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31. 发明授权

US08004950B2 Optical pickup, optical information recording and reproducing apparatus and method for optically recording and reproducing information 有权
标题翻译：用于光学记录和再现信息的光学拾取器，光学信息记录和再现装置和方法
公开(公告)号：US08004950B2
公开(公告)日：2011-08-23
申请号：US12038174
申请日：2008-02-27
申请人： Tatsuro Ide , Kenichi Shimada , Masahiko Takahashi , Takeshi Shimano , Kevin R. Curtis , Ken E. Anderson
发明人： Tatsuro Ide , Kenichi Shimada , Masahiko Takahashi , Takeshi Shimano , Kevin R. Curtis , Ken E. Anderson
IPC分类号： G11B7/00
CPC分类号： G11B7/00772 , G03H1/041 , G11B7/1353 , G11B7/1378
摘要： An optical pickup for recording a hologram by using an angle multiplexing method. An optical beam is separated into two beams, a signal beam and a reference beam having different convergence/divergence degrees, by using an optical component such as a diffraction lens. The signal and reference beams are made incident upon the same objective, and the optical component or the objective lens is moved in a direction perpendicular to an optical axis, to thereby realize angle multiplex recording. If an optical information recording medium is inclined, the optical component or the objective lens is moved along the direction along which the optical information recording medium moved to change an angle of the reference beam incident upon the optical information recording medium and compensate for degradation of a reproduction signal.
摘要翻译：一种用于通过使用角度复用方法记录全息图的光学拾取器。通过使用诸如衍射透镜的光学部件，将光束分离成两束，信号光束和具有不同会聚/发散度的参考光束。信号和参考光束入射到相同的物镜上，并且光学部件或物镜在垂直于光轴的方向上移动，从而实现角度多路复用记录。如果光学信息记录介质倾斜，则光学部件或物镜沿着光学信息记录介质移动的方向移动以改变入射在光学信息记录介质上的参考光束的角度并补偿光学信息记录介质的劣化再现信号。

32. 发明申请

US20100271921A1 OPTICAL INFORMATION RECORDING MEDIUM, OPTICAL INFORMATION RECORDING/REPRODUCING DEVICE AND OPTICAL INFORMATION RECORDING/REPRODUCING METHOD 有权
标题翻译：光信息记录介质，光信息记录/再现设备和光信息记录/再现方法
公开(公告)号：US20100271921A1
公开(公告)日：2010-10-28
申请号：US12680612
申请日：2008-08-06
申请人： Kenichi Shimada , Tatsuro Ide , Takeshi Shimano , Harukazu Miyamoto
发明人： Kenichi Shimada , Tatsuro Ide , Takeshi Shimano , Harukazu Miyamoto
IPC分类号： G11B7/00
CPC分类号： G03H1/02 , G03H1/0256 , G03H1/22 , G03H2222/56 , G03H2223/19 , G03H2223/24 , G03H2250/33 , G03H2250/42 , G11B7/0065 , G11B7/24044
摘要： A holographic recording medium in which information can be reproduced by phase conjugate beam without requiring a mirror for obtaining the phase conjugate beam and its driving part and recording density is not reduced. The recording medium includes a recording layer in which an interference pattern is recorded and a light absorption/transmission layer which can be reversibly changed to be in a first state where signal beam and reference beam passed through the recording layer are absorbed at the time of recording of information and a second state where the reference beam is transmitted at the time of reproduction of information, and the reference beam transmitted through the light absorption/transmission layer is reflected by a reflection layer to produce the phase conjugate beam.
摘要翻译：可以通过相位共轭光再现信息的全息记录介质，而不需要用于获得相位共轭光束的反射镜及其驱动部分和记录密度。记录介质包括其中记录有干涉图案的记录层和可以可逆地改变为在记录时吸收信号束和参考光束通过记录层的第一状态的光吸收/透射层的信息和在再现信息时发送参考光束的第二状态，并且通过光吸收/透射层透射的参考光束被反射层反射以产生相位共轭光束。

