专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US08877879B2 Apparatus for producing methacrylic polymer and production method thereof 有权
标题翻译：甲基丙烯酸系聚合物的制造装置及其制造方法
公开(公告)号：US08877879B2
公开(公告)日：2014-11-04
申请号：US13639668
申请日：2011-04-04
申请人： Masahiro Hayashida , Hisaaki Yoshimura , Daisuke Nonaka , Yusuke Morita , Mitsuhiro Matsuo
发明人： Masahiro Hayashida , Hisaaki Yoshimura , Daisuke Nonaka , Yusuke Morita , Mitsuhiro Matsuo
IPC分类号： C08F2/01 , C08F20/02 , B01J19/24 , B01J19/00 , C08F2/00 , B01J19/18 , C08F220/18
CPC分类号： C08F2/01 , B01J19/0066 , B01J19/1806 , B01J19/242 , B01J2219/0004 , B01J2219/00094 , C08F2/001 , C08F220/18
摘要： Disclosed is an apparatus for producing a high-quality methacrylic polymer with good productivity, comprising a complete mixing type reactor 11, tubular reactors 12 and 13 which have been serially connected, and a volatile removing instrument 14, wherein at least two of the tubular reactors 12 and 13 are connected via a cooler 15 for cooling the reaction mixture. It is preferable that the cooler 15 is a multitubular cooler and the tubular reactors 12 and 13 are plug flow reactors.
摘要翻译：公开了一种用于生产高质量甲基丙烯酸聚合物的装置，其具有良好的生产率，包括已经串联连接的完全混合型反应器11，管状反应器12和13以及挥发性去除装置14，其中至少两个管式反应器 12和13通过冷却器15连接，用于冷却反应混合物。优选地，冷却器15是多管冷却器，并且管式反应器12和13是活塞流反应器。

32. 发明申请

US20070180270A1 Encryption/decryption device, communication controller, and electronic instrument 审中-公开
标题翻译：加密/解密设备，通信控制器和电子仪器
公开(公告)号：US20070180270A1
公开(公告)日：2007-08-02
申请号：US11345386
申请日：2006-02-02
申请人： Tomonori Kumagai , Nobuyuki Saito , Mitsuhiro Matsuo
发明人： Tomonori Kumagai , Nobuyuki Saito , Mitsuhiro Matsuo
IPC分类号： G06F12/14
CPC分类号： G06F21/73 , G06F21/72 , G06F21/85 , G06F2221/2129 , H04L63/0464 , H04L63/08
摘要： An encryption/decryption device includes a storage section which stores input data and output data, a first encryption/decryption processing section which performs first encryption and decryption processing, and a second encryption/decryption processing section which performs second encryption and decryption processing. The encryption/decryption device stores decrypted data obtained by causing one of the first and second encryption/decryption processing sections to perform the first or second decryption processing for the input data in the storage section. The encryption/decryption device stores data obtained by causing the other of the first and second encryption/decryption processing sections to perform the first or second encryption processing for the decrypted data in the storage section as the output data. The storage area of the storage section for the decrypted data is configured to be inaccessible from the outside of the encryption/decryption device.
摘要翻译：加密/解密装置包括存储输入数据和输出数据的存储部分，执行第一加密和解密处理的第一加密/解密处理部分，以及执行第二加密和解密处理的第二加密/解密处理部分。加密/解密装置存储通过使第一和第二加密/解密处理部中的一个对存储部中的输入数据执行第一或第二解密处理而获得的解密数据。加密/解密装置存储通过使第一和第二加密/解密处理部分中的另一个对存储部分中的解密数据执行第一或第二加密处理而获得的数据作为输出数据。用于解密数据的存储部分的存储区域被配置为从加密/解密设备的外部不可访问。

