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31. 发明申请

US20120205209A1 DRUM BRAKE TYPE PARKING BRAKE APPARATUS 审中-公开
标题翻译：鼓式刹车式制动器
公开(公告)号：US20120205209A1
公开(公告)日：2012-08-16
申请号：US13501823
申请日：2010-11-04
申请人： Haruo Tsuzuku , Hiroyasu Ishikawa , Hiroshi Ikegami , Hideki Kakizaki , Toshifumi Maehara
发明人： Haruo Tsuzuku , Hiroyasu Ishikawa , Hiroshi Ikegami , Hideki Kakizaki , Toshifumi Maehara
IPC分类号： F16D51/22 , F16D65/22 , B60T1/06
CPC分类号： F16D51/20 , F16D65/563 , F16D65/58 , F16D2121/02 , F16D2121/14 , F16D2121/24 , F16D2123/00 , F16D2125/48 , F16D2125/52 , F16D2125/565 , F16D2125/64 , F16D2125/68
摘要： A joining link, a strut, and first and second expansion levers constitute an expansion and contraction device. At the time of the braking, the proximal end portion of both of the expansion levers are mutually pressed from the opposite sides by first and second pressing members constituting a driving device. The reaction due to the braking is offset by the joining link portion, whereby a large force is not applied to the back plate or the like.
摘要翻译：连接杆，撑杆，第一和第二膨胀杆构成了伸缩装置。在制动时，通过构成驱动装置的第一和第二按压部件，两个膨胀杆的基端部从相对侧相互压紧。由于制动引起的反应由接合连接部分抵消，由此不会对后板等施加大的力。

32. 发明授权

US07975741B2 Pneumatic tire and producing method of pneumatic tire 有权
标题翻译：气动轮胎及充气轮胎的生产方法
公开(公告)号：US07975741B2
公开(公告)日：2011-07-12
申请号：US11379746
申请日：2006-04-21
申请人： Kazuma Nishitani , Shigeru Ohno , Hiroshi Ikegami , Koji Hiramatsu , Katsuhiro Nakatani
发明人： Kazuma Nishitani , Shigeru Ohno , Hiroshi Ikegami , Koji Hiramatsu , Katsuhiro Nakatani
IPC分类号： B60C13/00 , B29D30/72
CPC分类号： B60C13/00 , B29D30/30 , B29D30/72 , B60C2013/045
摘要： A sidewall rubber disposed outside of a carcass layer, reinforcing a portion between beads, in a widthwise direction of the tire is configured from a wide rubber ribbon having a width of 20 to 100 mm wound spirally along a circumferential direction of the tire outward of the tire such that the rubber ribbon is deviated radially outward of the tire.
摘要翻译：在轮胎宽度方向上设置在胎体层外侧的侧壁橡胶，其沿着轮胎的宽度方向加强胎圈之间的部分，由宽度为20〜100mm的宽度的橡胶带构成，沿着轮胎的周向螺旋地卷绕，轮胎使得橡胶带径向向外偏离轮胎。

33. 发明申请

US20100012259A1 PROCESS FOR PRODUCING TIRE 审中-公开
标题翻译：生产轮胎的工艺
公开(公告)号：US20100012259A1
公开(公告)日：2010-01-21
申请号：US12438973
申请日：2006-09-12
申请人： Mamoru Matsuoka , Hiroshi Ikegami
发明人： Mamoru Matsuoka , Hiroshi Ikegami
IPC分类号： B29D30/10
CPC分类号： B29D30/3021 , B29D30/3028
摘要： A process for producing a tire, in which a tire improved in qualities, such as uniformity and weight balance, is produced through inhibiting of rubber lumping under the influence of gravitational force at the time of initiation of rubber discharge. There is provided a process for producing a tire, comprising, while rotating forming drum (B), discharging strip rubber (S) of given sectional configuration by means of injection molding machine (A) and sequentially winding the discharged strip rubber (S) around the forming drum (B) to thereby attain forming of a tire configuration, wherein the strip rubber (S) discharged from the injection molding machine (A) is dropped in a vertical downward direction and wound around the surface of the forming drum (B), and wherein the position of dropping of the strip rubber (S) is set so as to fall within the range of rotation upward 45° to rotation downward 90° with respect to, as a baseline, the segment binding the uppermost point and the center of rotation of the forming drum (B).
摘要翻译：通过在开始橡胶排出时在重力的影响下抑制橡胶块而产生轮胎的制造方法，其中轮胎质量的提高，如均匀性和重量平衡。提供了一种轮胎的制造方法，其特征在于，在成形滚筒（B）的旋转的同时，通过注射成型机（A）排出具有给定截面形状的带状橡胶（S），并将排出的带状橡胶（S）成形鼓（B），从而形成轮胎结构，其中从注射成型机（A）排出的带状橡胶（S）沿垂直向下的方向下落并缠绕在成形滚筒（B）的表面上，并且其中，所述带状橡胶（S）的下落位置被设定为以相对于作为基准的上下方向旋转45°向下旋转90°的方式，将所述带状橡胶（S）（B）的旋转。