33. 发明授权

US07737366B2 Multilayer printed wiring board with filled viahole structure 有权
标题翻译：多层印刷线路板，带有通孔结构
公开(公告)号：US07737366B2
公开(公告)日：2010-06-15
申请号：US12164710
申请日：2008-06-30
申请人： Seiji Shirai , Kenichi Shimada , Motoo Asai
发明人： Seiji Shirai , Kenichi Shimada , Motoo Asai
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H05K3/4661 , H05K3/108 , H05K3/381 , H05K3/382 , H05K3/421 , H05K3/423 , H05K2201/0129 , H05K2201/015 , H05K2201/0278 , H05K2201/09563 , H05K2201/096 , H05K2201/09745 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917 , Y10T428/31681
摘要： A multilayer printed wiring board having a multilayered structure including multiple conductor circuit layers and multiple interlaminar insulative layers, the conductor layers having one or more conductor circuit portions, the interlaminar insulative resin layers including the outermost interlaminar insulative resin layer forming the outermost layer of the multilayered structure, a filled-viahole formed in the outermost interlaminar insulative resin layer and made of one or more metal plating filling and completely closing a hole formed through the outermost interlaminar insulative resin layer, the metal plating of the filled-viahole extending out of the hole and having a substantially flat surface, the filled-viahole electrically connected to the conductor circuit portion in the conductor circuit layers, and a solder bump formed on the substantially flat surface of the filled-viahole.
摘要翻译：一种多层印刷线路板，具有包括多个导体电路层和多个层间绝缘层的多层结构，所述导体层具有一个或多个导体电路部分，所述层间绝缘树脂层包括形成所述多层的最外层的最外层间绝缘树脂层结构，形成在最外层间绝缘树脂层中的填充通孔，并由一个或多个金属电镀填充并且完全闭合通过最外层间绝缘树脂层形成的孔，填充通孔延伸出孔的金属电镀并且具有基本上平坦的表面，电连接到导体电路层中的导体电路部分的填充通孔以及形成在填充通孔的基本上平坦表面上的焊料凸块。

34. 再颁专利

USRE40947E1 Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole 失效
公开(公告)号：USRE40947E1
公开(公告)日：2009-10-27
申请号：US10829479
申请日：1990-10-12
申请人： Motoo Asai , Kenichi Shimada , Kouta Noda , Takashi Kariya , Hiroshi Segawa
发明人： Motoo Asai , Kenichi Shimada , Kouta Noda , Takashi Kariya , Hiroshi Segawa
IPC分类号： B32B3/00
CPC分类号： B32B3/00 , H05K3/0094 , H05K3/383 , H05K3/384 , H05K3/385 , H05K3/4069 , H05K3/4602 , H05K2201/0209 , H05K2201/0212 , H05K2201/0215 , H05K2201/0257 , H05K2201/0347 , H05K2201/09536 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , Y10S428/901 , Y10T428/24917
摘要： A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.

35. 发明申请

US20090189631A1 MOVEMENT APPARATUS AND ELECTRONIC DEVICE TEST APPARATUS 审中-公开
标题翻译：运动装置和电子装置测试装置
公开(公告)号：US20090189631A1
公开(公告)日：2009-07-30
申请号：US12280757
申请日：2007-02-21
申请人： Kenichi Shimada , Yoshiyuki Masuo
发明人： Kenichi Shimada , Yoshiyuki Masuo
IPC分类号： G01R31/26
CPC分类号： G01R31/2893
摘要： An air cylinder raising and lowering a pickup head for holding an IC device in an electronic device test apparatus, the air cylinder includes a cylinder tube; a piston; a first hollow chamber formed below the piston; a second hollow chamber formed above the piston and being larger than the first hollow chamber in terms of a pressure receiving area of the piston; and a rod with one end coupled with the piston and the other end coupled with the pickup head. The first hollow chamber is connected to the air feed device via a first feed system in which the air feed is secured even if the electric power supply of the electronic device test apparatus is cut off, and the second hollow chamber is connected to the air feed device via a second feed system having a shutoff valve.
摘要翻译：一种用于将IC器件保持在电子设备测试装置中的用于升高和降低拾取头的气缸，气缸包括气缸筒; 活塞形成在活塞下方的第一中空室; 形成在活塞上方的第二中空室，并且在活塞的受压面积方面大于第一中空室; 以及杆，其一端与活塞联接，另一端与拾取头相连。第一中空室经由第一进料系统连接到空气供给装置，即使电子装置测试装置的电力供应被切断，空气进料被固定，第二中空室连接到空气进料装置通过具有截止阀的第二进料系统。

