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    • 33. 发明申请
    • Business process diagnostic method and business process diagnostic system
    • 业务流程诊断方法和业务流程诊断系统
    • US20050080647A1
    • 2005-04-14
    • US10929418
    • 2004-08-31
    • Koji OkadaTatsuya SuzukiAsahiro Kuni
    • Koji OkadaTatsuya SuzukiAsahiro Kuni
    • G06Q10/00G06Q10/06G06Q50/00G06F17/60
    • G06Q10/06G06Q30/0203
    • In business process diagnosis, answers to questions is improved in their accuracy, and an accurate result of diagnosis is obtained. A computer diagnoses a business process of an organization based on answers to questions. The diagnosis includes a first answer reception step in which a first question sheet containing common questions is displayed to receive answers to said common questions and to receive questions proper to the organization, and then a second question sheet containing said common questions, said answers to the common questions, and said questions proper to the organization is generated; a second answer reception step in which said second question sheet is displayed to receive answers to said questions proper to the organization, and then a third question sheet containing said common questions, said answers to the common questions, said questions proper to the organization, and said answers to the questions proper to the organization is generated; and a diagnosis step in which the business process of said organization is diagnosed based on the answers to said common questions and the answers to said questions proper to the organization, with said answers to said common questions and said answers to said questions proper to the organization being filled in said third question sheet.
    • 在业务流程诊断中,问题的答案在准确性方面得到改进,得到了准确的诊断结果。 计算机根据问题的答案诊断组织的业务流程。 诊断包括第一答案接收步骤,其中显示包含常见问题的第一问题单以接收对所述常见问题的答案并且接收适合于该组织的问题,然后包含包含所述常见问题的第二个问题单,对 共同的问题,并提出了适合组织的问题; 第二回答接收步骤,其中显示所述第二问题单以接收对组织适当的所述问题的答案,然后包含第三个问题单,其中包含所述常见问题,常见问题的答案,对组织适用的所述问题,以及 表示对组织适用的问题的答案是产生的; 以及诊断步骤,其中基于所述常见问题的答案和对组织适当的所述问题的答案来诊断所述组织的业务流程,所述答案涉及对所述组织适合的所述常见问题和所述问题的答案 填写在第三个问题单中。
    • 34. 发明授权
    • Projection alignment method and apparatus
    • 投影对准方法及装置
    • US4708484A
    • 1987-11-24
    • US789778
    • 1985-10-21
    • Yoshihiro KomeyamaYukio KemboAsahiro KuniRyuuichi FunatsuAkira InagakiMinoru IkedaKeiichi Okamoto
    • Yoshihiro KomeyamaYukio KemboAsahiro KuniRyuuichi FunatsuAkira InagakiMinoru IkedaKeiichi Okamoto
    • G01R31/26G03F9/00H01L21/30G01B11/26
    • G03F9/7023G03F9/7049G03F9/7076
    • The present invention relates, in a projection aligner wherein a mask and a wafer are held proximate to one another and wherein a circuit pattern depicted on the mask is transferred onto the wafer, to a method of detecting the respective positions of the mask and the wafer for the relative positioning between the mask and the wafer. To the end of dispensing with the withdrawal of a microscope objective in such a way that the objective of a microscope for detecting the mask and the wafer and projection light, for example, an X-ray, are prevented from interfering, thereby to achieve the enhancement of throughput and to permit the detection of the positions of the mask and the wafer even during projection, the present invention consists in that the objective of the microscope is inclined with respect to a perpendicular to the plane of the mask or the plane of the wafer being a plane to-be-detected, so as not to interfere with the projection light, for example, the X-ray, whereby the circuit pattern can be transferred while the relative positions of the mask and the wafer are being detected.
    • 本发明涉及一种投影对准器,其中掩模和晶片彼此靠近地保持,并且其中将掩模上描绘的电路图案转印到晶片上,以检测掩模和晶片的相应位置的方法 用于掩模和晶片之间的相对定位。 以这样的方式分配显微镜物镜的取出的结束,使得防止用于检测掩模和晶片的显微镜和例如X射线的投射光的目的被干扰,从而实现 增加吞吐量并且即使在投影期间也能够检测掩模和晶片的位置,本发明的目的在于,显微镜的目的是相对于掩模的平面垂直于或平面的倾斜 晶片是要被检测的平面,以便不干涉诸如X射线的投影光,由此可以在检测掩模和晶片的相对位置的同时传输电路图案。
    • 35. 发明授权
    • Surface flaw detection method
    • 表面探伤法
    • US4647196A
    • 1987-03-03
    • US695231
    • 1985-01-28
    • Asahiro KuniKazuo YamaguchiNobuyuki AkiyamaJuro Endo
    • Asahiro KuniKazuo YamaguchiNobuyuki AkiyamaJuro Endo
    • G01B9/02G01N21/88
    • G01N21/88G01B9/02021G01B9/02032
    • A flaw detection method for detecting flaw existing in the surface of a substantially plate-shaped examination object by making use of an interference of light. A coherent light is applied to the surface of the examination object and also to a reference mirror surface. The light reflected by the surface of the examination object and the light reflected by the reference mirror surface are made to interfere with each other to form an interference image from which the flaw is detected. The reference mirror surface is disposed at an optical inclination to the surface of the examination object. The reference mirror surface may be the reverse surface of the examination object while the obserse side of the same is being examined. Infrared coherent ray is preferably used as the coherent light.
