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31. 发明申请

US20100233627A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PLASMA DISPLAY PANEL 审中-公开
标题翻译：感光性树脂组合物，耐热性图案的制造方法，制造印刷线路板的方法以及用于制造等离子显示面板的基板的方法
公开(公告)号：US20100233627A1
公开(公告)日：2010-09-16
申请号：US12280247
申请日：2007-02-20
申请人： Takashi Kumaki , Masahiro Miyasaka
发明人： Takashi Kumaki , Masahiro Miyasaka
IPC分类号： G03F7/20 , G03F7/004
CPC分类号： G03F7/027 , G03F7/0007
摘要： A photosensitive resin composition comprising (A) a binder polymer with a weight-average molecular weight of 35000 to 65000, (B) a photopolymerizable compound with an ethylenically unsaturated bond and (C) a photopolymerization initiator, wherein component (B) includes (B1) a photopolymerizable compound with one ethylenically unsaturated bond, (B2) a photopolymerizable compound with two ethylenically unsaturated bonds and (B3) a photopolymerizable compound with three ethylenically unsaturated bonds, and the proportion of component (B3) with respect to the total of component (B) is 15 to 30 wt %.
摘要翻译：一种感光性树脂组合物，其含有（A）重均分子量为35000〜65000的粘合剂聚合物，（B）具有烯键式不饱和键的光聚合性化合物和（C）光聚合引发剂，其中，成分（B））具有一个烯键式不饱和键的光聚合化合物，（B2）具有两个烯键式不饱和键的光聚合化合物和（B3）具有三个烯属不饱和键的光聚合化合物，以及组分（B3）相对于组分 B）为15〜30重量％。

32. 发明授权

US07785708B2 Adhesive film for circuit connection, and circuit connection structure 失效
标题翻译：电路连接用胶带，电路连接结构
公开(公告)号：US07785708B2
公开(公告)日：2010-08-31
申请号：US11029628
申请日：2005-01-06
申请人： Takashi Tatsuzawa , Itsuo Watanabe , Naoki Fukushima , Masahide Kume
发明人： Takashi Tatsuzawa , Itsuo Watanabe , Naoki Fukushima , Masahide Kume
IPC分类号： B32B15/04
CPC分类号： H01L24/83 , C09J7/10 , C09J2433/00 , H01L23/4828 , H01L24/29 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/2919 , H01L2224/83101 , H01L2224/838 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H05K3/323 , Y10T428/24917 , Y10T428/2857 , Y10T428/2896 , H01L2924/00
摘要： The present invention provides an adhesive film for circuit connection which is to be interposed between circuit electrodes facing each other and used for electrically connecting the circuit electrodes to each other, which comprises a curing agent to generate free radicals with heating, a radically polymerizable substance, and a film-forming polymer, and in which a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m.
摘要翻译：本发明提供了一种用于电路连接的粘合膜，其被插入在彼此面对的电路电极之间并且用于将电路电极彼此电连接，其包括固化剂以加热产生自由基，可自由基聚合的物质，和成膜聚合物，并且其中具有电路电极的柔性基板的临时固定电力为40-180N / m。

33. 发明申请

US20100210109A1 CMP POLISHING SLURRY AND METHOD OF POLISHING SUBSTRATE 有权
标题翻译： CMP抛光浆料和抛光底材的方法
公开(公告)号：US20100210109A1
公开(公告)日：2010-08-19
申请号：US12768082
申请日：2010-04-27
申请人： Masato Fukasawa , Naoyuki Koyama , Kouji Haga , Toshiaki Akutsu
发明人： Masato Fukasawa , Naoyuki Koyama , Kouji Haga , Toshiaki Akutsu
IPC分类号： C09K13/00 , H01L21/461
CPC分类号： C09K3/1463 , C09G1/02
摘要： A CMP polishing slurry of the present invention contains cerium oxide particles, water, and a polymer of at least one of a methacrylic acid and the salt thereof, and/or a polymer of at least one of a methacrylic acid and the salt thereof and a monomer having an unsaturated double bond, preferably contains furthermore a dispersant or a polymer of monomers containing at least one of an acrylic acid and the salt thereof. The present invention provides a CMP polishing slurry and a polishing method that, after polishing, give a polished film having a smaller difference in residual film thickness due to a pattern density difference.
摘要翻译：本发明的CMP抛光浆料含有氧化铈颗粒，水和甲基丙烯酸及其盐中的至少一种的聚合物和/或甲基丙烯酸及其盐中的至少一种的聚合物和具有不饱和双键的单体优选还含有分散剂或含有丙烯酸及其盐中的至少一种的单体的聚合物。本发明提供一种CMP抛光浆料和抛光方法，其在抛光后由于图案密度差而产生具有较小残留膜厚差异的抛光膜。

