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1. 发明申请

US20120132948A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20120132948A1
公开(公告)日：2012-05-31
申请号：US13229972
申请日：2011-09-12
申请人： Shinji Nunotani , Masaaki Ogawa , Koji Asakawa , Ryota Kitagawa , Akira Fujimoto , Takanobu Kamakura
发明人： Shinji Nunotani , Masaaki Ogawa , Koji Asakawa , Ryota Kitagawa , Akira Fujimoto , Takanobu Kamakura
IPC分类号： H01L33/36
CPC分类号： H01L33/38 , H01L2933/0016
摘要： According to one embodiment, a semiconductor light emitting device includes a light emitter, a first and a second electrode layer, a pad electrode and an auxiliary electrode portion. The emitter includes a first semiconductor layer provided on one side of the emitter, a second semiconductor layer provided on one other side of the emitter, and a light emitting layer provided between the first and second semiconductor layers. The first electrode layer is provided on opposite side of the second semiconductor layer from the first semiconductor layer and includes a metal layer and a plurality of apertures penetrating through the metal layer. The second electrode layer is electrically continuous with the first semiconductor layer. The pad electrode is electrically continuous with the first electrode layer. The auxiliary electrode portion is electrically continuous with the first electrode layer and extends in a second direction orthogonal to the first direction.
摘要翻译：根据一个实施例，半导体发光器件包括光发射器，第一和第二电极层，焊盘电极和辅助电极部分。发射极包括设置在发射极一侧的第一半导体层，设置在发射极的另一侧的第二半导体层以及设置在第一和第二半导体层之间的发光层。第一电极层设置在第二半导体层的与第一半导体层相反的一侧上，并且包括金属层和贯穿金属层的多个孔。第二电极层与第一半导体层电连接。焊盘电极与第一电极层电连接。辅助电极部分与第一电极层电连续并沿与第一方向正交的第二方向延伸。

2. 发明申请

US20120056155A1 SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20120056155A1
公开(公告)日：2012-03-08
申请号：US13037990
申请日：2011-03-01
申请人： Koji Asakawa , Akira Fujimoto , Ryota Kitagawa , Takanobu Kamakura , Shinji Nunotani , Eishi Tsutsumi , Masaaki Ogawa
发明人： Koji Asakawa , Akira Fujimoto , Ryota Kitagawa , Takanobu Kamakura , Shinji Nunotani , Eishi Tsutsumi , Masaaki Ogawa
IPC分类号： H01L33/06 , H01L33/38 , B82Y99/00 , B82Y40/00
CPC分类号： H01L33/38 , H01L33/405 , H01L2933/0016
摘要： A semiconductor light emitting device includes a structural body, a first electrode layer, and a second electrode layer. The structural body includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer between the first semiconductor layer and the second semiconductor layer. The first electrode layer includes a metal portion, a plurality of first opening portions, and at least one second opening portion. The metal portion has a thickness of not less than 10 nanometers and not more than 200 nanometers along a direction from the first semiconductor layer toward the second semiconductor layer. The plurality of first opening portions each have a circle equivalent diameter of not less than 10 nanometers and not more than 1 micrometer. The at least one second opening portion has a circle equivalent diameter of more than 1 micrometer and not more than 30 micrometers.
摘要翻译：半导体发光器件包括结构体，第一电极层和第二电极层。结构体包括第一导电类型的第一半导体层，第二导电类型的第二半导体层以及第一半导体层和第二半导体层之间的发光层。第一电极层包括金属部分，多个第一开口部分和至少一个第二开口部分。金属部分沿着从第一半导体层朝向第二半导体层的方向具有不小于10纳米且不大于200纳米的厚度。多个第一开口部分的圆当量直径不小于10纳米且不超过1微米。至少一个第二开口部分具有大于1微米且不超过30微米的圆当量直径。

