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    • 4. 发明申请
    • PMR with improved writability and process controllability by double layer patterning
    • PMR具有改进的可编写性和工艺可控性,通过双层图案化
    • US20120008236A1
    • 2012-01-12
    • US13200012
    • 2011-09-15
    • Jiun-Ting LeeShiwen HuangMoris Dovek
    • Jiun-Ting LeeShiwen HuangMoris Dovek
    • G11B5/127
    • G11B5/3116G11B5/1278G11B5/3163Y10T29/49052
    • Improved writability and a sharper neck transition are achieved in a PMR writer with a yoke that has essentially vertical sidewalls and a write pole that has sidewalls with a beveled angle. An alumina mold is made with a negative differential bevel angle by employing a two mask process. A first photoresist layer is patterned and etched to form a rectangular trench in an alumina layer. The trench extends beyond the intended ABS plane and in the opposite direction into the intended yoke area. A second photoresist layer is patterned into a yoke shape that is partially superimposed over the rectangular trench. After a second RIE process, the yoke opening adjoins the trench at a neck transition point along each long trench side. The volume of magnetic material in the yoke adjacent to the neck is thereby maximized. Dimension control of the main pole becomes independent of ABS positioning errors.
    • 在具有基本垂直侧壁的磁轭和具有倾斜角度的侧壁的写入极的PMR写入器中实现了改进的可写入性和更尖锐的颈部转变。 通过采用两个掩模工艺制造具有负微分斜角的氧化铝模具。 对第一光致抗蚀剂层进行图案化和蚀刻以在氧化铝层中形成矩形沟槽。 沟槽延伸超过预期的ABS平面并且在相反方向延伸到预期的轭区域中。 将第二光致抗蚀剂层图案化为部分地叠置在矩形沟槽上的磁轭形状。 在第二次RIE处理之后,磁轭开口在沿着每个长沟槽侧的颈部转变点处与沟槽相邻。 因此,与颈部相邻的磁轭中的磁性材料的体积最大化。 主极的尺寸控制变得与ABS定位误差无关。
    • 7. 发明授权
    • PMR with improved writability and process controllability by double layer patterning
    • PMR具有改进的可编写性和工艺可控性,通过双层图案化
    • US08027125B2
    • 2011-09-27
    • US11820962
    • 2007-06-21
    • Jiun-Ting LeeShiwen HuangMoris Dovek
    • Jiun-Ting LeeShiwen HuangMoris Dovek
    • G11B5/127
    • G11B5/3116G11B5/1278G11B5/3163Y10T29/49052
    • Improved writability and a sharper neck transition are achieved in a PMR writer with a yoke that has essentially vertical sidewalls and a write pole that has sidewalls with a beveled angle. An alumina mold is made with a negative differential bevel angle by employing a two mask process. A first photoresist layer is patterned and etched to form a rectangular trench in an alumina layer. The trench extends beyond the intended ABS plane and in the opposite direction into the intended yoke area. A second photoresist layer is patterned into a yoke shape that is partially superimposed over the rectangular trench. After a second RIE process, the yoke opening adjoins the trench at a neck transition point along each long trench side. The volume of magnetic material in the yoke adjacent to the neck is thereby maximized. Dimension control of the main pole becomes independent of ABS positioning errors.
    • 在具有基本垂直侧壁的磁轭和具有倾斜角度的侧壁的写入极的PMR写入器中实现了改进的可写入性和更尖锐的颈部转变。 通过采用两个掩模工艺制造具有负微分斜角的氧化铝模具。 对第一光致抗蚀剂层进行图案化和蚀刻以在氧化铝层中形成矩形沟槽。 沟槽延伸超出预期的ABS平面并且在相反方向延伸到预期的轭区域中。 将第二光致抗蚀剂层图案化为部分地叠置在矩形沟槽上的磁轭形状。 在第二次RIE处理之后,磁轭开口在沿着每个长沟槽侧的颈部转变点处与沟槽相邻。 因此,与颈部相邻的磁轭中的磁性材料的体积最大化。 主极的尺寸控制变得与ABS定位误差无关。
    • 8. 发明授权
    • Method for manufacturing wraparound shield write head using hard masks
    • 使用硬掩模制造环绕屏蔽写头的方法
    • US08801943B2
    • 2014-08-12
    • US13193520
    • 2011-07-28
    • Shiwen HuangFenglin LiuQiping ZhongKyusik ShinYingjian Chen
    • Shiwen HuangFenglin LiuQiping ZhongKyusik ShinYingjian Chen
    • B44C1/22
    • G11B5/3116G11B5/3163
    • The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.
    • 本公开描述了通过实施三层(三层)硬掩模制造全封装屏蔽镶嵌写头的方法。 根据本发明的实施例,在形成写入头期间,各种硬掩模层用于不同的目的。 本发明的环绕式屏蔽头表现出改进的物理特性,进一步导致改善的性能特征。 根据本发明的硬掩模层的使用允许使用可以比其它工艺中使用的那些方法更加严格地控制的制造工艺。 例如,可以使用较小尺寸的光刻技术。 此外,在使用CMP工艺不如使用本发明可能的沉积或光刻技术那样不受控制的情况下,对某些CMP工艺的依赖是不必要的。