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    • 1. 发明申请
    • PV MODULE AND METHOD FOR MANUFACTURING PV MODULE
    • PV模块和PV模块的制造方法
    • US20090314343A1
    • 2009-12-24
    • US12524082
    • 2008-02-26
    • Kaoru OkaniwaTakehiro ShimizuHiroaki Morikawa
    • Kaoru OkaniwaTakehiro ShimizuHiroaki Morikawa
    • H01L31/0216H01L31/18
    • H01L31/0236H01L31/02168H01L31/02363H01L31/048Y02E10/50
    • Provided is a photovoltaic (PV) module by which electric power generation efficiency can be improved by improving light use rate. An encapsulant (202) is permitted to be a first layer (A cover glass (201) and the encapsulant (202) are considered optically equivalent, since their refractive indexes are substantially the same), a light trapping film (300) to be a second layer, an anti-reflective layer (104) to be a third layer, and an n-type layer (103) to be a fourth layer. When the reflective indexes of the layers are expressed as first reflective index (n1), second reflective index (n2), third reflective index (n3) and fourth reflective index (n4), relationship n1≦n2≦n3≦n4 is satisfied. The light trapping film (300) of the second layer, i.e., one layer among the light transmitting layers, has a structured shape on an incident side (300a) where incident light (205) enters.
    • 提供了通过提高光利用率可以提高发电效率的光伏(PV)模块。 允许密封剂(202)为第一层(盖玻璃(201),并且密封剂(202)被认为是光学等效的,因为它们的折射率基本上相同),光捕获膜(300)为 第二层,作为第三层的抗反射层(104)和作为第四层的n型层(103)。 当这些层的反射指数被表示为第一反射指数(n1),第二反射指数(n2),第三反射指数(n3)和第四反射指数(n4)时,关系n1 <= n2 <= n3 <= n4 满意。 第二层的光捕获膜(300),即透光层中的一层,在入射光(205)入射的入射侧(300a)上具有结构形状。
    • 5. 发明授权
    • Powder removing apparatus, molding system, and method of manufacturing molded object
    • 除粉装置,成型系统及成形体的制造方法
    • US09475234B2
    • 2016-10-25
    • US13590689
    • 2012-08-21
    • Hiroaki Morikawa
    • Hiroaki Morikawa
    • B29C67/00
    • B28B17/04B29C64/153B29C64/35B29C67/0077B29C67/0096B33Y40/00
    • A powder removing apparatus includes a box, a stage moving mechanism, and a powder removing processing mechanism. The box has a main body with an opening and a stage movably provided in the main body. The box is capable of accommodating a molded object and non-bonding powder so as to arrange the molded object, which is formed using powder according to a rapid prototyping technique, on the stage together with the non-bonding powder. The stage moving mechanism is capable of moving the stage upward relative to the main body inside the main body. The powder removing processing mechanism is configured to remove the non-bonding powder existing around the molded object extruded by a driving operation of the stage moving mechanism via the opening.
    • 粉末去除装置包括盒,台移动机构和粉末去除处理机构。 该盒具有主体,其具有可移动地设置在主体中的开口和台。 该盒能够容纳模制物体和非粘合粉末,以便将与根据快速成型技术的粉末形成的成型物体一起,与非粘合粉末一起在舞台上布置。 舞台移动机构能够相对于主体内的主体向上移动舞台。 粉末去除处理机构被构造成通过该开口移除通过台架移动机构的驱动操作而挤出的成型体上存在的非粘结粉末。
    • 10. 发明申请
    • Solar Battery and Production Method Thereof
    • 太阳能电池及其制作方法
    • US20090101197A1
    • 2009-04-23
    • US11920154
    • 2005-05-11
    • Hiroaki Morikawa
    • Hiroaki Morikawa
    • H01L31/00H01L21/4763
    • H01L31/022458H01L31/048H01L31/0516H01L31/1804Y02E10/547Y02P70/521
    • Included are a semiconductor layer that is formed on a light receiving surface of a semiconductor substrate and is of a type opposite to that of said semiconductor substrate, an electrode of a semiconductor layer that is of the same type as that of the semiconductor layer of said light receiving surface and is formed on a rear surface opposite to said light receiving surface, an electrode that is of the same type as that of said semiconductor substrate and is electrically insulated from said electrode of the semiconductor layer of the same type as that of the semiconductor layer of said light receiving surface formed on said rear surface, and a semiconductor layer that is of the same type as that of the semiconductor layer of said light receiving surface and electrically connects between the semiconductor layer of said light receiving surface and said electrode of the semiconductor layer of the same type as that of the semiconductor layer of said light receiving surface formed on said rear surface.
    • 包括半导体层,其形成在半导体衬底的光接收表面上并且具有与所述半导体衬底的类型相反的类型,与所述半导体衬底的半导体层的半导体层相同类型的半导体层的电极 光接收表面并且形成在与所述光接收表面相对的后表面上,电极与所述半导体衬底的类型相同,并且与所述半导体层的与所述半导体衬底相同类型的所述电极电绝缘 形成在所述后表面上的所述光接收表面的半导体层,以及与所述光接收表面的半导体层相同类型的半导体层,并且将所述光接收表面的半导体层与所述电极之间的电极 与形成在所述光接收表面上的半导体层相同类型的半导体层 后表面。