3. 发明申请

US20100025791A1 SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAME 失效
标题翻译：固态成像装置及其制造方法
公开(公告)号：US20100025791A1
公开(公告)日：2010-02-04
申请号：US12511402
申请日：2009-07-29
申请人： Masaaki Ogawa , Hitoshi Sugiyama
发明人： Masaaki Ogawa , Hitoshi Sugiyama
IPC分类号： H01L31/0232 , H01L21/00
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14623 , H01L27/14625 , H01L27/1464 , H01L27/14683 , H01L27/14685 , H01L2224/05009 , H01L2224/05548 , H01L2224/0557 , H01L2224/13 , H01L2924/00014 , H01L2224/05599 , H01L2224/05099
摘要： An interconnect layer is formed on a lower face of a silicon wafer, a support substrate is adhered over a lower face of the interconnect layer, and a thickness reduction of the silicon wafer is performed from an upper face side. Next, a photodiode is formed in an upper face of the silicon wafer, and a microlens is formed at a position corresponding to the photodiode. An adhesive layer is formed on the silicon wafer in a region not covering the microlens, a low refractive index layer having a lower refractive index than the microlens is formed in a region covering the microlens, and a glass substrate is adhered to the silicon wafer by the adhesive layer. The support substrate is removed from the interconnect layer, and a solder ball is bonded to a lower face of the interconnect layer. Thereafter, a CMOS image sensor is manufactured by dicing the silicon wafer.
摘要翻译：在硅晶片的下表面上形成互连层，在互连层的下表面上附着支撑基板，从上表面侧进行硅晶片的厚度减少。接下来，在硅晶片的上表面中形成光电二极管，并且在与光电二极管对应的位置处形成微透镜。在不覆盖微透镜的区域上的硅晶片上形成粘合剂层，在覆盖微透镜的区域中形成折射率低于微透镜的折射率低的低折射率层，玻璃基板通过粘合剂层。从互连层移除支撑基板，并且将焊球接合到互连层的下表面。此后，通过切割硅晶片来制造CMOS图像传感器。

4. 发明申请

US20070078067A1 Sliding structure and sliding method 审中-公开
标题翻译：滑动结构和滑动方法
公开(公告)号：US20070078067A1
公开(公告)日：2007-04-05
申请号：US11542209
申请日：2006-10-04
申请人： Ikuo Nakagawa , Masaaki Ogawa , Yoshio Fuwa , Yoshinori Ozaki
发明人： Ikuo Nakagawa , Masaaki Ogawa , Yoshio Fuwa , Yoshinori Ozaki
IPC分类号： C10M135/18
CPC分类号： C10M137/10 , C10M125/22 , C10M135/18 , C10M141/08 , C10M141/10 , C10M2201/066 , C10M2219/068 , C10M2223/045 , C10N2210/06 , C23C14/0605 , C23C16/26 , F16C33/10
摘要： According to the present invention, a sliding structure whereby wear resistance of a pair of sliding members that are able to slide relative to each other is improved and the friction coefficient can be reduced is provided. The sliding structure in which a lubricating oil is fed between sliding faces of a pair of sliding members that are able to slide relative to each other such that at least one of the members is allowed to slide is provided. The sliding structure is characterized in that: an amorphous carbon film is formed on the sliding face of at least one sliding member so as to result in a D to G band integrated intensity ratio in the Raman spectrum of between 1.5 and 2.0; and the lubricating oil existing between the sliding faces contains a compound comprising at least molybdenum and sulfur so as to result in a molybdenum content of not less than 400 ppm relative to the lubricating oil.
摘要翻译：根据本发明，提供了能够相对于彼此滑动的一对滑动构件的耐磨性提高并且可以降低摩擦系数的滑动结构。提供了一种滑动结构，其中在一对滑动构件的滑动面之间供给润滑油，该滑动构件能够相对于彼此滑动，使得至少一个构件被允许滑动。滑动结构的特征在于：在至少一个滑动构件的滑动面上形成无定形碳膜，以使拉曼光谱中的D与G波段的一体化强度比在1.5和2.0之间; 并且存在于滑动面之间的润滑油含有至少包含钼和硫的化合物，以使得钼含量相对于润滑油不低于400ppm。

