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    • 31. 发明申请
    • OPTICAL UNIT
    • 光学单元
    • US20090274184A1
    • 2009-11-05
    • US11912385
    • 2006-04-25
    • Kei IkedaHiroyuki Ogawa
    • Kei IkedaHiroyuki Ogawa
    • H01S3/04
    • G11B7/12G11B7/127
    • The present invention provides an optical unit capable of suppressing a thermal influence on the optical element even if a heating source such as a laser driver is disposed near the optical element. A light pickup unit 9 of the present invention includes a beam splitter 12 and a collimate lens 13 at locations opposed to a laser driver 17. In a space 24 formed by the laser driver 17, the beam splitter 12 and the collimate lens 13, a thermal insulation sheet 18 is provided on the side of the laser driver 17, and a thermal conductive sheet 19 is provided on the side of the beam splitter 12 and the collimate lens 13.
    • 本发明提供一种能够抑制对光学元件的热影响的光学单元,即使在光学元件附近设置有诸如激光驱动器的加热源。 本发明的光拾取单元9在与激光驱动器17相对的位置处包括分束器12和准直透镜13.在由激光驱动器17,分束器12和准直透镜13形成的空间24中, 绝热片18设置在激光驱动器17的一侧,并且导热片19设置在分束器12和准直透镜13的一侧。
    • 32. 发明申请
    • Fabrication Process of a Semiconductor Device Having a Capacitor
    • 具有电容器的半导体器件的制造工艺
    • US20090098696A1
    • 2009-04-16
    • US12127067
    • 2008-05-27
    • Jun LinHiroyuki OgawaHideyuki Kojima
    • Jun LinHiroyuki OgawaHideyuki Kojima
    • H01L21/8234
    • H01L27/0629H01L27/0802H01L27/0805H01L28/40
    • A method of manufacturing a semiconductor device includes forming a first trench in a capacitor device region of a semiconductor substrate, forming a capacitor insulation film over a sidewall surface of the first trench, forming a semiconductor film to cover the first trench, a resistor device region of the semiconductor substrate and a logic device region of the semiconductor substrate, introducing a first impurity element into the semiconductor film formed over the first trench, patterning the semiconductor film to form a top electrode in the capacitor device region, a resistor in the resistor device region and a gate electrode in the logic device region, annealing the semiconductor substrate, and introducing a second impurity element in the resistor.
    • 一种制造半导体器件的方法包括在半导体衬底的电容器器件区域中形成第一沟槽,在第一沟槽的侧壁表面上形成电容器绝缘膜,形成覆盖第一沟槽的半导体膜,电阻器器件区域 的半导体衬底和半导体衬底的逻辑器件区域,在第一沟槽上形成的半导体膜中引入第一杂质元素,对半导体膜进行构图以在电容器器件区域中形成顶电极,电阻器件中的电阻器 区域和逻辑器件区域中的栅电极,退火半导体衬底,并在电阻器中引入第二杂质元素。