34. 发明申请

US20080050677A1 Processing method, manufacturing method of semiconductor device, and processing apparatus 审中-公开
标题翻译：半导体装置的加工方法，制造方法以及加工装置
公开(公告)号：US20080050677A1
公开(公告)日：2008-02-28
申请号：US11905976
申请日：2007-10-05
申请人： Tomoyuki Takeishi , Kenji Kawano , Hiroshi Ikegami , Shinichi Ito , Riichiro Takahashi
发明人： Tomoyuki Takeishi , Kenji Kawano , Hiroshi Ikegami , Shinichi Ito , Riichiro Takahashi
IPC分类号： G03C5/00
CPC分类号： H01L23/544 , B23K26/066 , B23K26/364 , B23K26/40 , B23K2103/172 , G03F7/2026 , G03F7/70341 , G03F9/7076 , G03F9/708 , G03F9/7084 , G21K5/10 , H01J2237/30438 , H01L2223/54453 , H01L2924/0002 , Y10S438/949 , H01L2924/00
摘要： A processing method for selectively reducing or removing the region to be exposed with energy ray in a film formed on a substrate, comprising relatively scanning a first exposure light whose shape on the substrate is smaller than the whole first region to be exposed against the whole first region to be exposed to selectively remove or reduce the first region to be exposed, and exposing a whole second region to be exposed inside the whole first region to be exposed with a second exposure light to selectively expose the whole second region to be exposed.
摘要翻译：一种处理方法，用于在形成在基板上的膜中选择性地减少或去除待曝光的区域，该方法包括相对地扫描基板上的形状比整个第一区域要暴露的整个第一区域的第一曝光灯区域，以选择性地去除或减少要暴露的第一区域，并且用第二曝光光将待暴露的整个第一区域暴露在整个第一区域内的整个第二区域，以选择性地暴露待暴露的整个第二区域。

35. 发明申请

US20050069815A1 Processing method and semiconductor manufacturing method 审中-公开
标题翻译：加工方法和半导体制造方法
公开(公告)号：US20050069815A1
公开(公告)日：2005-03-31
申请号：US10916414
申请日：2004-08-12
申请人： Tomoyuki Takeishi , Kenji Kawano , Hiroshi Ikegami , Shinichi Ito , Masami Watase
发明人： Tomoyuki Takeishi , Kenji Kawano , Hiroshi Ikegami , Shinichi Ito , Masami Watase
IPC分类号： B23K26/18 , B23K26/00 , B23K26/02 , B23K101/40 , G03F7/00 , H01L21/00 , H01L21/027 , H01L21/302 , H01L21/311 , H01L21/3205 , H01L21/3213 , H01L23/544
CPC分类号： H01L23/544 , H01L21/0275 , H01L21/0276 , H01L21/31144 , H01L21/32139 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： A processing method comprises forming a water-soluble protective film on a first film having a processing area above a substrate irradiating processing light on the processing area selectively with to selectively remove the first film in the processing area and the protective film on the processing area, and removing the protective film with water after the selective irradiating.
摘要翻译：一种处理方法包括在选择性地在处理区域上在基板上照射处理光的处理区域上的第一膜上形成水溶性保护膜，以选择性地去除处理区域中的第一膜和处理区域上的保护膜，并在选择性照射后用水除去保护膜。

