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31. 发明授权

US08428668B2 Sliding mechanism 有权
标题翻译：滑动机构
公开(公告)号：US08428668B2
公开(公告)日：2013-04-23
申请号：US12813615
申请日：2010-06-11
申请人： You Wang
发明人： You Wang
IPC分类号： H04M1/00
CPC分类号： H04M1/0237
摘要： A sliding mechanism comprises a main plate, a sliding plate, a sliding enabling member and a biasing assembly. The sliding enabling member is coupled between the sliding plate and the main plate so the sliding plate slidably engages with the main plate. The biasing assembly is coupled between the sliding plate and the main plate. When the sliding plate is slid from a closed position to an intermediate position, the biasing assembly is distorted to exert a force on the sliding plate and the main plate, causing the sliding plate to automatically slide toward an open position once the sliding plate passes the intermediate position.
摘要翻译：滑动机构包括主板，滑板，滑动启用构件和偏置组件。滑动启用构件联接在滑板和主板之间，使得滑动板可滑动地与主板接合。偏置组件联接在滑板和主板之间。当滑板从关闭位置滑动到中间位置时，偏压组件变形，以在滑板和主板上施加力，一旦滑板通过滑板，滑板就会自动滑向打开位置中间位置

32. 发明授权

US07879255B2 Method and composition for electrochemically polishing a conductive material on a substrate 失效
标题翻译：在基材上电化学研磨导电材料的方法和组合物
公开(公告)号：US07879255B2
公开(公告)日：2011-02-01
申请号：US11556593
申请日：2006-11-03
申请人： Huyen Karen Tran , Renhe Jia , You Wang , Stan D. Tsai , Martin S. Wohlert , Daxin Mao
发明人： Huyen Karen Tran , Renhe Jia , You Wang , Stan D. Tsai , Martin S. Wohlert , Daxin Mao
IPC分类号： C09K13/00
CPC分类号： B23H5/08
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. The method includes providing a substrate comprising dielectric feature definitions, a barrier material disposed in the feature definitions, and a bulk conductive material disposed on the barrier material in an amount sufficient to fill feature definitions; polishing the substrate to substantially remove the bulk conductive material; polishing a residual conductive material to expose feature definitions, comprising: applying a first voltage for a first time period, wherein the first voltage is less than the critical voltage; and applying a second voltage for a second time period, wherein the second voltage is greater than the critical voltage.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。该方法包括提供包括介电特征定义的基底，设置在特征定义中的阻挡材料和以足以填充特征定义的量设置在阻挡材料上的体导电材料; 抛光衬底以基本上去除体导电材料; 抛光残余导电材料以暴露特征定义，包括：施加第一电压第一时间段，其中所述第一电压小于所述临界电压; 以及施加第二时间段的第二电压，其中所述第二电压大于所述临界电压。

33. 发明申请

US20100096360A1 COMPOSITIONS AND METHODS FOR BARRIER LAYER POLISHING 审中-公开
标题翻译：用于障碍层抛光的组合物和方法
公开(公告)号：US20100096360A1
公开(公告)日：2010-04-22
申请号：US12579860
申请日：2009-10-15
申请人： You Wang , Yuchun Wang , Yan Wang , Kuo-Lih Chang , Jin Xu , Wen-Chaing Tu
发明人： You Wang , Yuchun Wang , Yan Wang , Kuo-Lih Chang , Jin Xu , Wen-Chaing Tu
IPC分类号： C09K13/00 , C23F1/02
CPC分类号： C09K3/1463 , C09G1/02 , H01L21/3212
摘要： Methods and apparatus are provided for polishing barrier layer materials. In one embodiment, a composition is provided for removing at least a barrier material from a substrate surface, including includes a base composition, a silica abrasive, a solvent, a pH between about 7 and about 10, and one or more components selected from the group of a metal passivating compound, an oxidizer, and an alumina abrasive. The composition may be used to chemical mechanical polishing process a substrate surface having a ruthenium-based barrier and one or more material selected from the group of a polysilicon layer, a dielectric layer, or metal layer.
摘要翻译：提供了用于抛光阻挡层材料的方法和装置。在一个实施方案中，提供了用于从基材表面去除至少阻挡材料的组合物，包括基础组合物，二氧化硅磨料，溶剂，约7至约10的pH以及选自下列的一种或多种组分一组金属钝化剂，氧化剂和氧化铝磨料。该组合物可以用于化学机械抛光工艺，其具有钌基阻挡层和选自多晶硅层，电介质层或金属层的一种或多种材料的衬底表面。

