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31. 发明授权

US08567756B2 Slit valve door able to compensate for chamber deflection 有权
标题翻译：狭缝阀门能够补偿室偏转
公开(公告)号：US08567756B2
公开(公告)日：2013-10-29
申请号：US12548553
申请日：2009-08-27
申请人： Mehran Behdjat , Shinichi Kurita , John M. White , Suhail Anwar , Makoto Inagawa
发明人： Mehran Behdjat , Shinichi Kurita , John M. White , Suhail Anwar , Makoto Inagawa
IPC分类号： F16K25/00
CPC分类号： H01L21/67201 , F16K15/147 , F16K51/02 , H01L21/67126
摘要： Embodiments disclosed herein generally relate to a slit valve door assembly for sealing an opening in a chamber. A slit valve door that is pressed against the chamber to seal the slit valve opening moves with the chamber as the slit valve opening shrinks so that an o-ring pressed between the slit valve door and the chamber may move with the slit valve door and the chamber. Thus, less rubbing of the o-ring against the chamber may occur. With less rubbing, fewer particles may be generated and the o-ring lifetime may be extended. With a longer lifetime for the o-ring, substrate throughput may be increased.
摘要翻译：本文公开的实施例通常涉及用于密封腔室中的开口的狭缝阀门组件。当狭缝阀开口收缩时，被压靠在腔室上以密封狭缝阀开口的狭缝阀门随着腔室移动，使得压紧在狭缝阀门和腔室之间的O形环可以与狭缝阀门一起移动，并且房间。因此，可能会发生O形环相对于室的摩擦较少。随着摩擦的减少，可能产生更少的颗粒，并且可以延长O形环的寿命。随着O形圈的寿命更长，衬底产量可能会增加。

32. 发明授权

US07973546B2 In-line electron beam test system 有权
标题翻译：在线电子束测试系统
公开(公告)号：US07973546B2
公开(公告)日：2011-07-05
申请号：US12826635
申请日：2010-06-29
申请人： Fayez E. Abboud , Sriram Krishnaswami , Benjamin M. Johnston , Hung T. Nguyen , Matthias Brunner , Ralf Schmid , John M. White , Shinichi Kurita , James C. Hunter
发明人： Fayez E. Abboud , Sriram Krishnaswami , Benjamin M. Johnston , Hung T. Nguyen , Matthias Brunner , Ralf Schmid , John M. White , Shinichi Kurita , James C. Hunter
IPC分类号： G01R31/302 , G01R31/305
CPC分类号： H01L21/67748 , H01J2237/2811 , H01J2237/2817 , H01L21/67201 , H01L21/67236
摘要： A method for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the method includes transferring a substrate on an end effector relative to a testing platform having a plurality of testing columns coupled thereto, the substrate having a plurality of electronic devices located thereon, and moving the substrate in a single directional axis relative to an optical axis of each of the plurality of testing columns, the single directional axis being substantially orthogonal to the optical axis to define a test area on the substrate, wherein the test area is configured to cover an entire length or an entire width of the substrate such that the testing columns are capable of testing the entire substrate as the substrate is moved through the test area.
摘要翻译：描述了用于测试形成在大面积基板上的多个电子设备的方法。在一个实施例中，所述方法包括相对于具有耦合到其上的多个测试柱的测试平台在端部执行器上传送衬底，所述衬底具有位于其上的多个电子器件，并且相对于所述多个测试列中的每一个的光轴，所述单方向轴基本上垂直于所述光轴，以在所述衬底上限定测试区域，其中所述测试区域被配置为覆盖所述衬底的整个长度或整个宽度使得当衬底移动通过测试区域时，测试柱能够测试整个衬底。

33. 发明申请

US20110146577A1 SHOWERHEAD WITH INSULATED CORNER REGIONS 审中-公开
标题翻译：具有绝缘角区域的淋浴
公开(公告)号：US20110146577A1
公开(公告)日：2011-06-23
申请号：US12975708
申请日：2010-12-22
申请人： SUHAIL ANWAR , John M. White , Soo Young Choi , Gaku Furuta , Shinichi Kurita , Carl Sorenson , Robin L. Tiner
发明人： SUHAIL ANWAR , John M. White , Soo Young Choi , Gaku Furuta , Shinichi Kurita , Carl Sorenson , Robin L. Tiner
IPC分类号： C23C16/455 , C23C16/458 , C23C16/50 , B05B1/14
CPC分类号： C23C16/4585 , C23C16/45565 , C23C16/5096 , H01J37/32174 , H01J37/32449 , H01J37/32541 , H01J37/3255
摘要： Embodiments of the present invention generally relate to a gas distribution showerhead having insulated corner regions to reduce arcing and improve deposition uniformity control. In one embodiment, the gas distribution showerhead is formed of a conductive material with material from the corner regions removed. Corner members formed substantially in the shape of the removed portion of corner regions are attached to the conductive showerhead. The corner members may be made of a material having electrical insulating properties, such as a ceramic or insulating polymer.
摘要翻译：本发明的实施方案一般涉及具有绝缘拐角区域以减少电弧放电并改善沉积均匀性控制的气体分配喷头。在一个实施例中，气体分配喷头由导电材料形成，其中去除了角部区域的材料。基本上形成角部区域的去除部分形状的角部件被附接到导电花洒。角部件可以由具有电绝缘性的材料制成，例如陶瓷或绝缘聚合物。