34. 发明申请

US20100140638A1 THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, METHOD FOR MANUFACTURING THE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION 有权
标题翻译：用于光反射的热固性树脂组合物，用于制造树脂组合物的方法和使用树脂组合物的光学半导体元件安装基板和光学半导体器件
公开(公告)号：US20100140638A1
公开(公告)日：2010-06-10
申请号：US12515182
申请日：2007-11-14
申请人： Hayato Kotani , Naoyuki Urasaki , Kanako Yuasa , Akira Nagai , Mitsuyoshi Hamada
发明人： Hayato Kotani , Naoyuki Urasaki , Kanako Yuasa , Akira Nagai , Mitsuyoshi Hamada
IPC分类号： H01L33/00 , C08L63/00 , C08K3/36 , C08K3/22 , C08K3/26
CPC分类号： H01L33/60 , B29C45/0001 , B29C45/02 , B29L2011/00 , C08G59/4014 , C08G59/4215 , C08K3/013 , C08K3/2279 , C08K7/24 , C08K7/28 , C08K2003/222 , C08K2003/2227 , C08K2003/2241 , C08K2003/2244 , C08L63/00 , C08L63/06 , H01L33/486 , H01L33/507 , H01L33/56 , H01L2224/16245 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.
摘要翻译：本发明提供了一种用于光反射的热固性树脂组合物，其在固化后可在可见光到近紫外光的范围内实现高反射率，具有优异的耐热劣化性和片剂成型性，并且在转印期间不太可能引起毛刺成型，以及树脂组合物的制造方法以及使用该树脂组合物的光半导体元件安装基板和光半导体装置。用于光反射的热固化树脂组合物包括热固化组分和白色颜料，其特征在于在成型温度为100℃至200℃的条件下在传递模塑时引起的毛刺长度，成型压力不大于 20MPa，成型时间60〜120秒不大于5mm，并且在350nm至800nm的波长下热固化后的光反射率不小于80％。该树脂组合物可用于构造光学半导体元件安装基板和光学半导体器件。

35. 发明申请

US20100120250A1 METAL POLISHING SLURRY AND POLISHING METHOD 有权
标题翻译：金属抛光浆和抛光方法
公开(公告)号：US20100120250A1
公开(公告)日：2010-05-13
申请号：US12527607
申请日：2008-02-22
申请人： Jin Amanokura , Takafumi Sakurada , Sou Anzai , Takashi Shinoda , Shigeru Nobe
发明人： Jin Amanokura , Takafumi Sakurada , Sou Anzai , Takashi Shinoda , Shigeru Nobe
IPC分类号： H01L21/302 , H01L21/304 , H01L21/306 , C09K13/00 , C09K13/04 , C09K13/06
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463 , C23F1/18 , C23F1/26 , H01L21/30625 , H01L21/3212
摘要： The present invention relates to a metal polishing slurry containing abrasive grains, a metal-oxide-dissolving agent, and water, wherein the abrasive grains contain two or more abrasive grain species different from each other in average secondary particle diameter. Using the metal polishing slurry of the present invention, a metal polishing slurry can be obtained which gives a large polishing rate of an interlayer dielectric layer, and is high in the flatness of the polished surface. This metal polishing slurry can provide suitable method for a semiconductor device which is excellent in being made finer and thinner and in dimension precision and in electric characteristics, is high in reliability, and can attain a decrease in costs.
摘要翻译：本发明涉及含有磨粒，金属氧化物溶解剂和水的金属抛光浆料，其中磨粒含有平均二次粒径彼此不同的两种或更多种磨粒。使用本发明的金属研磨浆，可以得到层状电介质层的研磨速度大的金属研磨浆料，并且抛光面的平坦度高。这种金属抛光浆料可以提供适合于制造更细和更薄，尺寸精度和电特性优异的可靠性高的半导体器件的方法，并且可以降低成本。

