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31. 发明授权

US5935687A Three dimensional package and architecture for high performance computer 失效
标题翻译：高性能计算机的三维封装和架构
公开(公告)号：US5935687A
公开(公告)日：1999-08-10
申请号：US554009
申请日：1995-11-06
申请人： Evan Ezra Davidson , David Andrew Lewis , Jane Margaret Shaw , Alfred Viehbeck , Janusz Stanislaw Wilczynski
发明人： Evan Ezra Davidson , David Andrew Lewis , Jane Margaret Shaw , Alfred Viehbeck , Janusz Stanislaw Wilczynski
IPC分类号： H05K3/36 , H01L25/065 , H05K1/05 , H05K1/14 , H05K3/34 , H05K3/46 , H05K7/14 , B32B3/00
CPC分类号： H05K3/4641 , H01L25/0652 , H05K1/145 , H01L2224/48091 , H01L2924/01014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/19041 , H05K1/053 , H05K1/056 , H05K2201/068 , H05K2201/09309 , H05K2201/09718 , H05K3/3436 , H05K3/4608 , Y10S428/901 , Y10T428/24802 , Y10T428/24917 , Y10T428/24926
摘要： A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.
摘要翻译：描述了用于最终高性能计算机的三维封装架构及其制造方法。该封装允许非常密集的多个集成电路芯片的封装，以实现计算机的最小通信距离和最大时钟速度。包装结构由多个子组件形成。每个子组件由至少一个侧面上至少有一个集成电路器件的衬底形成。在相邻的子组件之间设置有第二衬底。存在用于将子组件上的接触位置电互连到第二基板上的接触位置的电互连装置。电互连装置可以是焊锡槽，引线接合等。第一基板在电子设备和每个子组件之间提供电信号互通。第二基板提供对多个子组件的接地和功率分配。可选地，结构的外表面可以设置成存储芯片的立方体。

32. 发明授权

US5834537A Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin 失效
标题翻译：分散在热固性树脂中的均相，共型或多组分热塑性聚合物
公开(公告)号：US5834537A
公开(公告)日：1998-11-10
申请号：US668732
申请日：1996-06-24
申请人： Jeffrey Thomas Gotro , Jeffrey Curtis Hedrick , Konstantinos Papathomas , Niranjan Mohanlal Patel , Alfred Viehbeck , William Joseph
发明人： Jeffrey Thomas Gotro , Jeffrey Curtis Hedrick , Konstantinos Papathomas , Niranjan Mohanlal Patel , Alfred Viehbeck , William Joseph
IPC分类号： C08L27/12 , C08G59/30 , C08L63/00 , C08L71/00 , C08L71/08 , C08L71/10 , C08L87/00 , C08L101/00 , C08L101/02 , H05K1/03
CPC分类号： C08L71/00 , C08G59/30 , C08L63/00 , H05K1/034 , Y10S525/905 , Y10S525/906
摘要： The present invention relates to a curable thermosetting resin composition having enhanced fracture toughness as a results of the incorporation of reactive thermoplastic oligomers therein. More specifically, the present invention relates to a composition comprising a thermoset resin which contains fluorine and containing at least one fluorine containing thermoplastic homopolymer component which is soluble in the thermoset. Said thermoplastic polymer undergoes an in-situ phase separation process during cure to form a microphase separated multiphase thermoset material.
摘要翻译：本发明涉及作为在其中引入反应性热塑性低聚物的结果而具有增强的断裂韧性的可固化热固性树脂组合物。更具体地说，本发明涉及包含含有氟并含有至少一种可溶于热固性树脂的含氟热塑性均聚物组分的热固性树脂的组合物。所述热塑性聚合物在固化期间经历原位相分离工艺以形成微相分离的多相热固性材料。

33. 发明授权

US5756146A Inspecting copper or molybdenum lines on a substrate 失效
标题翻译：检查衬底上的铜或钼线
公开(公告)号：US5756146A
公开(公告)日：1998-05-26
申请号：US815826
申请日：1997-03-12
申请人： Kang-Wook Lee , Alfred Viehbeck
发明人： Kang-Wook Lee , Alfred Viehbeck
IPC分类号： G01N21/95 , H05K1/02 , H05K3/24 , H05K3/46 , H05H1/00
CPC分类号： G01N21/95 , H05K1/0269 , H05K2203/072 , H05K2203/161 , H05K3/244 , H05K3/4644
摘要： Copper lines or molybdenum lines on a substrate are inspected for defects by coating a metallized substrate with an inspection layer followed by imaging the substrate, and removing the inspection layer after the imaging. The inspection layer can be a light reflecting metal or a combination of a light reflecting metal and light-absorbing organic compound.
摘要翻译：通过用检查层涂覆金属化基板，然后对基板进行成像来检查基板上的铜线或钼线，并在成像之后移除检查层。检查层可以是光反射金属或光反射金属和光吸收有机化合物的组合。