34. 发明授权

US07582564B2 Process and composition for conductive material removal by electrochemical mechanical polishing 失效
标题翻译：通过电化学机械抛光去除导电材料的工艺和组成
公开(公告)号：US07582564B2
公开(公告)日：2009-09-01
申请号：US11123274
申请日：2005-05-05
申请人： Zhihong Wang , You Wang , Daxin Mao , Renhe Jia , Stan D. Tsai , Yongqi Hu , Yuan A. Tian , Liang-Yuh Chen
发明人： Zhihong Wang , You Wang , Daxin Mao , Renhe Jia , Stan D. Tsai , Yongqi Hu , Yuan A. Tian , Liang-Yuh Chen
IPC分类号： H01L21/302
CPC分类号： C25F3/02 , B23H5/08 , C09G1/02 , H01L21/32125 , H01L21/7684
摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.
摘要翻译：提供了用于处理其上设置有导电材料层的基板的组合物和方法。在一个实施方案中，提供了一种用于处理其上设置导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，溶剂和 pH为约3至约10.该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及去除导电材料层。

35. 发明申请

US20080035882A1 COMPOSITION FOR POLISHING A SUBSTRATE 审中-公开
标题翻译：用于抛光基材的组合物
公开(公告)号：US20080035882A1
公开(公告)日：2008-02-14
申请号：US11877344
申请日：2007-10-23
申请人： Junzi Zhao , You Wang , Feng Liu , Stan Tsai
发明人： Junzi Zhao , You Wang , Feng Liu , Stan Tsai
IPC分类号： C09K13/06 , C09K13/00 , C09K13/04
CPC分类号： H01L21/7684 , B24B37/044 , C09G1/02 , C09G1/04 , C25F3/02 , H01L21/32125
摘要： Polishing compositions and methods for removing barrier materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a barrier material from a substrate surface including an acid based electrolyte system, one or more chelating agents, one or more pH adjusting agents to provide a pH between about 3 and about 11, and a solvent. The composition may be used in an electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of barrier materials from the substrate surface with a reduction in planarization type defects.
摘要翻译：提供了用于从衬底表面去除阻挡材料的抛光组合物和方法。一方面，提供一种组合物，用于从基材表面至少除去阻挡材料，所述基材表面包括酸性电解质体系，一种或多种螯合剂，一种或多种pH调节剂以提供约3至约11的pH，以及溶剂。该组合物可用于电化学机械平面化工艺中。本文所述的抛光组合物和方法通过减小平坦化型缺陷来改善阻挡材料从衬底表面的有效去除速率。

36. 发明申请

US20070079087A1 User interface for archival storage of data 审中-公开
标题翻译：用于存档数据的用户界面
公开(公告)号：US20070079087A1
公开(公告)日：2007-04-05
申请号：US11540500
申请日：2006-09-28
申请人： You Wang , Steven Hartung
发明人： You Wang , Steven Hartung
IPC分类号： G06F12/16
CPC分类号： G06F11/1448 , G06F11/1461 , G06F16/113 , G06F16/1737
摘要： A user interface for a secondary storage system, where the secondary “backup” data resides in a power-managed disk array, is provided. The user interface enables a user of the secondary storage system to create and schedule archiving and retrieving tasks for files or directories. The user can manage the users of the secondary storage system. The user can also view details of currently executing tasks. Further, the user interface enables users to search for files and directories in the secondary storage system.
摘要翻译：提供了辅助存储系统的用户界面，其中辅助“备份”数据驻留在功率管理的磁盘阵列中。用户界面使辅助存储系统的用户可以创建和调度归档和检索文件或目录的任务。用户可以管理辅助存储系统的用户。用户还可以查看当前执行任务的详细信息。此外，用户界面使用户能够搜索辅助存储系统中的文件和目录。

37. 发明申请

US20060169597A1 Method and composition for polishing a substrate 审中-公开
标题翻译：抛光基材的方法和组合物
公开(公告)号：US20060169597A1
公开(公告)日：2006-08-03
申请号：US11356352
申请日：2006-02-15
申请人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu , Robert Ewald , Yuan Tian , You Wang , Stan Tsai
发明人： Feng Liu , Tianbao Du , Alain Duboust , Wei-Yung Hsu , Robert Ewald , Yuan Tian , You Wang , Stan Tsai
IPC分类号： B23H9/00 , B23H7/00
CPC分类号： C25F3/02 , B23H5/08
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, a corrosion inhibitor having an azole group, an organic acid salt, a pH adjusting agent to provide a pH between about 2 and about 10, and a solvent, and a solvent. The composition may be used in a conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer. The polishing compositions and methods described herein improve the effective removal rate of materials from the substrate surface, such as copper, with a reduction in planarization type defects and yielding a desirable surface finish.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。在一个方面，组合物包括酸基电解质体系，具有唑基的腐蚀抑制剂，有机酸盐，pH调节剂以提供约2至约10的pH以及溶剂和溶剂。该组合物可以用于导电材料去除工艺中，包括在包括电极的工艺设备中设置其上形成有导电材料层的衬底，在电极和衬底之间提供组合物，在电极和衬底之间施加偏压，以及从导电材料层去除导电材料。本文所述的抛光组合物和方法提高了材料从衬底表面（例如铜）的有效去除速率，同时平坦化型缺陷减少并产生理想的表面光洁度。