36. 发明授权

US07707211B2 Information management system and method 有权
标题翻译：信息管理系统和方法
公开(公告)号：US07707211B2
公开(公告)日：2010-04-27
申请号：US11558026
申请日：2006-11-09
申请人： Munetatsu Fukuda , Koshichiro Mitsukuni , Naoki Takahashi , Kazuki Kojima , Shinichi Kirikoshi , Eisuke Nishitsu , Minoru Oshino , Akira Nishimura
发明人： Munetatsu Fukuda , Koshichiro Mitsukuni , Naoki Takahashi , Kazuki Kojima , Shinichi Kirikoshi , Eisuke Nishitsu , Minoru Oshino , Akira Nishimura
IPC分类号： G06F17/30 , G06F7/00
CPC分类号： G06F17/30604
摘要： To obtain information having a relation, it is required for an application program to execute retrieval processing in which the program first acquires key information supervising relations between tables to sequentially trace the relations to finally obtain the target information. Since it is required for the program to execute as many access operations as there are hierarchic level of relations, the access efficiency is lowered. By establishing a correspondence between first relating information representing relations between a first table and a second table and second relating information, path information representing hierarchic structure of data between a plurality of tables is stored in a storage. Various processings are executed by use of the path information.
摘要翻译：为了获得具有关系的信息，应用程序需要执行检索处理，其中程序首先获取监视表之间的关键信息，以顺序追踪关系以最终获得目标信息。由于程序需要执行与层次关系级别相同数量的访问操作，所以访问效率降低。通过建立表示第一表和第二表之间的关系的第一关联信息与第二相关信息之间的对应关系，表示表示多个表之间的数据层次结构的路径信息存储在存储器中。通过使用路径信息执行各种处理。

37. 发明授权

US07675185B2 Epoxy resin molding material for sealing and electronic component 有权
标题翻译：用于密封和电子元件的环氧树脂成型材料
公开(公告)号：US07675185B2
公开(公告)日：2010-03-09
申请号：US10596387
申请日：2004-12-06
申请人： Kazuyoshi Tendou , Mitsuo Katayose
发明人： Kazuyoshi Tendou , Mitsuo Katayose
IPC分类号： H01L23/29 , C08L63/00 , C08K7/16 , C08K5/01
CPC分类号： C08G59/621 , C08K5/0041 , C08K5/5399 , C08L63/00 , H01L23/293 , H01L2924/0002 , C08L95/00 , H01L2924/00
摘要： An epoxy resin molding material for sealing which comprises an epoxy resin, an epoxy resin curing agent, and a pitch, as well as an electronic component comprising an element that is sealed with the molding material. This molding material exhibits favorable coloring properties, and even when used in packages with narrow distances between pads or wires, shorting defects caused by conductive materials can be prevented, as the molding material contains no conductive carbon black.
摘要翻译：包含环氧树脂，环氧树脂固化剂和沥青的用于密封的环氧树脂模制材料以及包含用模制材料密封的元件的电子部件。该成型材料具有良好的着色性，即使在垫片或电线之间的距离较窄的包装中使用时，也可以防止导电材料引起的短路缺陷，因为成型材料不含导电性炭黑。