    • 一种用于通过利用光的干涉来检测存在于基本上板状的检查对象的表面中的缺陷的探伤方法。 相干光被施加到检查对象的表面,并且也被施加到参考镜表面。 由检查对象的表面反射的光和由参考镜面反射的光被相互干涉,形成检测出缺陷的干涉图像。 参考镜面设置在与检查对象表面成光学倾斜度。 参考镜面可以是检查对象的反面,同时正在检查异物侧。 红外相干光线优选用作相干光。
    • 37. 发明授权
    • Inspection method for soldered joints using x-ray imaging and apparatus
therefor
    • 使用X射线成像的焊接接头的检查方法及其设备
    • US5463667A
    • 1995-10-31
    • US53240
    • 1993-04-28
    • Toshiaki IchinoseTakanori NinomiyaAsahiro KuniKozo NakahataToshimitsu HamadaToshihiko Ayabe
    • Toshiaki IchinoseTakanori NinomiyaAsahiro KuniKozo NakahataToshimitsu HamadaToshihiko Ayabe
    • G01N23/04H01L21/66H01L23/50H05K3/34H05K13/08
    • H05K13/08G01N23/04
    • A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate. The method may include moving the substrate so as to move the surface of the substrate in an XY plane to position the soldered joint at a desired position in the XY plane, rotating the substrate so as to rotate the surface of the substrate in the XY plane to position the soldered joint at a desired orientation in the XY plane, rotating an X-ray source and a detector about the soldered joint in both of two mutually perpendicular planes perpendicular to the XY plane while maintaining the X-ray source and the detector at fixed positions relative to each other to establish a desired oblique irradiation angle between an X-ray from the X-ray source and the lead on the surface of the substrate, irradiating the soldered joint with the X-ray from the X-ray source at the desired oblique irradiation angle such that the X-ray is transmitted through the soldered joint and the substrate, detecting the X-ray transmitted through the soldered joint and the substrate with the detector, the detector producing an output signal indicative of the detected X-ray, and determining a condition of the soldered joint based on the output signal of the detector. The apparatus may operate in the same fashion.
    • 一种用X射线检测焊接接头的方法和装置,所述焊接接头通过将引线焊接到基板的表面而形成。 该方法可以包括移动基板以使基板的表面在XY平面中移动,以将焊接接头定位在XY平面中的期望位置,旋转基板以使基板的表面在XY平面中旋转 将焊接接头定位在XY平面中所需的取向上,使X射线源和检测器围绕焊接接头在与XY平面垂直的两个相互垂直的平面中旋转,同时将X射线源和检测器保持在 固定位置,以建立来自X射线源的X射线与衬底表面上的铅之间的期望的倾斜照射角度,用X射线源的X射线照射焊接接头 所需的倾斜照射角度,使得X射线透射通过焊接接头和基板,通过检测器检测透过焊接接头和基板的X射线,检测器产品 选择表示检测到的X射线的输出信号,以及基于检测器的输出信号确定焊接接头的状态。 该装置可以以相同的方式操作。
    • 40. 发明授权
    • Method and apparatus for detecting defect in circuit pattern of a mask
for X-ray exposure
    • 用于检测用于X射线曝光的掩模的电路图案中的缺陷的方法和装置
    • US4814615A
    • 1989-03-21
    • US45538
    • 1987-05-04
    • Satoru FushimiYasuo NakagawaAsahiro KuniHitoshi KubotaHiroya Koshishiba
    • Satoru FushimiYasuo NakagawaAsahiro KuniHitoshi KubotaHiroya Koshishiba
    • H01L21/66G01B15/00G01N23/02G02B21/00G03F1/00G03F1/84G03F1/86H01J37/26H01J37/317
    • B82Y10/00B82Y40/00G03F1/86H01J37/3174H01J2237/2802H01J2237/31798
    • In accordance with the present invention, there is provided a pattern defect detecting apparatus using a scanning and transmission electron microscope, comprising an electron gun for accelerating an electron beam with high energy enough to transmit it through a sample and for radiating the accelerated electron beam, a condenser lens for focusing the electron beam generated by said electron gun, a beam deflection coil for deflecting the electron beam focused by said condenser lens, an objective lens for further focusing the electron beam deflected by said beam deflection coil onto a fixed spot, an XY stage for disposing the sample so as to be opposed to said objective lens, said XY stage being movable in X and Y directions in a step and repeat manner, a sample chamber for housing the XY stage in vacuum, said sample chamber including at least the outlet of the electron beam of said objective lens, an electron beam detector for detecting electron beams transmitted through said sample, said electron beam detector being fixed to a stationary member such as said chamber or a lens barrel, and defect detecting means for scanning the electron beam by using said beam deflection coil for each step and repeat operation of said XY stage, for comparing a video signal obtained from said electron beam detector with a reference pattern read out from memory means, and for thereby detecting a defect of the sample.
    • 根据本发明,提供了一种使用扫描和透射电子显微镜的图案缺陷检测装置,其包括用于加速具有足够高能量的电子束以通过样品透射并用于辐射加速电子束的电子枪的电子枪, 用于聚焦由所述电子枪产生的电子束的聚光透镜,用于偏转由所述聚光透镜聚焦的电子束的光束偏转线圈,用于将由所述光束偏转线圈偏转的电子束进一步聚焦到固定点上的物镜, XY台,用于将样品设置为与所述物镜相对,所述XY台可以在X和Y方向上以一个步骤和重复的方式移动,用于在XY真空中容纳XY台的样品室,所述样品室至少包括 所述物镜的电子束的出口,用于检测透过所述样品的电子束的电子束检测器 d电子束检测器固定到诸如所述腔室或透镜镜筒之类的静止构件上,以及缺陷检测装置,用于通过每个步骤使用所述光束偏转线圈扫描电子束,并重复所述XY平台的操作,用于比较视频信号 从所述电子束检测器获得从存储装置读出的参考图案,从而检测样品的缺陷。