36. 发明授权

US06709966B1 Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device 失效
标题翻译：半导体器件，其制造工艺，位置匹配标记，图案形成方法和图案形成装置
公开(公告)号：US06709966B1
公开(公告)日：2004-03-23
申请号：US09606152
申请日：2000-06-29
申请人： Yoshimi Hisatsune , Keiichi Sasaki , Hiroshi Ikegami , Mie Matsuo , Nobuo Hayasaka , Katsuya Okumura
发明人： Yoshimi Hisatsune , Keiichi Sasaki , Hiroshi Ikegami , Mie Matsuo , Nobuo Hayasaka , Katsuya Okumura
IPC分类号： H01L2144
CPC分类号： H01L24/81 , H01L21/6835 , H01L21/76877 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/11003 , H01L2224/1132 , H01L2224/1183 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/81121 , H01L2224/81136 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H05K3/207 , H05K3/4007 , H05K2201/0367 , H05K2201/083 , H05K2203/0113 , H05K2203/104 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： A semiconductor device comprising the bump containing magnetic body, magnetic body, the bump including non-magnetic body for at least partially covering the magnetic body, mixture of magnetic particles and non-magnetic particles and the bump including baked magnetic particles and baked non-magnetic particles.
摘要翻译：一种半导体器件，包括包括磁体的磁体，磁体，包括用于至少部分地覆盖磁体的非磁性体的凸起，磁性粒子和非磁性粒子的混合物以及包含焙烧磁性粒子的凸块和烘烤的非磁性体粒子。

37. 发明授权

US06566261B2 Semiconductor device and method of manufacturing the same 失效
公开(公告)号：US06566261B2
公开(公告)日：2003-05-20
申请号：US09946601
申请日：2001-09-06
申请人： Hiroshi Ikegami , Rempei Nakata , Takashi Yoda , Nobuo Hayasaka , Yoshimi Hisatsune
发明人： Hiroshi Ikegami , Rempei Nakata , Takashi Yoda , Nobuo Hayasaka , Yoshimi Hisatsune
IPC分类号： H01L2144
CPC分类号： H01L23/53238 , H01L21/0217 , H01L21/02274 , H01L21/02307 , H01L21/02315 , H01L21/3122 , H01L21/76838 , H01L24/11 , H01L2224/13099 , H01L2224/45144 , H01L2224/45147 , H01L2924/00011 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/12042 , H01L2924/19043 , H01L2924/30105 , Y10S438/959 , H01L2924/00 , H01L2924/01005 , H01L2924/01004 , H01L2924/00014
摘要： There is provided a semiconductor device including a semiconductor substrate and a conductive layer above the semiconductor substrate, wherein the conductive layer contains copper, a surface region of the conductive layer contains at least one of C—H bonds and C—C bonds, and a total amount of C atoms forming the C—H bonds and C atoms forming the C—C bonds in the surface region is 30 atomic % or more of a whole amount of elements in the surface region.

38. 发明授权

US06475285B2 Deposition apparatus 失效
标题翻译：沉积装置
公开(公告)号：US06475285B2
公开(公告)日：2002-11-05
申请号：US09817196
申请日：2001-03-27
申请人： Hiroshi Ikegami , Nobuo Hayasaka , Shinichi Ito , Katsuya Okumura
发明人： Hiroshi Ikegami , Nobuo Hayasaka , Shinichi Ito , Katsuya Okumura
IPC分类号： C23C1600
CPC分类号： B05C5/005
摘要： A deposition apparatus includes a chemical discharging nozzle for continuously discharging chemicals to a substrate to be processed, a gas spraying section arranged below the chemical discharging nozzle, for spraying gas on the chemicals discharged from the chemical discharging nozzle and changing an orbit of the chemicals by pressure of the gas, a chemical collecting section for collecting the chemicals the orbit of which is changed by the gas spraying section, the chemical collecting section being arranged so as to interpose the chemicals between the gas spraying section and the chemical collecting section, and a moving section for moving the chemical discharging nozzle and the substrate relatively with each other. The gas spraying section includes a laser oscillator for emitting a laser beam, and a gas generating film that generates the gas when heated and gasified by the laser beam emitted from the laser oscillator.
摘要翻译：沉积设备包括用于将化学品连续地排放到待处理基板的化学物质排放喷嘴，设置在化学物质排放喷嘴下方的气体喷射部分，用于将化学物质排出喷嘴上排出的化学物质喷射并改变化学品的轨道气体的压力，用于收集由气体喷射部分改变其轨道的化学物质的化学收集部分，化学收集部分布置成将气体喷射部分和化学收集部分之间的化学物质介入，使所述化学物质排出喷嘴和所述基板彼此相对移动的移动部。气体喷射部分包括用于发射激光束的激光振荡器，以及当由激光振荡器发射的激光束被加热和气化时产生气体的气体发生膜。