38. 发明授权

US07638564B2 Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish 失效
标题翻译：低介电损耗切线树脂清漆，预浸料，层压板和使用清漆的印刷线路板
公开(公告)号：US07638564B2
公开(公告)日：2009-12-29
申请号：US11529661
申请日：2006-09-29
申请人： Satoru Amou , Haruo Akahoshi , Yoshihiro Nakamura , Nobuyuki Minami , Yasuhiro Murai
发明人： Satoru Amou , Haruo Akahoshi , Yoshihiro Nakamura , Nobuyuki Minami , Yasuhiro Murai
IPC分类号： C08K5/3447 , C08K5/03 , C08K3/34
CPC分类号： B32B5/26 , B32B5/022 , B32B15/14 , B32B15/20 , B32B2255/02 , B32B2262/02 , B32B2262/10 , B32B2307/3065 , C08J5/24 , C08J2371/12 , C08K3/36 , C08K5/0066 , H05K1/0373 , H05K3/4626 , H05K2201/012 , H05K2201/0133 , H05K2201/0209 , Y10T428/25 , Y10T428/259
摘要： There is provided a varnish of a low dielectric loss tangent resin composition which is low in viscosity and excellent in storage stability. The varnish of a low dielectric loss tangent resin composition contains a thermosetting monomer (A) having a weight average molecular weight of not more than 1,000, a high polymer (B) having a weight average molecular weight of not less than 5,000, a halogen flame-retardant agent (C), a silicon dioxide filler (D), and an organic solvent (E). The average particle diameter of each the components (C) and (D) is in the range of 0.2 to 3 μm.
摘要翻译：提供了一种低介电损耗角正切树脂组合物的清漆，其粘度低，储存稳定性优异。低介电损耗角正切树脂组合物的清漆含有重均分子量不大于1000的热固性单体（A），重均分子量不小于5,000的高聚物（B），卤素火焰缓冲剂（C），二氧化硅填料（D）和有机溶剂（E）。各成分（C）和（D）的平均粒径为0.2〜3μm的范围。

39. 发明申请

US20090314343A1 PV MODULE AND METHOD FOR MANUFACTURING PV MODULE 审中-公开
标题翻译： PV模块和PV模块的制造方法
公开(公告)号：US20090314343A1
公开(公告)日：2009-12-24
申请号：US12524082
申请日：2008-02-26
申请人： Kaoru Okaniwa , Takehiro Shimizu , Hiroaki Morikawa
发明人： Kaoru Okaniwa , Takehiro Shimizu , Hiroaki Morikawa
IPC分类号： H01L31/0216 , H01L31/18
CPC分类号： H01L31/0236 , H01L31/02168 , H01L31/02363 , H01L31/048 , Y02E10/50
摘要： Provided is a photovoltaic (PV) module by which electric power generation efficiency can be improved by improving light use rate. An encapsulant (202) is permitted to be a first layer (A cover glass (201) and the encapsulant (202) are considered optically equivalent, since their refractive indexes are substantially the same), a light trapping film (300) to be a second layer, an anti-reflective layer (104) to be a third layer, and an n-type layer (103) to be a fourth layer. When the reflective indexes of the layers are expressed as first reflective index (n1), second reflective index (n2), third reflective index (n3) and fourth reflective index (n4), relationship n1≦n2≦n3≦n4 is satisfied. The light trapping film (300) of the second layer, i.e., one layer among the light transmitting layers, has a structured shape on an incident side (300a) where incident light (205) enters.
摘要翻译：提供了通过提高光利用率可以提高发电效率的光伏（PV）模块。允许密封剂（202）为第一层（盖玻璃（201），并且密封剂（202）被认为是光学等效的，因为它们的折射率基本上相同），光捕获膜（300）为第二层，作为第三层的抗反射层（104）和作为第四层的n型层（103）。当这些层的反射指数被表示为第一反射指数（n1），第二反射指数（n2），第三反射指数（n3）和第四反射指数（n4）时，关系n1 <= n2 <= n3 <= n4 满意。第二层的光捕获膜（300），即透光层中的一层，在入射光（205）入射的入射侧（300a）上具有结构形状。

40. 发明申请

US20090274583A1 MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20090274583A1
公开(公告)日：2009-11-05
申请号：US12501097
申请日：2009-07-10
申请人： Hiroshi KAWAZOE , Akishi NAKASO , Shigeharu ARIKE
发明人： Hiroshi KAWAZOE , Akishi NAKASO , Shigeharu ARIKE
IPC分类号： B01L3/00 , B32B37/00
CPC分类号： B01L3/502707 , B01J19/0093 , B01J2219/00783 , B01J2219/00788 , B01J2219/00822 , B01J2219/00833 , B01J2219/0086 , B01J2219/00869 , B01L2200/12 , B01L2300/0816 , B01L2300/0838 , B01L2300/0874 , B01L2300/0887 , B01L2400/0481 , B01L2400/0655 , B81B2201/051 , B81C1/00119 , B81C2201/019 , B81C2203/032 , Y10T156/10
摘要： A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.

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