会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 21. 发明申请
    • METHOD FOR MANUFACTURING SILICON SINGLE CRYSTAL
    • 制造硅单晶的方法
    • US20140174339A1
    • 2014-06-26
    • US14236977
    • 2012-08-02
    • Akihiro KimuraKiyotaka TakanoJunya Tokue
    • Akihiro KimuraKiyotaka TakanoJunya Tokue
    • C30B15/22
    • C30B15/22C30B15/00C30B15/10C30B29/06
    • There is provided a method for manufacturing a silicon single crystal, the method includes: a raw material melting step of melting polycrystalline silicon accommodated in a crucible to obtain a silicon melt; and bringing a seed crystal into contact with the silicon melt and pulling up the seed crystal to grow the silicon single crystal, wherein, after the raw material melting step and before the pulling step, there are performed: a cristobalitizing step of leaving the silicon melt at a predetermined number of rotations of the crucible with a predetermined gas flow rate and a predetermined furnace pressure to generate cristobalite while applying a magnetic field; and a dissolving step of partially dissolving the cristobalite by carrying out any one of an increase in number of rotations of the crucible, an increase in gas flow rate, and a reduction in furnace pressure beyond counterpart figures in the cristobalitizing step.
    • 提供一种制造单晶硅的方法,该方法包括:将容纳在坩埚中的多晶硅熔化以获得硅熔体的原料熔化步骤; 并使晶种与硅熔体接触并拉出晶种以生长硅单晶,其中在原料熔化步骤之后和拉制步骤之前,进行:将硅熔体离开的方圆化步骤 以规定的气体流量和规定的炉压进行坩埚的预定转数,以施加磁场而产生方英石; 以及通过进行坩埚转数增加,气体流量增加和炉压力下降中的任何一个部分溶解方英石的溶解步骤,超过了对立图中的曲线图。
    • 24. 发明授权
    • Single Crystal manufacturing method
    • 单晶制造方法
    • US08172943B2
    • 2012-05-08
    • US12129719
    • 2008-05-30
    • Masamichi Ohkubo
    • Masamichi Ohkubo
    • C30B15/22
    • C30B15/305C30B29/06
    • Single crystalline ingots can be stably pulled free from dislocation and with a good crystal shape by actuating a crystal driving unit so as to immerse a seed crystal in a silicon melt, and controlling the crystal driving unit and a crucible driving unit under predetermined conditions so as to pull the seed crystal. During pulling, a horizontal magnetic field positioning device applies a magnetic field in the horizontal direction to the inside of the silicon melt, fixing the magnetic field axis at a constant position from the liquid surface of the melt. Positional adjustment of the vertical position of the horizontal magnetic field is performed in advance by a magnetic field position adjusting device, and the magnetic field axis of the applied field is fixed at a constant distance lower than the liquid surface of the melt by more than 50 mm and at the same level or higher than a depth L from the melt surface at the point of tail-in.
    • 通过驱动晶体驱动单元以将晶种浸入硅熔体中,可以稳定地将单晶锭无位错地且具有良好的晶体形状,并且在预定条件下控制晶体驱动单元和坩埚驱动单元,以便 拉晶晶。 在拉动期间,水平磁场定位装置在水平方向上向硅熔体的内部施加磁场,将磁场轴线固定在距离熔体的液面的恒定位置。 水平磁场的垂直位置的位置调整由磁场位置调整装置预先进行,施加场的磁场轴固定在比熔体的液面低一定的距离以上50以上 mm,并且处于与尾部处的熔体表面相同的高度或高于深度L.
    • 27. 发明申请
    • Silicon single crystal and method of producing the same
    • 硅单晶及其制造方法
    • US20090311160A1
    • 2009-12-17
    • US12457421
    • 2009-06-10
    • Yasuhiro SaitoNobumitsu Takase
    • Yasuhiro SaitoNobumitsu Takase
    • C01B33/02C30B15/22
    • C30B15/22C01B33/02C30B29/06
    • The present invention provides a silicon single crystal comprising a seed crystal, a narrowed portion whose diameter decreases, and at its lower end, a neck portion, wherein in a front projection view, the contour of the narrowed portion is located inside the straight line connecting the contour of the lower end of the seed crystal to the contour of the upper end of the neck portion, and the contour of the neck portion is made to be a tangent at the lower end of the narrowed portion. At this time, the length L of the narrowed portion in a pulling direction and the difference d between the radius of the seed crystal and the radius of the narrowed portion relative to the diameter W of the seed crystal is appropriately adjusted and further the contour of the narrowed portion is desirably formed with any one of parabolas, circular arcs and elliptic arcs. Configuring the contour of the narrowed portion in this manner makes it possible to remove dislocations from the neck portion with a high success rate, shorten a pulling time of the silicon single crystal and improve the dislocation free ratio.
    • 本发明提供一种硅单晶,其包括晶种,其直径减小的变窄部分,其下端为颈部,其中,在前投影视图中,所述变窄部分的轮廓位于所述直线连接 晶种的下端的轮廓与颈部的上端的轮廓相同,颈部的轮廓在狭窄部分的下端形成切线。 此时,适当地调整拉伸方向上的变窄部分的长度L和晶种的半径与变窄部分的半径之间的差d相对于晶种的直径W,并且进一步调整 狭窄部分理想地由抛物面,圆弧和椭圆弧中的任何一个形成。 以这种方式配置变窄部分的轮廓使得可以以高成功率去除颈部的位错,缩短硅单晶的拉伸时间并提高无位错比。
    • 28. 发明申请
    • Method of shoulder formation in growing silicon single crystals
    • 生长硅单晶中肩峰形成的方法
    • US20090293804A1
    • 2009-12-03
    • US12457067
    • 2009-06-01
    • Hiroaki TaguchiHideki HaraRyoichi Kaito
    • Hiroaki TaguchiHideki HaraRyoichi Kaito
    • C30B15/22
    • C30B15/305C30B15/22C30B29/06C30B30/04
    • A method of shoulder formation in growing silicon single crystals by the CZ method which comprises causing the taper angle to vary in at least two stages, desirably three stages or four stages, can inhibit the occurrence of dislocations in the shoulder formation step and thereby improve the yield and increase the productivity. As the number of stages resulting from varying the taper angle is increased, possible disturbances to occur at crystal growth interfaces and incur dislocations can be reduced and, further, when the above shoulder formation method is applied under application of a transverse magnetic field having a predetermined intensity, the occurrence of dislocations can be inhibited and defect-free silicon single crystals suited for the manufacture of wafers can be grown with high production efficiency. Therefore, the method is best suited for the production of large-diameter silicon single crystals with a diameter of 450 mm which are to be applied to manufacturing semiconductor devices.
    • 包括使锥角在至少两个阶段,优选三个阶段或四个阶段中变化的CZ方法生长的单晶硅中的肩部形成方法可以抑制肩部形成步骤中位错的发生,从而改善 产量并提高生产率。 随着锥角变化的阶段数量的增加,在晶体生长界面发生可能的干扰并引起位错,此外,当应用上述肩部形成方法时,施加具有预定的 强度,可以抑制位错的发生,并且可以以高生产效率生长适合制造晶片的无缺陷硅单晶。 因此,该方法最适用于生产直径为450mm的大直径硅单晶,其应用于制造半导体器件。