34. 发明授权

US07845891B2 Decoupled chamber body 有权
标题翻译：解耦室体
公开(公告)号：US07845891B2
公开(公告)日：2010-12-07
申请号：US11332781
申请日：2006-01-13
申请人： Jae-Chull Lee , Shinichi Kurita , John M. White , Suhail Anwar
发明人： Jae-Chull Lee , Shinichi Kurita , John M. White , Suhail Anwar
IPC分类号： H01L21/677
CPC分类号： H01L21/67201 , Y10S414/139
摘要： Embodiments of the invention include a chamber body having at least one of a top or bottom decoupled from the sidewalls of the chamber body. The invention is suitable for use as a load lock chamber, substrate transfer chamber and vacuum processing chambers, among others.
摘要翻译：本发明的实施例包括室主体，其具有从腔体的侧壁分离的顶部或底部中的至少一个。本发明适用于负载锁定室，基板传送室和真空处理室等。

35. 发明申请

US20100196626A1 GROUND RETURN FOR PLASMA PROCESSES 有权
标题翻译：等离子体工艺的接地返回
公开(公告)号：US20100196626A1
公开(公告)日：2010-08-05
申请号：US12700484
申请日：2010-02-04
申请人： Soo Young Choi , Robin L. Tiner , Shinichi Kurita , John M. White , Carl A. Sorensen , Jeffrey A. Kho , Suhail Anwar , Makoto Inagawa , Gaku Furuta
发明人： Soo Young Choi , Robin L. Tiner , Shinichi Kurita , John M. White , Carl A. Sorensen , Jeffrey A. Kho , Suhail Anwar , Makoto Inagawa , Gaku Furuta
IPC分类号： C23C16/509
CPC分类号： C23C16/5096 , C23C16/4585 , H01J37/32091 , H01J37/32174 , H01J37/32568 , H01L21/67069
摘要： A method and apparatus for providing an electrically symmetrical ground or return path for electrical current between two electrodes is described. The apparatus includes at least on radio frequency (RF) device coupled to one of the electrodes and between a sidewall and/or a bottom of a processing chamber. The method includes moving one electrode relative to another and realizing a ground return path based on the position of the displaced electrode using one or both of a RF device coupled to a sidewall and the electrode, a RF device coupled to a bottom of the chamber and the electrode, or a combination thereof.
摘要翻译：描述了一种用于提供用于两个电极之间的电流的电对称接地或返回路径的方法和装置。该装置至少包括耦合到电极之一和处理室的侧壁和/或底部之间的射频（RF）装置。该方法包括相对于另一个电极移动一个电极，并且基于使用耦合到侧壁和电极的RF器件中的一个或两个的位移电极实现接地返回路径，耦合到腔室的底部的RF器件和电极或其组合。

36. 发明申请

US20080291228A1 METHODS AND APPARATUS FOR INKJET PRINTING WITH MULTIPLE ROWS OF PRINT HEADS 审中-公开
标题翻译：用于打印头多个打印头的方法和装置
公开(公告)号：US20080291228A1
公开(公告)日：2008-11-27
申请号：US11751231
申请日：2007-05-21
申请人： JOHN M. WHITE , Fan-Cheung Sze , Quanyuan Shang , Shinichi Kurita , Hongbin Ji , Janusz Jozwiak , Inchen Huang , Emanuel Beer
发明人： JOHN M. WHITE , Fan-Cheung Sze , Quanyuan Shang , Shinichi Kurita , Hongbin Ji , Janusz Jozwiak , Inchen Huang , Emanuel Beer
IPC分类号： B41J29/38 , B41J2/145
CPC分类号： B41J2/145 , B41J2/515 , B41J25/003 , B41J2202/09 , H01L51/0005
摘要： According to the present invention, multiple rows of nozzles within a print head may be arranged proximal to and offset from each other to facilitate inkjet printing. Print heads may comprise a single row of nozzles or may comprise a plurality of rows of nozzles. Each row of nozzles may be situated such that the immediately adjacent row of nozzles may be offset by a predetermined distance. In some embodiments, adjacent rows of nozzles may each print with the same color. In this way, adjacent offset rows of nozzles may be used in combination to dispense ink drops into sub-pixel wells in improved patterns and with improved ink distribution within the sub-pixel well. These offset print techniques may also enable tighter grouping of ink drops within a sub-pixel well and enable faster printing operations.
摘要翻译：根据本发明，打印头内的多排喷嘴可以布置成彼此靠近并且彼此偏离，以便于喷墨打印。打印头可以包括单排喷嘴，或者可以包括多排喷嘴。每排喷嘴可以被定位成使得紧邻的喷嘴排可以偏移预定距离。在一些实施例中，相邻排的喷嘴可以以相同的颜色打印。以这种方式，相邻的喷嘴排可以组合使用，以将墨滴以改进的图案分配到子像素阱中，并且改进子像素阱内的油墨分布。这些偏移打印技术还可以使得子像素内的墨滴更紧密地分组并且能够实现更快的打印操作。