38. 发明授权

US06689424B1 Solid lubricant coatings produced by thermal spray methods 失效
标题翻译：通过热喷涂方法生产的固体润滑剂涂料
公开(公告)号：US06689424B1
公开(公告)日：2004-02-10
申请号：US09579874
申请日：2000-05-27
申请人： You Wang , Tongsan D. Xiao , Hui Ye
发明人： You Wang , Tongsan D. Xiao , Hui Ye
IPC分类号： C23C406
CPC分类号： C23C4/06 , C23C4/04
摘要： A method for the deposition of solid lubricant coatings onto a substrate, comprising thermally spraying a powder comprising agglomerates of a solid lubricant coated with sulfur. Preferably, the solid lubricant is a sulfide. The coatings find particular utility on rollers used in the manufacture of steel.
摘要翻译：一种用于将固体润滑剂涂层沉积到基材上的方法，包括热喷涂包含用硫涂覆的固体润滑剂的附聚物的粉末。优选地，固体润滑剂是硫化物。涂层在用于制造钢的辊子上特别有用。

39. 发明授权

US06639783B1 Multi-layer ceramic electrostatic chuck with integrated channel 失效
标题翻译：多层陶瓷静电卡盘，集成通道
公开(公告)号：US06639783B1
公开(公告)日：2003-10-28
申请号：US09149807
申请日：1998-09-08
申请人： Shamouil Shamouilian , You Wang , Ananda H. Kumar
发明人： Shamouil Shamouilian , You Wang , Ananda H. Kumar
IPC分类号： H02N1300
CPC分类号： H02N13/00 , Y10T279/23
摘要： A semiconductor wafer support chuck having small diameter gas distribution ports for heat transfer gas. The diameter ports inhibit plasma ignition in heat transfer gas distribution channels. The ports are less than 20 mils in diameter less than 3 mm in length. The short length of the ports facilitates fabrication of multiple ports of very small diameter. The ports communicate with a gas distribution plenum integrated into the body of the chuck beneath a wafer support surface. The plenum has radial channels and a peripheral groove for distributing heat transfer gas to the wafer support surface.
摘要翻译：一种半导体晶片支撑卡盘，其具有用于传热气体的小直径气体分配端口。直径端口禁止传热气体分配通道中的等离子体点火。这些端口的直径小于20密耳，长度小于3毫米。端口的短长度有助于制造非常小直径的多个端口。端口与在晶片支撑表面下方集成到卡盘主体中的气体分配气室连通。气室具有径向通道和用于将传热气体分配到晶片支撑表面的外围槽。

40. 发明授权

US06583980B1 Substrate support tolerant to thermal expansion stresses 失效
标题翻译：基材支持耐热膨胀应力
公开(公告)号：US06583980B1
公开(公告)日：2003-06-24
申请号：US09641536
申请日：2000-08-18
申请人： You Wang , Arnold Kholodenko , Shamouil Shamouilian , Alexander M. Veytser , Wing L. Cheng
发明人： You Wang , Arnold Kholodenko , Shamouil Shamouilian , Alexander M. Veytser , Wing L. Cheng
IPC分类号： H01G300
CPC分类号： H01L21/6831
摘要： A chamber 30 for processing a substrate 25 comprises a support 55 including an electrode 70 at least partially covered by a dielectric 60 that is permeable to electromagnetic energy. The electrode 70 may be chargeable to electrostatically hold the substrate 25, to couple energy to a gas in the chamber 30, or both. A base 90 below the support 55 comprises a slot 95 that may be adapted to serve as a thermal expansion slot to reduce thermal stresses.
摘要翻译：用于处理基板25的室30包括支撑件55，其包括至少部分地被电介质60覆盖的电极70，电介质60可透过电磁能。电极70可以被充电以静电保持衬底25，以将能量耦合到腔室30中的气体，或两者。支撑件55下方的底座90包括可适于用作热膨胀槽以减少热应力的槽95。

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