专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

31. 发明授权

US06214268B1 Blow-molded hoses and apparatuses for producing the same 失效
标题翻译：吹塑软管及其制造装置
公开(公告)号：US06214268B1
公开(公告)日：2001-04-10
申请号：US09025340
申请日：1998-02-18
申请人： Masaaki Ogawa
发明人： Masaaki Ogawa
IPC分类号： B29C4904
CPC分类号： B29C47/065 , B29C47/0023 , B29C47/0026 , B29C47/062 , B29C47/22 , B29C47/26 , B29C47/268 , B29C47/28 , B29C49/04 , B29C49/041 , Y10T428/1352 , Y10T428/139 , Y10T428/1393
摘要： The blow-molded hose of a synthetic resin of the present invention is produced by blow-molding a single parison comprising a soft resin and a hard resin. The blow-molded hose comprises a monolayer (or single-layer) segment formed with either a soft resin layer or a hard resin layer and multilayer (laminating) segment formed with the soft resin layer and the hard resin layer, wherein, in the multilayer (laminating) segment, the thickness of the resin layer forming the monolayer segment is thinner than that of the other resin layer. Practically, the monolayer segment comprises the soft resin layer and forms the connection end (s) at the end (s) of the hose.
摘要翻译：本发明的合成树脂的吹塑软管通过对包含软树脂和硬树脂的单一型坯进行吹塑来制造。吹塑软管包括由软树脂层或硬树脂层形成的单层（或单层）段和由软树脂层和硬树脂层形成的多层（层压）段，其中在多层（层叠）部分，形成单层链段的树脂层的厚度比其他树脂层的厚度薄。实际上，单层段包括软树脂层，并在软管的端部形成连接端。

32. 发明授权

US06168002A Control system for use with semiconductor device transporting and handling apparatus 失效
标题翻译：用于半导体装置运输和处理装置的控制系统
公开(公告)号：US06168002A
公开(公告)日：2001-01-02
申请号：US08934023
申请日：1997-09-19
申请人： Hiroyuki Takahashi , Masaaki Ogawa
发明人： Hiroyuki Takahashi , Masaaki Ogawa
IPC分类号： B65G4300
CPC分类号： H05K13/022 , H05K13/08
摘要： In a handler attracting and transporting ICs by the use of a vacuum pick-up head, a control system is provided which provides for removing a jammed IC without the need for opening the door of the constant temperature chamber, if the vacuum pick-up head's failure to grasp an IC should cause jamming. A jam detecting means detects the occurrence of jam to interrupt the operation of the handler, whereupon a motion control means is activated to move the vacuum pick-up head to and stop it at a position distant from the site of jamming whereby the space above the site of jamming is cleared. This allows for removing the jammed IC by using a manipulator rod inserted through a through-hole formed through the outer wall of the constant temperature chamber.
摘要翻译：在通过使用真空吸尘器吸引和传送IC的处理器中，提供一种控制系统，其提供去除卡住的IC，而不需要打开恒温室的门，如果真空拾取头的不能抓住IC应该导致卡住。卡纸检测装置检测卡纸的发生以中断处理器的操作，于是启动运动控制装置以使真空拾取头移动并停止在远离卡纸位置的位置，干扰部位被清除。这允许通过使用插入通过恒温室的外壁形成的通孔的操纵杆来去除卡住的IC。

33. 发明授权

US5601779A Method for manufacturing hollow resin products 失效
标题翻译：中空树脂制品的制造方法
公开(公告)号：US5601779A
公开(公告)日：1997-02-11
申请号：US542300
申请日：1995-10-12
申请人： Hajime Ishikawa , Masaaki Ogawa , Ryosuke Hasegawa , Hideo Yamamoto
发明人： Hajime Ishikawa , Masaaki Ogawa , Ryosuke Hasegawa , Hideo Yamamoto
IPC分类号： B29B11/10 , B29C31/04 , B29C49/02 , B29C49/04 , B29C49/28 , B29C49/42 , B29C49/48 , B29C49/56 , B29C49/64 , B29L22/00
CPC分类号： B29C49/4242 , B29C49/4205 , B29C49/04
摘要： A method of manufacturing hollow resin products which are curved two-dimensionally or three-dimensionally. The method includes extruding a tubular parison from an extruder at a constant speed and cutting the parison at a specified length; receiving the parison extruded from the extruder into a conveyer having a feeder which is driven at the same speed as the extruding speed of the parison; maintaining the parison in the conveyer by stopping the feeder temporarily; feeding a leading portion of the parison to a trailing portion thereof successively through an outlet of the conveyer into a cavity of a lower mold of a blow molding machine by driving the feeder, the cavity being curved two-dimensionally or three-dimensionally; and closing the lower mold with an upper mold of the blow molding machine and blowing compressed gas into the parison in the blow molding machine.
摘要翻译：制造二维或三维弯曲的中空树脂制品的方法。该方法包括以一定速度从挤出机挤出管状型坯并以特定长度切割型坯; 接收从挤出机挤出的型坯到具有以与型坯的挤出速度相同的速度驱动的进料器的输送机; 通过暂时停止进料器将型坯保持在输送机中; 通过驱动进料器，将型坯的引导部分连续地通过输送机的出口进入吹塑机的下模的空腔中，该空腔被二维或三维地弯曲; 并用吹塑机的上模封闭下模，并在吹塑机中将压缩气体吹入型坯。