36. 发明申请

US20090080313A1 Optical Information Recording and Reproducing Device 有权
标题翻译：光信息记录和再现设备
公开(公告)号：US20090080313A1
公开(公告)日：2009-03-26
申请号：US12116245
申请日：2008-05-07
申请人： Kenichi Shimada , Tatsuro Ide
发明人： Kenichi Shimada , Tatsuro Ide
IPC分类号： G11B7/00
CPC分类号： G03H1/18 , G03H1/181 , G03H1/182 , G11B7/0065 , G11B7/127 , G11B7/13 , G11B7/1365 , G11B7/1369 , G11B7/1378 , G11B2007/0006
摘要： The optical information recording and reproducing device utilizing holography requires the optical system to generate the signal beam and the reference beam to be irradiated to the holographic storage medium as well as another optical system to generate the curing light beam to be irradiated to the holographic storage medium. Furthermore, from the viewpoint of backward compatibility, if the same device is used for recording or reproduction on the conventional optical discs represented by Blu-ray Disc, another optical system adaptable to recording and reproduction on these optical disks is required. This means the optical system configurations become complicated and larger in size. One solution for downsizing is to use the reference beam also as the curing light beam. Another way is sharing of optical path for curing light beam and for the reference beam. Furthermore, it is possible to share the light source for generating the curing light beam and for generating the recording or reproducing light beam. In such way, optical system configurations become simple.
摘要翻译：利用全息术的光学信息记录和再现装置需要光学系统产生要照射到全息存储介质的信号光束和参考光束以及另一个光学系统，以产生照射到全息存储介质的固化光束。此外，从向后兼容性的观点出发，如果在由蓝光光盘所表示的传统光盘上使用相同的设备进行记录或再现，则需要在这些光盘上适用于记录和再现的另一光学系统。这意味着光学系统的配置变得复杂并且尺寸更大。用于小型化的一个解决方案是使用参考光束也作为固化光束。另一种方式是共享用于固化光束和参考光束的光路。此外，可以共享用于产生固化光束的光源和用于产生记录或再现光束。以这种方式，光学系统配置变得简单。

37. 发明授权

US07504719B2 Printed wiring board having a roughened surface formed on a metal layer, and method for producing the same 有权
标题翻译：在金属层上形成有粗糙面的印刷电路板及其制造方法
公开(公告)号：US07504719B2
公开(公告)日：2009-03-17
申请号：US11188886
申请日：2005-07-26
申请人： Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
发明人： Honchin En , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
IPC分类号： H01L23/12 , H01L21/4763
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
摘要翻译：本发明的目的在于提供一种多层印刷电路板，其特征在于其具有非常好的韧性，介电常数，粘合性和可加工性。本发明涉及一种多层印刷电路板，其包括基板，形成在所述基板上的树脂绝缘层和在所述树脂绝缘层上构成的导体电路，其中所述树脂绝缘层包括聚烯烃树脂。

38. 发明授权

US07471077B2 Conveyor device, electronic device handling apparatus and conveying method in electronic device handling apparatus 有权
标题翻译：电子装置处理装置中的输送装置，电子装置处理装置及输送方法
公开(公告)号：US07471077B2
公开(公告)日：2008-12-30
申请号：US11294341
申请日：2005-12-06
申请人： Kenichi Shimada , Tadashi Kainuma
发明人： Kenichi Shimada , Tadashi Kainuma
IPC分类号： G01R31/28
CPC分类号： H01L21/67333 , G01R31/2893 , H05K13/0084 , H05K13/021
摘要： A tray transfer arm 205 capable of holding and releasing a customer tray KST is movable in a Z-axis direction by a Z-axis drive, and the Z-axis drive is capable of switching a moving operation from a normal operation to a torque restriction operation while moving the tray transfer arm 205 downward in the Z-axis direction.
摘要翻译：能够保持和释放顾客托盘KST的托盘传送臂205可以通过Z轴驱动在Z轴方向上移动，并且Z轴驱动器能够将移动操作从正常操作切换到扭矩限制同时使托盘传送臂205沿Z轴方向向下移动。

39. 发明申请

US20080289864A1 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 有权
公开(公告)号：US20080289864A1
公开(公告)日：2008-11-27
申请号：US12146105
申请日：2008-06-25
申请人： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
发明人： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
IPC分类号： H05K1/09
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

40. 发明申请

US20080289176A1 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20080289176A1
公开(公告)日：2008-11-27
申请号：US12146204
申请日：2008-06-25
申请人： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
发明人： Honchin EN , Masayuki Hayashi , Dongdong Wang , Kenichi Shimada , Motoo Asai , Koji Sekine , Tohru Nakai , Shinichiro Ichikawa , Yukihiko Toyoda
IPC分类号： H05K3/00
CPC分类号： C23G1/10 , H01L2924/0002 , H05K3/0094 , H05K3/062 , H05K3/067 , H05K3/108 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/4602 , H05K3/4644 , H05K3/4661 , H05K2201/0129 , H05K2201/0158 , H05K2201/0338 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2203/0307 , H05K2203/0315 , H05K2203/072 , H05K2203/1105 , Y10T29/49124 , Y10T29/49151 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , Y10T428/24917 , H01L2924/00
摘要： The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.
摘要翻译：本发明的目的在于提供一种多层印刷电路板，其特征在于其具有非常好的韧性，介电常数，粘合性和可加工性。本发明涉及一种多层印刷电路板，其包括基板，形成在所述基板上的树脂绝缘层和在所述树脂绝缘层上构成的导体电路，其中所述树脂绝缘层包括聚烯烃树脂。

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