sensor stack formed of a plurality of thin film layers; a shunt formed of at least some of the same layers as the sensor stack, the shunt being spaced from the sensor stack; a first lead coupled to the sensor stack and the shunt; and a second lead coupled to the sensor stack and the shunt. A method in one embodiment includes forming a plurality of thin film layers; removing a portion of the thin film layers for defining at least a portion of a sensor stack and at least a portion of a shunt spaced front the sensor stack; forming a first lead coupled to the at least a portion of the sensor stack and the at least a portion of the shunt and a second lead coupled to the at least a portion of the sensor stack and the at least a portion of the shunt. Additional systems and methods are also presented.
    • 一种方法的系统包括由多个薄膜层形成的传感器堆叠; 由与所述传感器堆叠的至少一些相同层形成的分流器,所述分流器与所述传感器堆叠间隔开; 耦合到传感器堆叠和分流器的第一引线; 以及耦合到传感器堆叠和分流器的第二引线。 一个实施例中的方法包括形成多个薄膜层; 去除用于限定传感器堆叠的至少一部分的薄膜层的一部分和与传感器堆叠间隔开的分流器的至少一部分; 形成耦合到传感器堆叠的至少一部分和分流器的至少一部分的第一引线和耦合到传感器堆叠的至少一部分和分流器的至少一部分的第二引线。 还介绍了其他系统和方法。
    • 49. 发明授权
    • Magnetic head with delayed connection heater shunting
    • 磁头与延时连接加热器分流
    • US07969687B2
    • 2011-06-28
    • US12124997
    • 2008-05-21
    • Edward Hin Pong LeeDavid John Seagle
    • Edward Hin Pong LeeDavid John Seagle
    • G11B15/10
    • G11B5/314G11B5/102G11B5/6005G11B5/6064
    • A slider structure that allows a grounded heater element to be employed, while also allowing a decision of whether the slider is to be an “up” slider or a “down” slider to be made in a late stage in the formation of the slider. The slider includes electrical contact pads for making electrical connection with the heater element. The slider also includes a dedicated ground path formed on the slider body at a location that is removed from either of the first and second contact pads, ground path providing electrical connectivity to the slider body. At a late stage in the manufacture of the read and write head, a determination can be made as to which contact pad is to be a ground pad, and that pad can be electrically connected with the ground path.
    • 允许使用接地加热器元件的滑块结构,同时还允许决定滑块是否是在滑块的形成的后期制造的“向上”滑块或“向下”滑块。 滑块包括用于与加热器元件电连接的电接触垫。 滑块还包括在从第一和第二接触焊盘之一移除的位置处形成在滑块主体上的专用接地路径,提供与滑块主体的电连接的接地路径。 在制造读写头的后期阶段,可以确定哪个接触焊盘是接地焊盘,并且该焊盘可以与接地路径电连接。