5. 发明授权

US06537630B1 Bow-molded hoses and apparatuses for producing the same 失效
标题翻译：弓形软管及其制造装置
公开(公告)号：US06537630B1
公开(公告)日：2003-03-25
申请号：US09651318
申请日：2000-08-31
申请人： Masaaki Ogawa
发明人： Masaaki Ogawa
IPC分类号： F16L1100
CPC分类号： B29C47/065 , B29C47/0023 , B29C47/0026 , B29C47/062 , B29C47/22 , B29C47/26 , B29C47/268 , B29C47/28 , B29C49/04 , B29C49/041 , Y10T428/1352 , Y10T428/139 , Y10T428/1393
摘要： The blow-molded hose of a synthetic resin of the present invention is produced by blow-molding a single parison comprising a soft resin and a hard resin. The blow-molded hose comprises a monolayer (or single-layer) segment formed with either a soft resin layer or a hard resin layer and multilayer laminating) segment formed with the soft resin layer and the hard resin layer, wherein, in the multilayer (laminating) segment, the thickness of the resin layer forming the monolayer segment is thinner than that of the other resin layer. Practically, the monolayer segment comprises the soft resin layer and forms the connection end(s) at the end(s) of the hose.
摘要翻译：本发明的合成树脂的吹塑软管通过对包含软树脂和硬树脂的单一型坯进行吹塑来制造。吹塑软管包括由软树脂层和硬树脂层形成的单层（或单层）段，其形成有软树脂层或硬树脂层和多层层合）段，其中在多层（层叠），形成单层链段的树脂层的厚度比其他树脂层的厚度薄。实际上，单层段包括软树脂层，并在软管的端部形成连接端。

6. 发明授权

US5730278A Transfer feeder 失效
标题翻译：输送机
公开(公告)号：US5730278A
公开(公告)日：1998-03-24
申请号：US492094
申请日：1995-06-29
申请人： Kiyokazu Baba , Masaaki Ogawa
发明人： Kiyokazu Baba , Masaaki Ogawa
IPC分类号： B21D43/05 , B65G25/00
CPC分类号： B21D43/055 , B21D43/05 , B21D43/052
摘要： A transfer feeder for a module-type transfer press, wherein the module-type transfer press includes a plurality of slides, a crown having a plurality of crown portions for each of the respective slides, and respective slide drive mechanisms accommodated in each of the crown portions for driving the respective slides. The transfer feeder includes a lift drive mechanism and a feed drive mechanism disposed in an upper portion of the transfer press. The lift drive mechanism is driven by a lift drive source. The feed drive mechanism is accommodated in an upstream one of the crown portions which is disposed on an upstream side of the transfer press, and is driven by power derived from the slide drive mechanism accommodated in the upstream one of the crown portions.
摘要翻译： PCT No.PCT / JP94 / 00074 Sec。 371日期：1995年6月29日 102（e）1995年6月29日PCT PCT 1994年1月20日PCT公布。公开号WO94 / 16840 日本1994年8月4日用于模块式转印压机的转印给料机，其中模块型转印机包括多个滑动件，具有用于各个滑块的多个冠部的表冠，以及容纳各自的滑动驱动机构在每个冠部中用于驱动各个滑块。传送给料机包括提升驱动机构和设置在转印机上部的进给驱动机构。提升驱动机构由提升驱动源驱动。供给驱动机构容纳在设置在转印压力机的上游侧的冠部中的上游侧，并且由从容纳在上游侧冠部中的滑动驱动机构的动力驱动。