34. 发明授权

US5269168A Transfer feeder 失效
标题翻译：输送机
公开(公告)号：US5269168A
公开(公告)日：1993-12-14
申请号：US828997
申请日：1992-04-06
申请人： Masaaki Ogawa
发明人： Masaaki Ogawa
IPC分类号： B21D43/05 , B30B13/00
CPC分类号： B21D43/055 , B21D43/052
摘要： It is an object of this invention to provide a transfer feeder wherein lift levers are pivoted to vertically move upstream and downstream lift beams through connecting rods and lift mechanisms to change their heights, and cross bars extend between transfer bars and are adapted to adjust the level of a workpiece to a plurality of different levels. The transfer feeder comprises a first feed height adjustment mechanism (25) disposed between the lift levers (22) and the connecting rods (28) to simultaneously change the height of the upstream lift beams (7.sub.1) and the downstream lift beams (7.sub.2) to respective levels, and a second feed height adjustment mechanism (30) disposed between the lift mechanisms (8) for the upstream lift beams (7.sub.1) and the lift mechanisms (8) for the downstream lift beams (7.sub.2) to change the height of the upstream lift beams relative to the upstream lift beams.
摘要翻译： PCT No.PCT / JP91 / 00782 Sec。 371日期：1992年4月6日 102（e）日期1992年4月6日PCT Filed 1991年6月11日PCT公布。公开号WO91 / 19576 日本1991年12月26日。本发明的一个目的是提供一种传送给料器，其中提升杆枢转以垂直移动上游和下游提升梁通过连接杆和提升机构以改变其高度，并且横杆在传送杆之间延伸并且适于将工件的水平调节到多个不同的水平。传送进料器包括设置在提升杆（22）和连杆（28）之间的第一进料高度调节机构（25），以同时将上游提升梁（71）和下游提升梁（72）的高度改变为以及设置在用于上游提升梁（71）的提升机构（8）和用于下游提升梁（72）的升降机构（8）之间的第二进料高度调节机构（30），以改变高度上游提升梁相对于上游提升梁。

35. 发明授权

US09200601B2 Evaporated fuel treatment device for motorcycle 有权
标题翻译：摩托车蒸发燃料处理装置
公开(公告)号：US09200601B2
公开(公告)日：2015-12-01
申请号：US13424849
申请日：2012-03-20
申请人： Nobuyuki Kondo , Hiroshi Inaoka , Teruhide Yamanishi , Kazuo Fujihara , Toshinao Takigawa , Toshiyuki Hyodo , Masaaki Ogawa
发明人： Nobuyuki Kondo , Hiroshi Inaoka , Teruhide Yamanishi , Kazuo Fujihara , Toshinao Takigawa , Toshiyuki Hyodo , Masaaki Ogawa
IPC分类号： B62M7/00 , F02M35/10 , B62J35/00 , B62J37/00 , F02M25/08 , F02M35/16
CPC分类号： F02M35/10222 , B62J35/00 , B62J37/00 , B62K2202/00 , F02M25/0872 , F02M35/162
摘要： A charge pipe passage includes: a first engine-side pipe passage part which extends vertically; a second engine-side pipe passage part which is connected to a lower end of the first engine-side pipe passage part on one side in the vehicle widthwise direction and extends from one side to the other side in the vehicle widthwise direction above the engine body; and a third engine-side pipe passage part which is communicably connected to the second engine-side pipe passage part on the other side in the vehicle widthwise direction and is connected to the engine body, and at least a part of the charge pipe passage between a frame-side support part and an engine-side support part is formed of an elastic tube.
摘要翻译：充气管通道包括：垂直延伸的第一发动机侧管道通道部分; 第二发动机侧管路通路部，其在车宽方向的一侧与第一发动机侧管路部的下端连接，并且沿着车宽方向从发动机主体的一侧向另一侧延伸 ; 以及第三发动机侧管道通道部分，其在车辆宽度方向上的另一侧可连接地连接到第二发动机侧管道通道部分，并且连接到发动机主体，并且至少一部分充电管通道在框架侧支撑部和发动机侧支撑部由弹性管形成。