37. 发明申请

US20080268173A1 PECVD PROCESS CHAMBER BACKING PLATE REINFORCEMENT 有权
标题翻译： PECVD过程室背板加固
公开(公告)号：US20080268173A1
公开(公告)日：2008-10-30
申请号：US12037885
申请日：2008-02-26
申请人： John M. White , Shinichi Kurita , Robin L. Tiner
发明人： John M. White , Shinichi Kurita , Robin L. Tiner
IPC分类号： H05H1/34
CPC分类号： H01J37/32449 , C23C16/44 , C23C16/5096 , H01J37/3244 , H01J37/32495 , H01J37/32623 , H01J2237/3321 , H01J2237/3325
摘要： The present invention generally comprises a backing plate reinforcement apparatus for use in a plasma enhanced chemical vapor deposition apparatus. When processing large area substrates, the backing plate extending across the chamber may also be quite large. By supporting a central area of the backing plate with a frame structure, the backing plate may be maintained substantially planar. Alternatively, as necessary, the contour of the backing plate may be adjusted to suit the particular needs of the process.
摘要翻译：本发明通常包括用于等离子体增强化学气相沉积设备中的背板加强装置。当处理大面积基板时，延伸穿过室的背板也可能相当大。通过用框架结构支撑背板的中心区域，背板可以保持基本上平面。或者，根据需要，可以调整背板的轮廓以适应该方法的特定需要。

38. 发明授权

US06746198B2 Substrate transfer shuttle 失效
标题翻译：基材转运班车
公开(公告)号：US06746198B2
公开(公告)日：2004-06-08
申请号：US09881009
申请日：2001-06-13
申请人： John M. White , Norman L. Turner , Robin L. Tiner , Ernst Keller , Shinichi Kurita , Wendell T. Blonigan , David E. Berkstresser
发明人： John M. White , Norman L. Turner , Robin L. Tiner , Ernst Keller , Shinichi Kurita , Wendell T. Blonigan , David E. Berkstresser
IPC分类号： B65G4907
CPC分类号： H01L21/67748 , C03B25/08 , C03B29/08 , C03B35/142 , C03B35/202 , C03B2225/02 , C03C17/002 , F27D3/00 , F27D5/00 , H01L21/67173 , H01L21/67236 , Y02P40/57 , Y10S414/135 , Y10S414/139
摘要： The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is moveable along a linear path defined by guide rollers between one position in the first chamber and another position in the second chamber. In this way, the substrate may be transferred, in both a forward and a reverse direction, between the first chamber and the second chamber. The substrate transfer shuttle is structured so that a substrate may be removed therefrom by moving a support in one of the chambers from a lowered position to an intermediate position, after which the substrate transfer shuttle may be removed from the chamber.
摘要翻译：本发明提供了一种用于基板输送的装置和方法。在根据本发明的系统中，提供至少第一和第二腔室。第一室可以是装载锁，第二室是处理室。提供基板传送梭，并且可沿着由第一室中的一个位置和第二室中的另一位置之间的导辊限定的线性路径移动。以这种方式，可以在第一室和第二室之间沿正向和反向的方向转移衬底。衬底传送穿梭被构造成使得可以通过将其中一个室中的支撑件从降低位置移动到中间位置而从其中移除基板，之后可以从室移除基板传送梭。