7. 发明授权

US5637894A Solid state image sensor device with single-layered transfer electrodes 失效
标题翻译：具有单层转移电极的固态图像传感器装置
公开(公告)号：US5637894A
公开(公告)日：1997-06-10
申请号：US544834
申请日：1995-10-18
申请人： Masako Hori , Masaaki Ogawa , Hidenori Shibata , Yoshiyuki Shioyama , Yutaka Koshino
发明人： Masako Hori , Masaaki Ogawa , Hidenori Shibata , Yoshiyuki Shioyama , Yutaka Koshino
IPC分类号： G09F9/00 , H01L21/339 , H01L27/148 , H01L29/762
CPC分类号： H01L27/14831
摘要： A charge coupled device, together with a method for manufacturing the device, is provided which can eliminate a conventional problem, that is, the remaining of a light-receiving film at a great step area and a consequent lowering of a sensitivity resulting from the shutting-off of a portion of incident light. In the charge coupled device, insulating areas are formed in substantially strip-like array on a silicon substrate. Respective transfer electrodes are formed on a gate insulating film on a semiconductor substrate with an insulating areas interposed. The respective phase transfer electrodes are electrically separated by the insulating area. By doing so, the respective phase transfer electrodes can be formed on the same plane without leaving a greater step. This can achieve a thinned light shielding film.
摘要翻译：提供了电荷耦合器件，以及用于制造器件的方法，其可以消除常规问题，即，在大步进区域处的光接收膜的剩余部分以及由此导致的灵敏度的降低一部分入射光。在电荷耦合器件中，绝缘区域在硅衬底上形成为大致带状的阵列。各个传输电极形成在半导体衬底上的绝缘膜上的绝缘膜上。各个相转移电极被绝缘区域电隔离。通过这样做，各个相转移电极可以形成在同一平面上，而不会留下更大的台阶。这可以实现减薄的遮光膜。

8. 发明授权

US5589205A Apparatus for manufacturing hollow resin products 失效
标题翻译：中空树脂制品的制造装置
公开(公告)号：US5589205A
公开(公告)日：1996-12-31
申请号：US329648
申请日：1994-10-25
申请人： Hajime Ishikawa , Masaaki Ogawa , Ryosuke Hasegawa , Hideo Yamamoto
发明人： Hajime Ishikawa , Masaaki Ogawa , Ryosuke Hasegawa , Hideo Yamamoto
IPC分类号： B29B11/10 , B29C31/04 , B29C49/02 , B29C49/04 , B29C49/28 , B29C49/42 , B29C49/48 , B29C49/56 , B29C49/64 , B29L22/00
CPC分类号： B29C49/4242 , B29C49/4205 , B29C49/04
摘要： An apparatus for manufacturing hollow resin products. The apparatus includes an extruder for extruding a tubular resin material and cutting the material into a parison with a specified length; a blow molding machine having an upper mold and a lower mold which form a cavity of a specified shape inside; and a parison delivering machine for receiving the parison from the extruder and feeding the parison into the cavity of the lower mold. The parison delivering machine includes a conveyer which has parison feeder for feeding a parison longitudinally from an inlet to an outlet, a driver for driving the feeder, and at least four shafts which serve as pivots of three-dimensional movement of the conveyor.
摘要翻译：一种中空树脂制品的制造装置。该装置包括用于挤出管状树脂材料并将材料切割成具有特定长度的型坯的挤出机; 具有上模具和下模具的吹塑机，其在内部形成指定形状的空腔; 以及用于从挤出机接收型坯的型坯输送机，并将型坯送入下模具的型腔。型坯输送机包括输送机，该输送机具有型坯进料器，用于将型坯从入口纵向输送到出口，用于驱动进料器的驱动器，以及用作输送机三维运动枢轴的至少四个轴。