39. 发明授权

US5813936A Driving force controller in vehicle for forcibly upshifting in response to a driving force traction controller and a vehicle stopped detection means 失效
标题翻译：响应于驱动力牵引控制器和车辆停止检测装置强制升档车辆中的驱动力控制器
公开(公告)号：US5813936A
公开(公告)日：1998-09-29
申请号：US818065
申请日：1997-03-14
申请人： Yutaka Kichima , Shinichi Inagawa , Hiroshi Ikegami
发明人： Yutaka Kichima , Shinichi Inagawa , Hiroshi Ikegami
IPC分类号： B60K28/16 , B60W10/04 , B60W10/06 , B60W10/10 , B60W10/11 , F02D29/02 , F16H59/50 , F16H61/02 , F16H63/50
CPC分类号： B60K28/165 , F02D29/02 , B60W2550/148 , F16H2059/506 , F16H61/0213 , Y10T477/65
摘要： A driving-force controller in a vehicle in which, when an accelerator pedal is depressed to initially move the vehicle at a time t.sub.1, if a state in which a vehicle speed is zero due to slippage of driven wheels continues for a predetermined time, it is judged that the vehicle is on a road surface having an extremely low road surface friction coefficient. If a driven wheel speed and the vehicle speed become zero at a time t.sub.4 because a driver abandons initial acceleration and releases an accelerator pedal, a gear shift stage of an automatic transmission is forcibly shifted to a second gear shift stage, and a target slip rate set in a traction control device is switched to a decreased value. As a result, when the driver depresses the accelerator pedal to restart the vehicle at a time t.sub.5, excessive slippage is suppressed by a decrease in driven wheel torque so that the vehicle begins moving smoothly. If a driven wheel slip rate exceeds the decreased target slip rate at a time t.sub.6, engine power output is immediately decreased by the traction control to further effectively suppress excessive slippage.
摘要翻译：一种车辆的驱动力控制装置，其中，当加速踏板被压下以在时间t1初始移动车辆时，如果由于从动轮的滑动导致车速为零的状态持续预定时间，则判断车辆处于具有极低路面摩擦系数的路面上。如果由于驾驶员放弃初始加速并释放加速踏板而在时间t4从动轮速度和车速变为零，则将自动变速器的变速级强制转移到第二档位，并且目标滑移率设置在牵引力控制装置中的值被切换到减小的值。结果，当驾驶员在时间t5下压加速器踏板以重新起动车辆时，由于驱动轮转矩的降低而抑制了过度的滑动，使得车辆开始平稳地移动。如果在时刻t6的从动轮滑移率超过降低的目标滑移率，则通过牵引力控制立即降低发动机功率输出，以进一步有效地抑制过大的滑动。

40. 发明授权

US5497817A Method for continuously annealing steel strip 失效
标题翻译：钢带连续退火方法
公开(公告)号：US5497817A
公开(公告)日：1996-03-12
申请号：US369340
申请日：1995-01-06
申请人： Hiroshi Ikegami
发明人： Hiroshi Ikegami
IPC分类号： C21D9/56 , C21D11/00
CPC分类号： C21D9/563
摘要： In an apparatus for continuously annealing a steel strip after cold rolling, stable operation of the annealing apparatus can be obtained by preventing slippage of bridle rolls and hearth rolls. The diameter D of a bridle roll is set so that a surface pressure p defined by an equation p=h(.sigma..sub.1 +.sigma..sub.2)/D can be 10 kPa (kilopascal) or more, wherein the unit tension of a steel strip at the inlet side of the bridle roll and hearth rolls of the apparatus is .sigma..sub.1, the unit tension at the outlet side is .sigma..sub.2, the thickness of the steel strip is h and the diameter of the bridle roll is D.
摘要翻译：在冷轧后对钢带进行连续退火的装置中，可以通过防止搓纸辊和炉膛辊的滑动而获得退火装置的稳定操作。设定张力辊的直径D，使得由等式p = h（σ1+ sigma2）/ D定义的表面压力p可以为10kPa（千帕）以上，其中钢带的单位张力在设备的le辊和炉床辊的入口侧为σ1，出口侧的单位张力为σ2，钢带的厚度为h，le辊的直径为D.

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