34. 发明授权

US5709906A Method for conditioning halogenated polymeric materials and structures fabricated therewith 失效
标题翻译：用于调节卤化聚合物材料和用其制造的结构的方法
公开(公告)号：US5709906A
公开(公告)日：1998-01-20
申请号：US490930
申请日：1995-06-16
申请人： Harry Randall Bickford , Peter J. Duke , Elizabeth Foster , Martin Goldberg , Voya Rista Markovich , Linda Matthew , Donald G. McBride , Terrence Robert O'Toole , Stephen Leo Tisdale , Alfred Viehbeck
发明人： Harry Randall Bickford , Peter J. Duke , Elizabeth Foster , Martin Goldberg , Voya Rista Markovich , Linda Matthew , Donald G. McBride , Terrence Robert O'Toole , Stephen Leo Tisdale , Alfred Viehbeck
IPC分类号： C08J3/24 , C23C18/20 , C23C18/28 , C25D5/56 , H05K1/03 , H05K3/18 , H05K3/38 , H05K3/42 , B05D3/04
CPC分类号： H05K3/422 , C23C18/208 , C23C18/2093 , C23C18/30 , C25D5/56 , H05K3/381 , H05K1/034 , H05K3/181 , Y10S428/901 , Y10T428/24273 , Y10T428/24322 , Y10T428/24339 , Y10T428/24802 , Y10T428/3154 , Y10T428/31544 , Y10T428/31678
摘要： A method of treating a halogenated polymeric-containing substrate including exposing at least portions of the halogenated polymeric-containing substrate to a composition containing a reducing agent and an aprotic solvent selected from the group consisting of nitriles, nitro compounds, amides, esters, carbonates, oxides, sulfo compounds and mixtures thereof. The solvent is free of ethers, amines, ammonia. The composition is prepared by reacting a metal with an organic compound selected from the group consisting of polyaryl compounds, aromatic carbonyl containing compounds, aromatic nitriles, and aromatic heterocyclic nitrogen containing compounds in a reaction solvent that does not react with the metal but permits reaction between the metal and the organic compound to thereby provide the reducing agent. The reducing agent is isolated from the reaction solvent to obtain a reaction product as a solid. The reaction product is added to the aprotic solvent. The treated substrate is contacted with a material to promote adhesion of the material to the treated surface.
摘要翻译：一种处理卤化聚合物基质的方法，包括将含卤代聚合物的底物的至少一部分暴露于含有还原剂和非质子溶剂的组合物，所述组合物选自腈，硝基化合物，酰胺，酯，碳酸酯，氧化物，磺基化合物及其混合物。溶剂不含醚，胺，氨。该组合物是通过在不与金属反应的反应溶剂中使金属与选自由聚芳基化合物，含芳族羰基的化合物，芳族腈和含芳族杂环氮的化合物组成的组中的有机化合物反应而制备的，金属和有机化合物，从而提供还原剂。将还原剂从反应溶剂中分离，得到固体的反应产物。将反应产物加入到非质子溶剂中。经处理的基底与材料接触以促进材料粘附到经处理的表面。

35. 发明授权

US5582858A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5582858A
公开(公告)日：1996-12-10
申请号：US474985
申请日：1995-06-07
申请人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , B05D5/10
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络嵌入在陶瓷和/或聚合物基材内。在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

36. 发明授权

US5523776A Photovoltaic array for computer display 失效
标题翻译：用于计算机显示的光伏阵列
公开(公告)号：US5523776A
公开(公告)日：1996-06-04
申请号：US370938
申请日：1995-01-10
申请人： Gareth G. Hougham , Alfred Viehbeck
发明人： Gareth G. Hougham , Alfred Viehbeck
IPC分类号： G06F1/16 , G06F1/26 , G09G3/20 , H02N6/00 , G09G5/00 , H01L31/04
CPC分类号： G09G3/20 , G06F1/1601 , G06F1/26 , H02S99/00 , G06F2200/1612 , Y10S136/291
摘要： A display is constructed having a flat screen consisting of pixels which may be individually excited to create an image. The pixels are excitable between a light reflective and a transparent state in which they are visible in the reflective state and dark in the transparent state. A solar panel is mounted behind the flat screen to receive light transmitted by the transparent pixels. The solar panel converts the light to electric power to supplement the battery operation of the device.
摘要翻译：构建了具有由像素组成的平面屏幕的显示器，该像素可被单独激发以产生图像。像素在光反射和透明状态之间是可激发的，其中它们在反射状态下是可见的，在透明状态下是暗的。太阳能电池板安装在平面屏幕后面，以接收由透明像素传输的光。太阳能电池板将光转换成电力，以补充设备的电池操作。