33. 发明申请

US20060188098A1 Encryption/decryption device, communication controller, and electronic instrument 审中-公开
标题翻译：加密/解密设备，通信控制器和电子仪器
公开(公告)号：US20060188098A1
公开(公告)日：2006-08-24
申请号：US11355999
申请日：2006-02-17
申请人： Tomonori Kumagai , Nobuyuki Saito , Mitsuhiro Matsuo
发明人： Tomonori Kumagai , Nobuyuki Saito , Mitsuhiro Matsuo
IPC分类号： H04N7/167
CPC分类号： H04L9/0637 , H04L2209/60
摘要： An encryption/decryption device includes an encryption/decryption processing section which performs encryption or decryption processing for divided data of first and second content data in an operation mode of a block cipher method using data in a block other than a block under processing, and an intermediate value storage section which stores a processing result or an input value of the encryption/decryption processing section in content units. After the processing result or the input value of the encryption/decryption processing section for one of the divided data of the second content data has been stored in the intermediate value storage section, the processing result or the input value for the Kth divided data of the first content data is read from the intermediate value storage section, and the encryption/decryption processing section performs the encryption or decryption processing for the (K+1)th divided data of the first content data by using the processing result or the input value.
摘要翻译：一种加密/解密装置包括：加密/解密处理部分，其使用在处理中的块以外的块中的数据的块密码方法的操作模式中对第一和第二内容数据的划分数据执行加密或解密处理，中间值存储部，其以内容单位存储加密/解密处理部的处理结果或输入值。在第二内容数据的划分数据之一的处理结果或加密/解密处理部分的输入值已被存储在中间值存储部分中之后，处理结果或第K个分割数据的输入值从中间值存储部分读取第一内容数据，并且加密/解密处理部分通过使用处理结果或输入值来执行第一内容数据的第（K + 1）个划分数据的加密或解密处理。

34. 发明授权

US06860004B2 Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink 有权
标题翻译：制造具有连接到散热器的接地图案的导热电路板的方法
公开(公告)号：US06860004B2
公开(公告)日：2005-03-01
申请号：US10309707
申请日：2002-12-03
申请人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
发明人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
IPC分类号： C08J5/18 , B29C43/18 , C08K3/00 , C08L101/00 , H01L23/373 , H01L23/433 , H01L23/498 , H01L23/50 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/20 , H05K3/40 , H05K7/20 , H05K3/30
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： In a method of manufacturing a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection, a sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. The method provides that a part of a lead frame and heat sink are connected not only mechanically, but also electrically, and allows an associated power module size to be reduced and its density to be increased.
摘要翻译：在具有高散热，高导电性和高接地连接的导热电路板的制造方法中，含有70〜95重量份的片状导热性树脂组合物，％无机填料和5〜30wt。热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。该方法提供引线框架和散热器的一部分不仅机械地而且电连接，并且允许相关联的功率模块尺寸减小并且其密度增加。

35. 发明授权

US06700182B2 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module 失效
标题翻译：导热基板，导热基板的制造方法和电源模块
公开(公告)号：US06700182B2
公开(公告)日：2004-03-02
申请号：US09870684
申请日：2001-06-01
申请人： Yoshihisa Yamashita , Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo
发明人： Yoshihisa Yamashita , Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo
IPC分类号： H01L23495
CPC分类号： H05K1/0256 , H01L23/367 , H01L23/498 , H01L23/49861 , H01L23/60 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , H05K2201/0355 , H05K2201/09145 , H01L2924/00
摘要： By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator sheet inside of the insulator sheet in a plane direction of the insulator sheet, it is possible to secure a creeping distance between the lead frame and the radiation plate without decreasing a lead frame area on which components can be actually mounted.
摘要翻译：通过设置位于绝缘片的端部和靠近引线框架延伸的绝缘片的端部上的辐射板的端部，在离开绝缘片的端部的位置远离绝缘体片的端部的位置处，绝缘体片材，可以确保引线框架和辐射板之间的蠕变距离，而不会减少可实际安装部件的引线框区域。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式