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1. 发明授权

US07879255B2 Method and composition for electrochemically polishing a conductive material on a substrate 失效
标题翻译：在基材上电化学研磨导电材料的方法和组合物
公开(公告)号：US07879255B2
公开(公告)日：2011-02-01
申请号：US11556593
申请日：2006-11-03
申请人： Huyen Karen Tran , Renhe Jia , You Wang , Stan D. Tsai , Martin S. Wohlert , Daxin Mao
发明人： Huyen Karen Tran , Renhe Jia , You Wang , Stan D. Tsai , Martin S. Wohlert , Daxin Mao
IPC分类号： C09K13/00
CPC分类号： B23H5/08
摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. The method includes providing a substrate comprising dielectric feature definitions, a barrier material disposed in the feature definitions, and a bulk conductive material disposed on the barrier material in an amount sufficient to fill feature definitions; polishing the substrate to substantially remove the bulk conductive material; polishing a residual conductive material to expose feature definitions, comprising: applying a first voltage for a first time period, wherein the first voltage is less than the critical voltage; and applying a second voltage for a second time period, wherein the second voltage is greater than the critical voltage.
摘要翻译：提供了抛光组合物和从衬底表面去除导电材料的方法。该方法包括提供包括介电特征定义的基底，设置在特征定义中的阻挡材料和以足以填充特征定义的量设置在阻挡材料上的体导电材料; 抛光衬底以基本上去除体导电材料; 抛光残余导电材料以暴露特征定义，包括：施加第一电压第一时间段，其中所述第一电压小于所述临界电压; 以及施加第二时间段的第二电压，其中所述第二电压大于所述临界电压。

2. 发明申请

US20080196833A1 RETAINING RING WITH SHAPED SURFACE 有权
标题翻译：具有形状表面的保持环
公开(公告)号：US20080196833A1
公开(公告)日：2008-08-21
申请号：US12049650
申请日：2008-03-17
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： H01L21/306 , B24B1/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译：保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。保持环的底面可以包括平坦的，倾斜的和弯曲的部分。可以使用专用于研磨保持环底面的机器进行研磨。在研磨期间，可以允许环围绕环的轴线自由旋转。保持环的底面可以具有弯曲或平坦的部分。

3. 发明授权

US08585468B2 Retaining ring with shaped surface 有权
公开(公告)号：US08585468B2
公开(公告)日：2013-11-19
申请号：US13305589
申请日：2011-11-28
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B5/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

4. 发明申请

US20120168135A1 APPARATUS AND METHOD FOR SOLAR CELL MODULE EDGE COOLING DURING LAMINATION 审中-公开
标题翻译：用于层叠时的太阳能电池组件边缘冷却的装置和方法
公开(公告)号：US20120168135A1
公开(公告)日：2012-07-05
申请号：US13327369
申请日：2011-12-15
申请人： Robert C. LINKE , Martin S. WOHLERT , Adam BRAND , Ofer AMIR
发明人： Robert C. LINKE , Martin S. WOHLERT , Adam BRAND , Ofer AMIR
IPC分类号： F28F7/00 , H01L31/18
CPC分类号： H01L31/206 , H01L31/0488 , Y02E10/50 , Y02P70/521 , Y10T29/53061 , Y10T29/5317
摘要： Embodiments of the present invention provide a lamination module and procedure for cooling the edges of a partially formed thin film solar module to substantially the same temperature as the central region of the module just prior to compressing and bonding the layers of the heated module. The lamination module may include a cooling module having a plurality of nozzles configured to apply a curtain of cooling fluid to leading and trailing edges of the partially formed solar module after heating the module and just prior to compressing the module. The nozzles may further be configured to apply a curtain of cooling fluid to side edges of the partially formed solar cell module as it passes through the cooling module. As a result, the chance of bubble formation within the bonding material in the edge regions of the completed solar cell module is significantly lowered with respect to conventional lamination processes.
摘要翻译：本发明的实施例提供了一种层压模块和程序，用于将部分形成的薄膜太阳能模块的边缘冷却到与模块的中心区域基本相同的温度，就在压缩和粘合加热模块的层之前。层压模块可以包括冷却模块，其具有多个喷嘴，其被配置为在加热模块之后并且在压缩模块之前将冷却流体帘幕施加到部分形成的太阳能模块的前缘和后缘。喷嘴可以进一步构造成当部分形成的太阳能电池模块通过冷却模块时将冷却流体帘幕施加到部分形成的太阳能电池模块的侧边缘。结果，相对于传统的层压方法，在完成的太阳能电池模块的边缘区域中的接合材料内的气泡形成的机会显着降低。

