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    • 32. 发明授权
    • High throughput heated ion implantation system and method
    • 高通量加热离子注入系统及方法
    • US09378992B2
    • 2016-06-28
    • US14317778
    • 2014-06-27
    • Axcelis Technologies, Inc.
    • Armin HuseinovicJoseph FerraraBrian Terry
    • H01J37/18H01J37/20H01L21/67H01L21/265H01L21/677H01J37/317
    • H01L21/67201H01J37/185H01J37/20H01J37/3171H01L21/265H01L21/67103H01L21/67109H01L21/67115H01L21/67161H01L21/67213H01L21/67712
    • An ion implantation system has an ion implantation apparatus coupled to first and second dual load lock assemblies, each having a respective first and second chamber separated by a common wall. Each first chamber has a pre-heat apparatus configured to heat a workpiece to a first temperature. Each second chamber has a post-cool apparatus configured to cool the workpiece to a second temperature. A thermal chuck retains the workpiece in a process chamber for ion implantation, and the thermal chuck is configured to heat the workpiece to a third temperature. A pump and vent are in selective fluid communication with the first and second chambers. A controller is configured to heat the workpiece to the first temperature in an atmospheric environment via the pre-heat apparatus, to heat the workpiece to the second temperature via the thermal chuck, to implant ions into the workpiece via the ion implantation apparatus, and to transfer the workpiece between atmospheric and vacuum environments via a control of the pre-heat apparatus, post-cool apparatus, pump, vent, and thermal chuck.
    • 离子注入系统具有耦合到第一和第二双负载锁定组件的离子注入装置,每个具有由公共壁分隔的相应的第一和第二室。 每个第一室具有构造成将工件加热到第一温度的预热装置。 每个第二腔室具有后冷却装置,其构造成将工件冷却至第二温度。 热卡盘将工件保持在用于离子注入的处理室中,并且热卡盘构造成将工件加热到第三温度。 泵和排气口与第一和第二室选择性地流体连通。 控制器被配置为经由预热装置在大气环境中将工件加热到第一温度,以经由热卡盘将工件加热到第二温度,以通过离子注入装置将离子注入工件,并且 通过预热装置,后冷却装置,泵,通风口和热卡盘的控制在大气和真空环境之间传送工件。
    • 35. 发明授权
    • Apparatus for transferring substrate
    • 用于转移衬底的装置
    • US09246377B2
    • 2016-01-26
    • US14505712
    • 2014-10-03
    • Samsung Display Co., Ltd.
    • Takayuki FukasawaYeon-Keon MoonSang-woo SohnKatsushi KishimotoSang-Won Shin
    • B65G35/00H02K41/03H01L21/677H02K7/09
    • H02K41/031H01L21/677H01L21/67709H01L21/67712H01L21/6776H02K7/09
    • Disclosed is an apparatus for transferring substrates capable of stably transferring substrates by using magnetic levitation. The apparatus includes a substrate stage including a substrate loading unit, a first guide block disposed at a first end of the substrate stage and including a first magnet generator, a second guide block disposed at a second end of the substrate stage and including a second magnet generator, a first guide rail accommodating the first magnet generator and including a third magnet generator, and a second guide rail accommodating the second magnet generator and including a fourth magnet generator. The first magnet generator and the third magnet generator exert repulsive force on each other, and the second magnet generator and the fourth magnet generator exert repulsive force on each other.
    • 公开了一种通过磁悬浮转移能够稳定地转移衬底的衬底的装置。 该装置包括:衬底台,包括衬底装载单元,设置在衬底台的第一端处的第一引导块,并且包括第一磁体发生器,设置在衬底台的第二端处的第二引导块,并且包括第二磁体 发电机,容纳所述第一磁体发生器并包括第三磁体发生器的第一导轨和容纳所述第二磁体发生器并包括第四磁体发生器的第二导轨。 第一磁体发生器和第三磁体发生器相互施加排斥力,第二磁体发生器和第四磁体发生器相互施加排斥力。
    • 36. 发明授权
    • Coating apparatus and method
    • 涂布装置及方法
    • US09211563B2
    • 2015-12-15
    • US14000369
    • 2012-02-21
    • Erkan KoparalAndreas Kloeppel
    • Erkan KoparalAndreas Kloeppel
    • B05C13/00B05D7/00C23C14/56H01L21/67H01L21/677
    • B05C13/00B05D7/56C23C14/568H01L21/67173H01L21/67712H01L21/6776
    • A substrate processing system for processing an essentially vertically oriented substrate is described. The system includes a first processing chamber having a first processing region to deposit a first layer comprising a first material, a second processing chamber having a second processing region to deposit a second layer over the first layer, the second layer comprising a second material, a third processing chamber having a third processing region to deposit a layer comprising the second material, a transfer chamber providing essentially linear transport paths with the first, second, and third chambers, respectively, and a chamber comprising a first and a second transportation track, wherein at least one of the first and second transportation tracks forms an essentially linear transportation path with the first processing chamber, wherein the first chamber is adapted to receive the substrate from the transfer chamber, and to deposit a further layer comprising the first material.
