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    • 4. 发明授权
    • Fabrication of magnetoresistive sensors and electronic lapping guides
    • 磁阻传感器和电子研磨导轨的制造
    • US08361541B2
    • 2013-01-29
    • US12462104
    • 2009-07-28
    • Edward Hin Pong LeeDavid John Seagle
    • Edward Hin Pong LeeDavid John Seagle
    • G11B5/33G11B5/127
    • G11B5/3909B82Y10/00B82Y25/00G11B5/3906G11B2005/3996Y10T428/1107Y10T428/1121
    • The subject matter disclosed herein provides methods for manufacturing an electronic lapping guide and a magnetic read head assembly. The magnetoresistive head assembly includes a sensing element that has a front edge and a front flux guide that has a back edge, such that the sensing element front edge and the front flux guide back edge share a common interface that defines an interface plane normal to the surface of a wafer substrate. The electronic lapping guide comprises a conductive material adapted to attach to two electrical leads for measuring a resistance through the conductive material. The conductive material may include a conductive material back edge aligned with the interface plane. The resistance of the conductive material may be inversely proportional to a conductive material length normal to the interface plane.
    • 本文公开的主题提供了用于制造电子研磨导向器和磁读头组件的方法。 磁阻头组件包括具有前边缘的感测元件和具有后边缘的前通量引导件,使得感测元件前边缘和前导流引导后边缘共享公共接口,该公共接口限定与 晶片基板的表面。 电子研磨引导件包括适于附接到两个电引线的导电材料,用于测量通过导电材料的电阻。 导电材料可以包括与界面平面对准的导电材料后边缘。 导电材料的电阻可能与与界面平面垂直的导电材料长度成反比。
    • 10. 发明授权
    • Methods and systems for using resistivity of sensor film in an element shunt
    • 在元件分流中使用传感器膜电阻率的方法和系统
    • US08274762B2
    • 2012-09-25
    • US12130389
    • 2008-05-30
    • Satoru ArakiYing HongEdward Hin Pong LeeTsann LinDavid John Seagle
    • Satoru ArakiYing HongEdward Hin Pong LeeTsann LinDavid John Seagle
    • G11B5/33
    • G01R33/18G01R33/0023G11B5/3929
    • A system in one approach includes a sensor stack formed of a plurality of thin film layers; a shunt formed of at least some of the same layers as the sensor stack, the shunt being spaced from the sensor stack; a first lead coupled to the sensor stack and the shunt; and a second lead coupled to the sensor stack and the shunt. A method in one embodiment includes forming a plurality of thin film layers; removing a portion of the thin film layers for defining at least a portion of a sensor stack and at least a portion of a shunt spaced front the sensor stack; forming a first lead coupled to the at least a portion of the sensor stack and the at least a portion of the shunt and a second lead coupled to the at least a portion of the sensor stack and the at least a portion of the shunt. Additional systems and methods are also presented.
    • 一种方法的系统包括由多个薄膜层形成的传感器堆叠; 由与所述传感器堆叠的至少一些相同层形成的分流器,所述分流器与所述传感器堆叠间隔开; 耦合到传感器堆叠和分流器的第一引线; 以及耦合到传感器堆叠和分流器的第二引线。 一个实施例中的方法包括形成多个薄膜层; 去除用于限定传感器堆叠的至少一部分的薄膜层的一部分和与传感器堆叠间隔开的分流器的至少一部分; 形成耦合到传感器堆叠的至少一部分和分流器的至少一部分的第一引线和耦合到传感器堆叠的至少一部分和分流器的至少一部分的第二引线。 还介绍了其他系统和方法。