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    • 32. 发明授权
    • Method for thin film deposition on single-crystal semiconductor substrates
    • 在单晶半导体衬底上薄膜沉积的方法
    • US06258637B1
    • 2001-07-10
    • US09452922
    • 1999-12-02
    • Glen D. WilkYi WeiRobert M. Wallace
    • Glen D. WilkYi WeiRobert M. Wallace
    • H01L2100
    • H01L21/02043H01L21/02046H01L21/02238H01L21/02255H01L21/02301H01L21/02312H01L21/02381H01L21/02532H01L21/0262H01L21/31662Y10S438/974
    • A method of preparing a surface for and forming a thin film on a single-crystal silicon substrate is disclosed. One embodiment of his method comprises forming an oxidized silicon layer (which may be a native oxide) on at least one region of the substrate, and thermally annealing the substrate in a vacuum while supplying a silicon-containing flux to the oxide surface, thus removing the oxidized silicon layer. Preferably, the thin film is formed immediately after removal of the oxidized silicon layer. The silicon-containing flux is preferably insufficient to deposit a silicon-containing layer on top of the oxidized silicon layer, and yet sufficient to substantially inhibit an SiO-forming reaction between the silicon substrate and the oxidized silicon layer. The method of the invention allows for growth or deposition of films which have exceptionally smooth interfaces (less than 0.1 nm rms roughness) with the underlying silicon substrate at temperatures less than 800° C., and is ideally suited for deposition of ultrathin films having thicknesses less than about 5 nm.
    • 公开了一种制备在单晶硅衬底上形成薄膜的表面的方法。 他的方法的一个实施方案包括在衬底的至少一个区域上形成氧化硅层(其可以是天然氧化物),并且在真空中对衬底进行热退火,同时向氧化物表面提供含硅助焊剂,从而除去 氧化硅层。 优选地,在去除氧化硅层之后立即形成薄膜。 含硅助焊剂优选不足以在氧化硅层的顶部上沉积含硅层,并且还足以基本上抑制硅衬底和氧化硅层之间的形成SiO的反应。 本发明的方法允许在低于800℃的温度下与底层硅衬底具有非常平滑的界面(小于0.1nm均方根粗糙度)的生长或沉积,并且理想地适用于沉积具有厚度的超薄膜 小于约5nm。
    • 37. 发明授权
    • Directed effusive beam atomic layer epitaxy system and method
    • 导向射流原子层外延系统及方法
    • US5316793A
    • 1994-05-31
    • US919685
    • 1992-07-27
    • Robert M. WallaceBruce E. Gnade
    • Robert M. WallaceBruce E. Gnade
    • B01J19/00C23C16/44C23C16/455C30B25/02C30B25/14H01L21/205C23C16/00
    • C23C16/45544C23C16/45517C30B25/14
    • A system and method for epitaxial growth of high purity materials on an atomic or molecular layer by layer basis wherein a substrate is placed in an evacuated chamber which is evacuated to a pressure of less than about 10.sup.-9 Torr and predetermined amounts of predetermined precursor gases are injected into the chamber from a location in the chamber closely adjacent the substrate to form the atomic or molecular layer at the surface of the substrate while maintaining the pressure at less than about 10.sup.-9 Torr in the chamber in regions thereof distant from the substrate. The precursor gases are provided from a plurality of tanks containing the precursor gases therein under predetermined pressure and predetermined ones of the tanks are opened to the chamber for predetermined time periods while maintaining the pressure in the tanks. A dose limiting structure is provided for directing predetermined amounts of the precursor gases principally at the substrate with a dose limiting directional structure.
    • 一种用于以原子或分子层为基础外延生长高纯度材料的系统和方法,其中将衬底放置在抽真空至小于约10-9乇的压力的预抽真空室中,并将预定量的预定前体气体 从与基板紧邻的室中的位置注入室中,以在基板的表面处形成原子层或分子层,同时在远离基板的区域中将室内的压力维持在小于约10-9乇 。 前体气体由预定压力下容纳其中的前体气体的多个容器提供,并且预定的这些罐在腔室中保持预定的时间段同时保持在罐中的压力。 提供了剂量限制结构,用于以剂量限制的方向结构主要在衬底上引导预定量的前体气体。
    • 39. 发明申请
    • SYNTHESIZING GRAPHENE FROM METAL-CARBON SOLUTIONS USING ION IMPLANTATION
    • 使用离子植入法合成来自金属碳解决方案的石墨
    • US20100224851A1
    • 2010-09-09
    • US12706116
    • 2010-02-16
    • Luigi ColomboRobert M. WallaceRodney S. Ruoff
    • Luigi ColomboRobert M. WallaceRodney S. Ruoff
    • H01L29/15C04B35/536H01L21/20
    • H01L21/02612H01L21/02527
    • A method and semiconductor device for synthesizing graphene using ion implantation of carbon. Carbon is implanted in a metal using ion implantation. After the carbon is distributed in the metal, the metal is annealed and cooled in order to precipitate the carbon from the metal to form a layer of graphene on the surface of the metal. The metal/graphene surface is then transferred to a dielectric layer in such a manner that the graphene layer is placed on top of the dielectric layer. The metal layer is then removed. Alternatively, recessed regions are patterned and etched in a dielectric layer located on a substrate. Metal is later formed in these recessed regions. Carbon is then implanted into the metal using ion implantation. The metal may then be annealed and cooled in order to precipitate the carbon from the metal to form a layer of graphene on the metal's surface.
    • 一种使用碳的离子注入合成石墨烯的方法和半导体器件。 使用离子注入将碳注入金属中。 在碳分布在金属中之后,对金属进行退火和冷却,以便从金属沉淀碳以在金属表面上形成一层石墨烯。 然后将金属/石墨烯表面转移到电介质层,使得石墨烯层被放置在电介质层的顶部上。 然后去除金属层。 或者,将凹陷区域图案化并蚀刻在位于基底上的电介质层中。 金属后来形成在这些凹陷区域。 然后使用离子注入将碳注入到金属中。 然后可以对金属进行退火和冷却,以便从金属沉淀碳以在金属表面上形成一层石墨烯。