    • 描述了用于处理基本垂直取向的基板的基板处理系统。 该系统包括具有第一处理区域的第一处理室,以沉积包括第一材料的第一层,具有第二处理区域的第二处理室以在第一层上沉积第二层,第二层包括第二材料, 第三处理室具有第三处理区域以沉积包含第二材料的层,传送室分别与第一,第二和第三室提供基本上线性的输送路径,以及包括第一和第二输送轨道的室,其中 所述第一和第二输送轨道中的至少一个与所述第一处理室形成基本上线性的输送路径,其中所述第一室适于从所述转移室接收所述基板,并沉积包括所述第一材料的另外的层。
    • 39. 发明申请
    • SUBSTRATE PROCESSING APPARATUS
    • 基板加工设备
    • US20140126980A1
    • 2014-05-08
    • US14071205
    • 2013-11-04
    • TOKYO ELECTRON LIMITED
    • Yu WAMURAAkira SHIMIZU
    • B65G49/00
    • H01L21/67167H01L21/67184H01L21/67201H01L21/67712
    • Provided is a substrate processing apparatus which includes: first and second vacuum transfer chambers which are partitioned from each other; processing chambers configured to perform a vacuum processing onto substrates; a load lock chamber installed to be sandwiched between the first and second vacuum transfer chambers, and including partition valves installed between the load lock chamber and a normal pressure atmosphere, and between the load lock chamber and each of the first and second vacuum transfer chambers; and substrate mounting tables inside the load lock chamber and configured to move between an upper position at which the substrates are transferred between the load lock chamber and the normal pressure atmosphere, and a lower position at which the substrates are transferred between the load lock chamber and the first or second vacuum transfer chamber.
    • 提供了一种基板处理装置,其包括:彼此分隔的第一和第二真空传送室; 处理室,被配置为对基板执行真空处理; 安装在第一和第二真空传送室之间的负载锁定室,并且包括安装在负载锁定室和常压气氛之间以及负载锁定室与第一和第二真空传送室中的每一个之间的分隔阀; 以及衬底安装台,其设置在所述负载锁定室内并且构造成在所述衬底在所述负载锁定室和所述常压气氛之间传递的上部位置和所述衬底在所述负载锁定室和所述正常压力气氛之间传送的下部位置之间移动; 第一或第二真空传送室。
    • 40. 发明授权
    • Gas-ejecting bearings for transport of glass sheets
    • 用于运输玻璃板的喷气轴承
    • US08511461B2
    • 2013-08-20
    • US12465859
    • 2009-05-14
    • Gautam Narendra KudvaWeiwei Luo
    • Gautam Narendra KudvaWeiwei Luo
    • B65G45/22C03B35/24
    • C03B35/24B65G49/061B65G49/062B65G49/063F16C32/0603H01L21/67712H01L21/67721
    • Non-contact, gas-ejecting bearings (3) are provided for conveying flexible glass sheets (13), such as LCD substrates, at high conveyance speeds, e.g., speeds of 40 meters/minute and above, e.g., 60 meters/minute. Gas is provided to the bearing's orifices (22) from a plenum which operates at a pressure Pplenum and the bearings have a calculated static pressure Pmidpoint at the midpoints (27) between the bearing's centermost orifice (26) and each of its nearest neighbors (28) in a horizontal direction which satisfies the relationship Pmidpoint/Pplenum≧0.05. The bearings (3) can reduce the time-averaged, peak-to-peak variation in the spacing between a LCD substrate (13) traveling at, for example, 60 meters/minute and the face (20) of the bearing (3) to less than 500 microns, thus reducing the chances that the substrate (13) will hit and be damaged by the bearing (3).
    • 提供非接触式气体喷射轴承(3),以高输送速度(例如40米/分钟以上,例如60米/分钟)的速度传送诸如LCD基板的柔性玻璃板(13)。 气体从在压力Pplenum上工作的增压室提供给轴承的孔口(22),并且轴承在轴承的最中心孔口(26)和其最近的邻近件(28)之间的中点(27)处具有计算的静态压力Pmidpoint )满足关系Pmidpoint / Pplenum> = 0.05的水平方向。 轴承(3)可以减少以例如60米/分钟行进的LCD基板(13)与轴承(3)的表面(20)之间的间隔的时间平均,峰 - 峰变化, 到小于500微米,从而减少了衬底(13)将被轴承(3)撞击并损坏的机会。