9. 发明授权

US5250140A Device having raised side edge portions for heat-sealing tubular packaging material 失效
标题翻译：具有用于热封管状包装材料的侧边缘部分升高的装置
公开(公告)号：US5250140A
公开(公告)日：1993-10-05
申请号：US777707
申请日：1991-10-18
申请人： Kojiro Hayashi , Fumiyuki Iwano , Yoichi Nishiguchi , Hisao Takahashi , Masaaki Ogawa , Yoshio Kobashi
发明人： Kojiro Hayashi , Fumiyuki Iwano , Yoichi Nishiguchi , Hisao Takahashi , Masaaki Ogawa , Yoshio Kobashi
IPC分类号： B65B51/10 , B29C65/00 , B29C65/02 , B65B51/22 , B65D51/10 , B32B31/24
CPC分类号： B29C66/72321 , B29C65/3656 , B29C65/3668 , B29C65/368 , B29C65/745 , B29C66/1122 , B29C66/3242 , B29C66/328 , B29C66/346 , B29C66/4312 , B29C66/72328 , B29C66/7373 , B29C66/73921 , B29C66/8126 , B29C66/81427 , B29C66/81431 , B29C66/81811 , B29C66/81871 , B29C66/83241 , B29C66/83543 , B29C66/849 , B65B51/227 , B29C66/71 , B29C66/8122 , B29C66/81422 , B29C66/81429 , B29K2705/02 , B29K2995/0008
摘要： A heat sealing device for a tubular packaging material which is made of a heat-sealable paper-base laminate having an aluminum foil layer and which is to be cut transversely thereof into lengths comprises a U-shaped high-frequency coil provided in a pressing surface of one of a pair of press members and having two straight portions extending in parallel to each other for heating the packaging material at opposite sides of each cutting portion therealong. Two strip-like magnetic members are arranged on the outer side of the respective straight portions and extend approximately over the entire length of the straight portions. Each of the two straight portions has a ridge extending longitudinally of the straight portion at each of two portions of the entire length thereof for individually applying an increased pressure to opposite side edge portions of the material. The ridge has a circular-arc contour in cross section.

10. 发明授权

US09444012B2 Semiconductor light emitting device and method for manufacturing the same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US09444012B2
公开(公告)日：2016-09-13
申请号：US13037990
申请日：2011-03-01
申请人： Koji Asakawa , Akira Fujimoto , Ryota Kitagawa , Takanobu Kamakura , Shinji Nunotani , Eishi Tsutsumi , Masaaki Ogawa
发明人： Koji Asakawa , Akira Fujimoto , Ryota Kitagawa , Takanobu Kamakura , Shinji Nunotani , Eishi Tsutsumi , Masaaki Ogawa
IPC分类号： H01L33/00 , H01L33/38 , H01L33/40
CPC分类号： H01L33/38 , H01L33/405 , H01L2933/0016
摘要： A semiconductor light emitting device includes a structural body, a first electrode layer, and a second electrode layer. The structural body includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer between the first and second semiconductor layers. The first electrode layer includes a metal portion, plural first opening portions, and at least one second opening portion. The metal portion has a thickness of not less than 10 nanometers and not more than 200 nanometers along a direction from the first semiconductor layer toward the second semiconductor layer. The plural first opening portions each have a circle equivalent diameter of not less than 10 nanometers and not more than 1 micrometer. The at least one second opening portion has a circle equivalent diameter of more than 1 micrometer and not more than 30 micrometers.
摘要翻译：半导体发光器件包括结构体，第一电极层和第二电极层。结构体包括第一导电类型的第一半导体层，第二导电类型的第二半导体层和第一和第二半导体层之间的发光层。第一电极层包括金属部分，多个第一开口部分和至少一个第二开口部分。金属部分沿着从第一半导体层朝向第二半导体层的方向具有不小于10纳米且不大于200纳米的厚度。多个第一开口部各自具有不小于10纳米且不大于1微米的圆当量直径。至少一个第二开口部分具有大于1微米且不超过30微米的圆当量直径。

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