37. 发明授权

US5187241A Isoimide modifications of a polyimide and reaction thereof with nucleophiles 失效
标题翻译：聚酰亚胺的异构酰亚胺改性物和与亲核试剂的反应
公开(公告)号：US5187241A
公开(公告)日：1993-02-16
申请号：US770506
申请日：1991-10-03
申请人： Stephen L. Buchwalter , Ernest R. Frank , Terrence R. O'Toole , Richard R. Thomas , Alfred Viehbeck
发明人： Stephen L. Buchwalter , Ernest R. Frank , Terrence R. O'Toole , Richard R. Thomas , Alfred Viehbeck
IPC分类号： C08G73/06 , C08G73/10 , C08J7/12 , C23C18/22 , G03F7/038 , H05K3/38
CPC分类号： C08J7/12 , C08G73/1089 , C23C18/22 , H05K3/381 , C08J2379/08
摘要： The invention relates to the formation of isoimides from amic acids, especially polyisoimides by a novel process in which polyimides are first converted to polyamic acids and then contacted with an isoimidizing agent. An acyl halide of a heterocyclic nitrogen compound or an acyl halide of a heterocyclic sulphur compound can be used as the isoimidizing agent. The isoimidization may also be carried out in the presence of a compound containing a heterocyclic nitrogen especially a solvent containing a heterocyclic nitrogen.The invention is especially applicable to conducting nucleophilic addition reactions on the surface of polyimides where the surface has been converted to a polyamic acid or on the surface of polyamic acid materials followed by isoimidization and reaction of the isoimide with a nucleophile such as an amine or organic hydroxy compound.Photosensitive metal compounds or electroless metal coating catalysts can be coordinated with the compositions obtained.
摘要翻译：本发明涉及通过一种新方法从酰胺酸，特别是聚酰亚胺形成异酰亚胺，其中首先将聚酰亚胺转化为聚酰胺酸，然后与异氰酸酯接触。可以使用杂环氮化合物的酰卤或杂环硫化合物的酰卤作为异亚胺化剂。异氰酰化还可以在含有杂环氮的化合物，特别是含有杂环氮的溶剂的存在下进行。本发明特别适用于在表面已转化为聚酰胺酸或聚酰胺酸物质表面的聚酰亚胺的表面上进行亲核加成反应，随后异亚胺化和异亚胺与亲核试剂例如胺或有机物的反应羟基化合物。感光金属化合物或无电镀金属涂层催化剂可以与获得的组合物配位。

38. 发明授权

US5179467A Charge transfer salts and uses thereof 失效
标题翻译：电荷转移盐及其用途
公开(公告)号：US5179467A
公开(公告)日：1993-01-12
申请号：US583888
申请日：1990-09-17
申请人： Stephen L. Buchwalter , Martin J. Goldberg , Revathi Iyengar , Terrence R. O'Toole , Alfred Viehbeck
发明人： Stephen L. Buchwalter , Martin J. Goldberg , Revathi Iyengar , Terrence R. O'Toole , Alfred Viehbeck
IPC分类号： C09K9/02 , H01B1/12
CPC分类号： H01B1/121 , C09K9/02 , H01B1/12
摘要： An electrochemical color change cell incorporating as a color changing agent intramolecular charge transfer salt or an intermolecular charge transfer salt. The intermolecular charge transfer salts and the intramolecular charge transfer salts have a plurality of oxidation states and a wide variation in color change. The intermolecular and intramolecular charge transfer salts preferably contain a violene moiety and a moiety having a carbonyl group conjugated to an aromatic moiety. The intramolecular charge transfer salts have a stable covalent radical-anion/radical-cation configuration. The intermolecular charge transfer salts have a stable ionic radical-anion/radical-cation configuration.
摘要翻译：一种结合作为变色剂分子内电荷转移盐或分子内电荷转移盐的电化学变色细胞。分子间电荷转移盐和分子内电荷转移盐具有多种氧化态和颜色变化的广泛变化。分子间和分子内电荷转移盐优选含有突出部分和具有与芳族部分结合的羰基的部分。分子内电荷转移盐具有稳定的共价自由基 - 阴离子/自由基 - 阳离子配置。分子间电荷转移盐具有稳定的离子自由基 - 阴离子/自由基 - 阳离子配置。