36. 发明授权

US08680561B2 Semiconductor light emitting device and method for manufacturing same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08680561B2
公开(公告)日：2014-03-25
申请号：US13037914
申请日：2011-03-01
申请人： Ryota Kitagawa , Akira Fujimoto , Koji Asakawa , Eishi Tsutsumi , Takanobu Kamakura , Shinji Nunotani , Masaaki Ogawa
发明人： Ryota Kitagawa , Akira Fujimoto , Koji Asakawa , Eishi Tsutsumi , Takanobu Kamakura , Shinji Nunotani , Masaaki Ogawa
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , B82Y20/00 , H01L33/42 , H01L2933/0016 , H01L2933/0091
摘要： A semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a light emitting layer, a first electrode layer, and a second electrode layer. The light emitting layer is between the first semiconductor layer and the second semiconductor layer. The first electrode layer is on a side of the second semiconductor layer opposite to the first semiconductor layer. The first electrode layer includes a metal portion and a plurality of opening portions piercing the metal portion along a direction from the first semiconductor layer toward the second semiconductor layer. The metal portion contacts the second semiconductor layer. An equivalent circular diameter of a configuration of the opening portions as viewed along the direction is not less than 10 nanometers and not more than 5 micrometers.
摘要翻译：一种半导体发光器件包括第一导电类型的第一半导体层，第二导电类型的第二半导体层，发光层，第一电极层和第二电极层。发光层位于第一半导体层和第二半导体层之间。第一电极层位于与第一半导体层相对的第二半导体层的一侧。第一电极层包括金属部分和沿着从第一半导体层朝向第二半导体层的方向刺穿金属部分的多个开口部。金属部分接触第二半导体层。沿着该方向观察的开口部分的构造的等效圆直径不小于10纳米且不大于5微米。

37. 发明申请

US20120240902A1 EVAPORATED FUEL TREATMENT DEVICE FOR MOTORCYCLE 有权
标题翻译：用于摩托车的蒸发燃料处理装置
公开(公告)号：US20120240902A1
公开(公告)日：2012-09-27
申请号：US13424558
申请日：2012-03-20
申请人： Nobuyuki Kondo , Hiroshi Inaoka , Teruhide Yamanishi , Kazuo Fujihara , Toshinao Takigawa , Toshiyuki Hyodo , Masaaki Ogawa
发明人： Nobuyuki Kondo , Hiroshi Inaoka , Teruhide Yamanishi , Kazuo Fujihara , Toshinao Takigawa , Toshiyuki Hyodo , Masaaki Ogawa
IPC分类号： F02M33/02
CPC分类号： B62J37/00 , B62J35/00 , B62K11/10 , B62K2202/00
摘要： A charge pipe passage includes a second pipe passage part which is connected to a fuel tank by way of a first pipe passage part and extends toward the other side from one side in the vehicle widthwise direction, and a third pipe passage part which is communicably connected with the second pipe passage part on the other side in the vehicle widthwise direction and has a highest part arranged at a highest position of the charge pipe passage at an intermediate position thereof. A first check valve is interposed on the third pipe passage part downstream of the highest part, an atmospheric air introducing pipe passage is connected to the third pipe passage part upstream of the first check valve, and a second check valve is interposed on the atmospheric air introducing pipe passage at a position higher than the highest part.
摘要翻译：一个充电管通道包括一个第二管道通道部分，该第二管道通道部分通过第一管道部分连接到燃料箱，并沿车宽方向从一侧向另一侧延伸，第三管道通道部分可连通地连接第二管道部分在车辆宽度方向上的另一侧，并且在其中间位置处具有布置在充电管通道的最高位置处的最高部分。第一止回阀插入在最高部分下游的第三管道部分上，大气引入管通道连接到第一止回阀的上游的第三管道部分，并且第二止回阀插入到大气中在高于最高部位的位置处引入管道。

