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    • 35. 发明授权
    • Multiple patterning layout decomposition for ease of conflict removal
    • 多重图案化布局分解,便于冲突删除
    • US08516403B2
    • 2013-08-20
    • US13223844
    • 2011-09-01
    • Rani S. Abou GhaidaKanak B. AgarwalLars W. LiebmannSani R. Nassif
    • Rani S. Abou GhaidaKanak B. AgarwalLars W. LiebmannSani R. Nassif
    • G06F17/50
    • G06F17/5068
    • A mechanism is provided for multiple patterning lithography with conflict removal aware coloring. The mechanism makes multiple patterning coloring aware of the conflict removal overhead. The coloring solution explicitly considers ease of conflict removal as one of the coloring objectives. The mechanism pre-computes how much shapes can move in each direction. The mechanism generates a conflict graph where nodes represent shapes in the layout and edges represent conflicts between shapes. The mechanism assigns weights to edges based on available spatial slack between conflicting features. The mechanism then uses the weights to guide multiple patterning coloring. The mechanism prioritizes conflicting features with higher weights to be assigned different colors.
    • 提供了一种用于具有冲突消除意识着色的多重图案化光刻的机构。 该机制使得多个图案化着色意识到冲突移除开销。 着色解决方案明确地将冲突移除的容易性作为着色目标之一。 该机制预先计算出每个方向上可以移动多少形状。 该机制生成一个冲突图,其中节点表示布局中的形状,边缘表示形状之间的冲突。 该机制基于冲突特征之间的可用空间松弛来为边缘分配权重。 该机构然后使用重量来引导多个图案化着色。 该机制优先处理具有较高权重的冲突特征,以分配不同的颜色。
    • 36. 发明授权
    • Placement and optimization of process dummy cells
    • 过程虚拟细胞的放置和优化
    • US08225255B2
    • 2012-07-17
    • US12124472
    • 2008-05-21
    • Xu OuyangGeng HanLars W. Liebmann
    • Xu OuyangGeng HanLars W. Liebmann
    • G06F17/50
    • G11C29/24G06F2217/12G11C5/02H01L27/0203H01L27/105Y02P90/265
    • A method for laying out process dummy cells in relationship to inside memory cells of a memory array includes (a) calculating an initial process performance parameter for the memory array; (b) changing dummy cell layout configuration for a layer electrically connected to inside cells; (c) applying lithographic simulation and yield model for both the inside memory cells and the changed layout configuration process dummy cells; and (d) repeating steps (b) and (c) until yield is maximized. Checks may be performed to ensure that there is enough room to make the change and that there is no significant adverse effect to neighboring circuits. The process performance parameter may be yield or a process window for the inside memory cells.
    • 与存储器阵列的内部存储单元相关地布置处理虚设单元的方法包括:(a)计算存储器阵列的初始处理性能参数; (b)改变电连接到内部单元的层的虚拟单元布局配置; (c)为内部存储单元和改变的布局配置处理虚拟单元应用光刻模拟和屈服模型; 和(d)重复步骤(b)和(c),直到产率最大化。 可以进行检查,以确保有足够的空间进行更改,并且对相邻电路没有明显的不利影响。 过程性能参数可以是产量或内部存储器单元的处理窗口。
    • 37. 发明授权
    • Electrically-driven optical proximity correction to compensate for non-optical effects
    • 电动光学接近校正补偿非光学效果
    • US08103983B2
    • 2012-01-24
    • US12269477
    • 2008-11-12
    • Kanak B. AgarwalShayak BanerjeePraveen ElakkumananLars W. Liebmann
    • Kanak B. AgarwalShayak BanerjeePraveen ElakkumananLars W. Liebmann
    • G06F17/50
    • G06F17/5081G03F1/36G06F2217/10
    • A contour of a mask design for an integrated circuit is modified to compensate for systematic variations arising from non-optical effects such as stress, well proximity, rapid thermal anneal, or spacer thickness. Electrical characteristics of a simulated integrated circuit chip fabricated using the mask design are extracted and compared to design specifications, and one or more edges of the contour are adjusted to reduce the systematic variation until the electrical characteristic is within specification. The particular electrical characteristic preferably depends on which layer is to be fabricated from the mask: on-current for a polysilicon; resistance for contact; resistance and capacitance for metal; current for active; and resistance for vias. For systematic threshold voltage variation, the contour is adjusted to match a gate length which corresponds to an on-current value according to pre-calculated curves for contour current and gate length at a nominal threshold voltage of the chip.
    • 改进了用于集成电路的掩模设计的轮廓,以补偿由非光学效应(例如应力,阱接近度,快速热退火或间隔物厚度)引起的系统变化。 提取使用掩模设计制造的模拟集成电路芯片的电气特性,并将其与设计规范进行比较,并调整轮廓的一个或多个边缘以减少系统变化,直到电气特性在规格范围内。 特定的电特性优选地取决于由掩模制成的层:多晶硅的导通电流; 接触阻力; 金属电阻和电容; 当前活跃; 和通孔阻力。 对于系统阈值电压变化,调整轮廓以根据芯片的标称阈值电压下的轮廓电流和栅极长度的预先计算的曲线来匹配对应于导通电流值的栅极长度。
    • 38. 发明申请
    • ELECTRICALLY-DRIVEN OPTICAL PROXIMITY CORRECTION TO COMPENSATE FOR NON-OPTICAL EFFECTS
    • 电动驱动光学近似校正补偿非光学效应
    • US20100122231A1
    • 2010-05-13
    • US12269477
    • 2008-11-12
    • Kanak B. AgarwalShayak BanerjeePraveen ElakkumananLars W. Liebmann
    • Kanak B. AgarwalShayak BanerjeePraveen ElakkumananLars W. Liebmann
    • G06F17/50
    • G06F17/5081G03F1/36G06F2217/10
    • A contour of a mask design for an integrated circuit is modified to compensate for systematic variations arising from non-optical effects such as stress, well proximity, rapid thermal anneal, or spacer thickness. Electrical characteristics of a simulated integrated circuit chip fabricated using the mask design are extracted and compared to design specifications, and one or more edges of the contour are adjusted to reduce the systematic variation until the electrical characteristic is within specification. The particular electrical characteristic preferably depends on which layer is to be fabricated from the mask: on-current for a polysilicon; resistance for contact; resistance and capacitance for metal; current for active; and resistance for vias. For systematic threshold voltage variation, the contour is adjusted to match a gate length which corresponds to an on-current value according to pre-calculated curves for contour current and gate length at a nominal threshold voltage of the chip.
    • 改进了用于集成电路的掩模设计的轮廓,以补偿由非光学效应(例如应力,阱接近度,快速热退火或间隔物厚度)引起的系统变化。 提取使用掩模设计制造的模拟集成电路芯片的电气特性,并将其与设计规范进行比较,并调整轮廓的一个或多个边缘以减少系统变化,直到电气特性在规格范围内。 特定的电特性优选地取决于由掩模制成的层:多晶硅的导通电流; 接触阻力; 金属电阻和电容; 当前活跃; 和通孔阻力。 对于系统阈值电压变化,调整轮廓以根据芯片的标称阈值电压下的轮廓电流和栅极长度的预先计算的曲线来匹配对应于导通电流值的栅极长度。