5. 发明申请

US20120071067A1 RETAINING RING WITH SHAPED SURFACE 有权
标题翻译：具有形状表面的保持环
公开(公告)号：US20120071067A1
公开(公告)日：2012-03-22
申请号：US13305589
申请日：2011-11-28
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B41/06
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译：保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。保持环的底面可以包括平坦的，倾斜的和弯曲的部分。可以使用专用于研磨保持环底面的机器进行研磨。在研磨期间，可以允许环围绕环的轴线自由旋转。保持环的底面可以具有弯曲或平坦的部分。

6. 发明授权

US08066551B2 Retaining ring with shaped surface 有权
标题翻译：带环形表面的保持环
公开(公告)号：US08066551B2
公开(公告)日：2011-11-29
申请号：US13089174
申请日：2011-04-18
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey P. Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey P. Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B1/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译：保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。保持环的底面可以包括平坦的，倾斜的和弯曲的部分。可以使用专用于研磨保持环底面的机器进行研磨。在研磨期间，可以允许环围绕环的轴线自由旋转。保持环的底面可以具有弯曲或平坦的部分。

7. 发明申请

US20110195639A1 RETAINING RING WITH SHAPED SURFACE 有权
标题翻译：具有形状表面的保持环
公开(公告)号：US20110195639A1
公开(公告)日：2011-08-11
申请号：US13089174
申请日：2011-04-18
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B1/00 , B23P19/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
摘要翻译：保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。保持环的底面可以包括平坦的，倾斜的和弯曲的部分。可以使用专用于研磨保持环底面的机器进行研磨。在研磨过程中，可以允许环绕环的轴线自由旋转。保持环的底面可以具有弯曲或平坦的部分。

8. 发明授权

US07927190B2 Retaining ring with shaped surface 有权
公开(公告)号：US07927190B2
公开(公告)日：2011-04-19
申请号：US12049650
申请日：2008-03-17
申请人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
发明人： Hung Chih Chen , Steven M. Zuniga , Charles C. Garretson , Douglas R. McAllister , Jian Lin , Stacy Meyer , Sidney P. Huey , Jeonghoon Oh , Trung T. Doan , Jeffrey Schmidt , Martin S. Wohlert , Kerry F. Hughes , James C. Wang , Danny Cam Toan Lu , Romain Beau De Lamenie , Venkata R. Balagani , Aden Martin Allen , Michael Jon Fong
IPC分类号： B24B5/00
CPC分类号： B24B37/32 , Y10T29/49815
摘要： A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

9. 发明授权

US07210988B2 Method and apparatus for reduced wear polishing pad conditioning 失效
标题翻译：降低磨损抛光垫调理的方法和装置
公开(公告)号：US07210988B2
公开(公告)日：2007-05-01
申请号：US11209167
申请日：2005-08-22
申请人： Yan Wang , Stan D. Tsai , Yongqi Hu , Feng Q. Liu , Liang-Yuh Chen , Daxin Mao , Huyen Karen Tran , Martin S. Wohlert , Renhe Jia , Yuan A. Tian
发明人： Yan Wang , Stan D. Tsai , Yongqi Hu , Feng Q. Liu , Liang-Yuh Chen , Daxin Mao , Huyen Karen Tran , Martin S. Wohlert , Renhe Jia , Yuan A. Tian
IPC分类号： B24B53/00
CPC分类号： B24B53/017 , B23H5/08
摘要： Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.
摘要翻译：提供了用于原位调理和/或清洁CMP，ECMP或其它处理系统的处理垫的调节头的实施例。在一个实施例中，调节头包括设置在中心腔中的刷子。清洁流体通过调节头的中心空腔设置到处理垫。刷子旋转并横向移动到处理垫的表面上。通过调节头分配的清洁溶液溶解处理操作的副产物，同时刷子轻轻擦拭处理垫。调节头的唇缘保持清洁流体和清洁废物，从而最小化调节头外部区域的污染。清洁废物通过在调节头的外周附近形成的通道从处理垫移除。

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