38. 发明申请

US20120070958A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：US20120070958A1
公开(公告)日：2012-03-22
申请号：US13238715
申请日：2011-09-21
申请人： Kazuyoshi Furukawa , Yoshinori Natsume , Yasuhiko Akaike , Shinji Nunotani , Wakana Nishiwaki , Masaaki Ogawa , Toru Kita , Hidefumi Yasuda
发明人： Kazuyoshi Furukawa , Yoshinori Natsume , Yasuhiko Akaike , Shinji Nunotani , Wakana Nishiwaki , Masaaki Ogawa , Toru Kita , Hidefumi Yasuda
IPC分类号： H01L21/762
CPC分类号： H01L21/185 , H01L21/76251 , H01L33/0079
摘要： In a method of manufacturing a semiconductor device of an embodiment, at room temperature, a first substrate including a semiconductor laminate body is adhered to a second substrate with a smaller thermal expansion coefficient than that of the first substrate. Then, the first substrate and the second substrate are heated with the first substrate heated at a temperature higher than that of the second substrate. Thus the first substrate and the second substrate are bonded together. The first substrate is either a sapphire substrate including a nitride-based semiconductor layer, or a GaAs substrate including a phosphorus-based semiconductor layer. The second substrate is a silicon substrate, a GaAs substrate, a Ge substrate, or a metal substrate.
摘要翻译：在本实施方式的半导体装置的制造方法中，在室温下，具有比第一基板的热膨胀系数小的第一基板与第二基板粘合。然后，第一基板和第二基板被加热，第一基板在比第二基板的温度高的温度下加热。因此，第一基板和第二基板结合在一起。第一衬底是包括氮化物基半导体层的蓝宝石衬底或包括磷基半导体层的GaAs衬底。第二基板是硅衬底，GaAs衬底，Ge衬底或金属衬底。

39. 发明申请

US20120056222A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20120056222A1
公开(公告)日：2012-03-08
申请号：US13037914
申请日：2011-03-01
申请人： Ryota KITAGAWA , Akira FUJIMOTO , Koji ASAKAWA , Eishi TSUTSUMI , Takanobu KAMAKURA , Shinji NUNOTANI , Masaaki OGAWA
发明人： Ryota KITAGAWA , Akira FUJIMOTO , Koji ASAKAWA , Eishi TSUTSUMI , Takanobu KAMAKURA , Shinji NUNOTANI , Masaaki OGAWA
IPC分类号： H01L33/58 , H01L33/38 , B82Y99/00 , B82Y40/00
CPC分类号： H01L33/38 , B82Y20/00 , H01L33/42 , H01L2933/0016 , H01L2933/0091
摘要： A semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a light emitting layer, a first electrode layer, and a second electrode layer. The light emitting layer is between the first semiconductor layer and the second semiconductor layer. The first electrode layer is on a side of the second semiconductor layer opposite to the first semiconductor layer. The first electrode layer includes a metal portion and a plurality of opening portions piercing the metal portion along a direction from the first semiconductor layer toward the second semiconductor layer. The metal portion contacts the second semiconductor layer. An equivalent circular diameter of a configuration of the opening portions as viewed along the direction is not less than 10 nanometers and not more than 5 micrometers.
摘要翻译：一种半导体发光器件包括第一导电类型的第一半导体层，第二导电类型的第二半导体层，发光层，第一电极层和第二电极层。发光层位于第一半导体层和第二半导体层之间。第一电极层位于与第一半导体层相对的第二半导体层的一侧。第一电极层包括金属部分和沿着从第一半导体层朝向第二半导体层的方向刺穿金属部分的多个开口部。金属部分接触第二半导体层。沿着该方向观察的开口部分的构造的等效圆直径不小于10纳米且不大于5微米。

40. 发明申请

US20110215356A1 LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING LIGHT EMITTING ELEMENT 审中-公开
标题翻译：发光元件，发光装置及制造发光元件的方法
公开(公告)号：US20110215356A1
公开(公告)日：2011-09-08
申请号：US12976730
申请日：2010-12-22
申请人： Masaaki OGAWA , Yasuhisa OHMURO
发明人： Masaaki OGAWA , Yasuhisa OHMURO
IPC分类号： H01L33/20 , H01L33/62
CPC分类号： H01L33/20 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： According to embodiment, a light emitting element includes a light emitting layer having a first major surface and a second major surface, a first electrode provided on the first major surface side of the light emitting layer, and a second electrode provided on the second major surface side of the light emitting layer and having a basic outline. Furthermore, the light emitting element includes a current blocking portion provided between the first electrode and the light emitting layer or between the second electrode and the light emitting layer, and has an outline with a protrusion-depression pattern with respect to a virtual outline similar in shape to the basic outline of the second electrode.
摘要翻译：根据实施例，发光元件包括具有第一主表面和第二主表面的发光层，设置在发光层的第一主表面侧上的第一电极和设置在第二主表面上的第二电极并且具有基本轮廓。此外，发光元件包括设置在第一电极和发光层之间或者在第二电极和发光层之间的电流阻挡部分，并且具有相对于类似于虚拟轮廓的突起凹陷图案的轮廓形状为第二电极的基本轮廓。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式