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    • 8. 发明授权
    • Method for reducing short channel effects in memory cells and related structure
    • 减少存储单元短路效应的方法及相关结构
    • US06773990B1
    • 2004-08-10
    • US10429150
    • 2003-05-03
    • Richard FastowYue-Song HeKazuhiro MizutaniTimothy Thurgate
    • Richard FastowYue-Song HeKazuhiro MizutaniTimothy Thurgate
    • H10L21336
    • H01L27/11521H01L27/115
    • According to one exemplary embodiment, a method for fabricating a floating gate memory array comprises a step of removing a dielectric material from an isolation region situated in a substrate to expose a trench, where the trench is situated between a first source region and a second source region, where the trench defines sidewalls in the substrate. The method further comprises implanting an N type dopant in the first source region, the second source region, and the sidewalls of the trench, where the N type dopant forms an N+ type region. The method further comprises implanting a P type dopant in the first source region, the second source region, and the sidewalls of the trench, where the P type dopant forms a P type region, and where the P type region is situated underneath the N+ type region.
    • 根据一个示例性实施例,一种用于制造浮动栅极存储器阵列的方法包括从位于衬底中的隔离区域去除介电材料以暴露沟槽的步骤,其中沟槽位于第一源区域和第二源极之间 区域,其中沟槽限定衬底中的侧壁。 该方法还包括在第一源极区域,第二源极区域和沟槽的侧壁中注入N型掺杂剂,其中N型掺杂剂形成N +型区域。 该方法还包括在第一源极区域,第二源极区域和沟槽的侧壁中注入P型掺杂剂,其中P型掺杂剂形成P型区域,并且其中P型区域位于N +型下方 地区。
    • 9. 发明授权
    • Memory array with memory cells having reduced short channel effects
    • 具有存储单元的存储器阵列具有减少的短通道效应
    • US06963106B1
    • 2005-11-08
    • US10839626
    • 2004-05-04
    • Richard FastowYue-Song HeKazuhiro MizutaniTimothy Thurgate
    • Richard FastowYue-Song HeKazuhiro MizutaniTimothy Thurgate
    • H01L21/8247H01L27/115H01L21/788
    • H01L27/11521H01L27/115
    • According to one exemplary embodiment, a method for fabricating a floating gate memory array comprises a step of removing a dielectric material from an isolation region situated in a substrate to expose a trench, where the trench is situated between a first source region and a second source region, where the trench defines sidewalls in the substrate. The method further comprises implanting an N type dopant in the first source region, the second source region, and the sidewalls of the trench, where the N type dopant forms an N+ type region. The method further comprises implanting a P type dopant in the first source region, the second source region, and the sidewalls of the trench, where the P type dopant forms a P type region, and where the P type region is situated underneath the N+ type region.
    • 根据一个示例性实施例,一种用于制造浮动栅极存储器阵列的方法包括从位于衬底中的隔离区域去除介电材料以暴露沟槽的步骤,其中沟槽位于第一源区域和第二源极之间 区域,其中沟槽限定衬底中的侧壁。 该方法还包括在第一源极区域,第二源极区域和沟槽的侧壁中注入N型掺杂剂,其中N型掺杂剂形成N +型区域。 该方法还包括在第一源极区域,第二源极区域和沟槽的侧壁中注入P型掺杂剂,其中P型掺杂剂形成P型区域,并且其中P型区域位于N +型下方 地区。