39. 发明授权

US5104944A Process for nucleophilic derivatization of materials having an imide group conjugated to an aromatic moiety 失效
标题翻译：具有连接到一个神经环境的组合物的材料的核化衍生物的方法
公开(公告)号：US5104944A
公开(公告)日：1992-04-14
申请号：US381627
申请日：1989-07-18
申请人： Martin J. Goldberg , Daniel P. Morris , Alfred Viehbeck
发明人： Martin J. Goldberg , Daniel P. Morris , Alfred Viehbeck
IPC分类号： C25B3/04 , C08G73/10 , C08G85/00 , G03F7/038 , H05K1/03 , H05K3/18 , H05K3/38
CPC分类号： G03F7/0387 , C08G73/10 , C08G73/1007 , C08G85/00 , H05K1/0346 , H05K3/181 , H05K3/381
摘要： A process for the synthesis of derivatives of materials containing an imide group conjugated to an aromatic moiety to form an ester, a thioester, an amide, a ketone, and silylesters. Electrons are supplied to redox sites to form a reduced imide material. The reduced imide material is contacted with a nucleophile which opens the imide ring of the reduced imide and chemically combines with a carbonyl carbon atom of the open imide ring to form an imide derivative.

40. 发明授权

US06379865B1 Photoimageable, aqueous acid soluble polyimide polymers 失效
标题翻译：可光成像，含水酸溶性聚酰亚胺聚合物
公开(公告)号：US06379865B1
公开(公告)日：2002-04-30
申请号：US09547390
申请日：2000-04-11
申请人： Guoping Mao , Hany B. Eitouni , Alphonsus V. Pocius , John B. Scheibner , Nanayakkara L. D. Somasiri , Nicholas A. Stacey , Alfred Viehbeck
发明人： Guoping Mao , Hany B. Eitouni , Alphonsus V. Pocius , John B. Scheibner , Nanayakkara L. D. Somasiri , Nicholas A. Stacey , Alfred Viehbeck
IPC分类号： G03F709
CPC分类号： C08G73/1007 , C08G73/1025 , G03F7/0387 , G03F7/164 , H05K3/287 , H05K2203/135 , Y10S430/136
摘要： A photoimageable, aqueous acid soluble polyimide polymer comprising an anhydride, including a substituted benzophenone nucleus, a diamine reacted with the anhydride to form a photosensitive polymer intermediate, and at least 60 Mole % of solubilizing amine reacted with the photosensitive polymer intermediate to form the photoimageable, aqueous acid soluble polyimide polymer. An emulsion for electrophoretic deposition of a coating of a photoimageable, aqueous acid soluble polyimide polymer comprises a dispersed phase, including the photoimageable aqueous acid soluble polyimide polymer, dissolved in an organic solvent and a dispersion phase including a coalescence promoter and water. The emulsion may be applied, by electrophoretic deposition, to a conductive structure to provide a photoimageable coating on the conductive structure. After exposing the coating to a pattern of radiation for photocrosslinking exposed parts of the photoimageable aqueous acid soluble polyimide polymer, an aqueous acid developer solution removes unexposed photoimageable aqueous acid soluble polyimide polymer to reveal a crosslinked polyimide polymer image of the radiation pattern.
摘要翻译：包含酸酐的可光成像的含水酸性聚酰亚胺聚合物，包括取代的二苯甲酮核，与酸酐反应形成光敏聚合物中间体的二胺和至少60摩尔的增溶胺与感光性聚合物中间体反应形成可光成像，水溶性聚酰亚胺聚合物水溶液。用于电泳沉积可光成像的含水酸性聚酰亚胺聚合物涂层的乳液包括溶解在有机溶剂中的分散相，包括可光成像的含水溶性聚酰亚胺聚合物，以及包含聚结促进剂和水的分散相。可以通过电泳沉积将乳液施加到导电结构上，以在导电结构上提供可光成像的涂层。在将涂层暴露于辐照图案之后，将可光成像的含水溶性聚酰亚胺聚合物的曝光部分光致交联，酸性显影剂水溶液除去未曝光的可光成像的酸性水溶性聚酰亚胺聚合物，以露出辐射图案的交联聚酰亚胺聚合物图像。

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