39. 发明授权

US06176668B1 In-situ substrate transfer shuttle 失效
标题翻译：原位底物转运梭
公开(公告)号：US06176668B1
公开(公告)日：2001-01-23
申请号：US09082488
申请日：1998-05-20
申请人： Shinichi Kurita , John M. White
发明人： Shinichi Kurita , John M. White
IPC分类号： B65G4907
CPC分类号： H01L21/67748 , Y10S414/139
摘要： The present invention provides an apparatus and method for sequential deposition of regular series of layers on consecutive substrates in a modular assembly-line like system. The apparatus and method are especially used processing large glass or metal substrates such as are employed in solar panels. The apparatus includes a load lock chamber and a processing chamber coupled to the load lock chamber. Both the load lock chamber and the processing chamber include a platen to support the substrate. Each platen includes slots therein. A substrate transfer shuttle is provided which is moveable along a shuttle path between one position in the load lock chamber and another position in the processing chamber for transferring the substrate between the load lock chamber and the processing chamber. The shuttle may be moved below the level of the platen and may be maintained in the processing chamber during processing.
摘要翻译：本发明提供了一种用于在模块化装配线状系统中在连续基板上顺序沉积规则系列层的装置和方法。该装置和方法特别用于处理太阳能电池板中使用的大型玻璃或金属基板。该装置包括负载锁定室和联接到负载锁定室的处理室。负载锁定室和处理室都包括支撑基板的压板。每个压板包括槽。提供了一种基板传送梭，其能够沿着穿过加载锁定室中的一个位置和处理室中的另一个位置之间的穿梭路径移动，用于在载荷锁定室和处理室之间传送基板。梭子可以移动到压板的水平面以下并且可以在处理期间保持在处理室中。

40. 发明授权

US09200368B2 Plasma uniformity control by gas diffuser hole design 有权
标题翻译：通过气体扩散器孔设计的等离子体均匀性控制
公开(公告)号：US09200368B2
公开(公告)日：2015-12-01
申请号：US13207227
申请日：2011-08-10
申请人： Soo Young Choi , John M. White , Qunhua Wang , Li Hou , Ki Woon Kim , Shinichi Kurita , Tae Kyung Won , Suhail Anwar , Beom Soo Park , Robin L. Tiner
发明人： Soo Young Choi , John M. White , Qunhua Wang , Li Hou , Ki Woon Kim , Shinichi Kurita , Tae Kyung Won , Suhail Anwar , Beom Soo Park , Robin L. Tiner
IPC分类号： C23C16/455 , C23C16/34 , C23C16/509 , H01J37/32
CPC分类号： H01J37/3244 , C23C16/345 , C23C16/455 , C23C16/45565 , C23C16/5096 , H01J37/32082 , H01J37/32091 , H01J37/32541 , H01J37/32596 , H01J2237/327 , H01J2237/3321 , H01J2237/3323 , H01J2237/3325 , Y10T29/49885 , Y10T29/49996
摘要： Embodiments of a gas diffuser plate for distributing gas in a processing chamber are provided. The gas distribution plate includes a diffuser plate having an upstream side and a downstream side, and a plurality of gas passages passing between the upstream and downstream sides of the diffuser plate. The gas passages include hollow cathode cavities at the downstream side to enhance plasma ionization. The depths, the diameters, the surface area and density of hollow cathode cavities of the gas passages that extend to the downstream end can be gradually increased from the center to the edge of the diffuser plate to improve the film thickness and property uniformity across the substrate. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can be created by bending the diffuser plate toward downstream side, followed by machining out the convex downstream side. Bending the diffuser plate can be accomplished by a thermal process or a vacuum process. The increasing diameters, depths and surface areas from the center to the edge of the diffuser plate can also be created computer numerically controlled machining. Diffuser plates with gradually increasing diameters, depths and surface areas of the hollow cathode cavities from the center to the edge of the diffuser plate have been shown to produce improved uniformities of film thickness and film properties.
摘要翻译：提供了用于在处理室中分配气体的气体扩散板的实施例。气体分配板包括具有上游侧和下游侧的扩散板，以及在扩散板的上游侧和下游侧之间通过的多个气体通路。气体通道包括在下游侧的中空阴极腔，以增强等离子体电离。延伸到下游端的气体通道的空心阴极腔的深度，直径，表面积和密度可以从扩散板的中心到边缘逐渐增加，以改善衬底上的膜厚度和性能均匀性。从扩散板的中心到边缘的直径，深度和表面积的增加可以通过向下游侧弯曲扩散板，然后在凸出的下游侧加工出来。扩散板的弯曲可以通过热处理或真空工艺来实现。从扩散板的中心到边缘的直径，深度和表面积的增加也可以用计算机数字控制加工。具有从扩散板的中心到边缘的中空阴极腔的直径逐渐增加，深度和表面积逐渐增大的扩散板已被证明可以产生改善的膜厚度和膜性质的均匀性。

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