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21. 发明申请

US20180027651A1 FLEXIBLE CIRCUIT BOARD, COF MODULE AND ELECTRONIC DEVICE COMPRISING THE SAME 审中-公开
公开(公告)号：US20180027651A1
公开(公告)日：2018-01-25
申请号：US15657296
申请日：2017-07-24
申请人： LG INNOTEK CO., LTD.
发明人： Jun Young LIM , Woong Sik KIM , Hyung Kyu YOON , Min Hwan KIM
IPC分类号： H05K1/02 , H01L23/00 , H05K3/18 , H05K1/18 , H05K1/14 , H05K3/28 , H01L23/498 , H01L21/48
CPC分类号： H05K1/0281 , H01L21/481 , H01L21/4821 , H01L23/4985 , H01L24/16 , H01L2224/16227 , H01L2224/16235 , H01L2924/15153 , H05K1/0271 , H05K1/144 , H05K1/189 , H05K3/18 , H05K3/28 , H05K2201/055 , H05K2201/10128
摘要： A flexible circuit board and an electronic device including a flexible circuit board are provided. The flexible circuit board may include a substrate having a bending area and a non-bending area, a wiring pattern layer provided on the bending area and the non-bending area, a plating layer provided on the wiring pattern layer and including an open area in an area corresponding to the bending area, and a protective layer that directly contacts one surface of the wiring pattern layer exposed at the open area and a side surface of the plating layer. The protective layer may have a larger thickness than a thickness of the plating layer.

22. 发明申请

US20180023197A1 PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PRODUCTION OF PRINTED WIRING BOARD USING SAME 审中-公开
公开(公告)号：US20180023197A1
公开(公告)日：2018-01-25
申请号：US15549471
申请日：2016-01-25
申请人： C. Uyemura & Co., Ltd.
发明人： Yoshikazu SAIJO , Hisamitsu YAMAMOTO , Tetsuji ISHIDA , Takuya KOMEDA , Masayuki UTSUMI
IPC分类号： C23C18/20 , H05K3/38
CPC分类号： C23C18/2066 , C23C18/2086 , C23C18/22 , C23C18/38 , H05K3/18 , H05K3/181 , H05K3/381 , H05K2203/0776 , H05K2203/0793
摘要： The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.

23. 发明申请

US20170251552A1 PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：US20170251552A1
公开(公告)日：2017-08-31
申请号：US15594673
申请日：2017-05-15
申请人： Subtron Technology Co., Ltd.
发明人： Chih-Hong Chuang , Chien-Hung Wu
IPC分类号： H05K1/09 , H05K3/46 , H01L23/498 , H05K1/11 , H01L21/48 , H01L21/683
CPC分类号： H05K1/09 , H01L21/4857 , H01L21/6835 , H01L23/49822 , H01L2221/68345 , H01L2221/68381 , H05K1/0298 , H05K1/115 , H05K3/0026 , H05K3/0047 , H05K3/007 , H05K3/18 , H05K3/205 , H05K3/4038 , H05K3/421 , H05K3/4638 , H05K3/4644 , H05K3/4682 , H05K2201/09509 , H05K2203/03
摘要： A temporary package substrate includes a first copper layer, a second copper layer, a third copper layer, a first plating copper layer, a second plating copper layer, a third plating copper layer, a first dielectric layer, a second dielectric layer and two circuit structures. The second copper layer is located between the first and the third copper layers, and edges of the second copper layer are retracted a distance compared to edges of the first copper layer and edges of the third copper layer. The first and the second dielectric layers completely encapsulate the edges of the second copper layer and the edges of the second plating copper layer. Each of the circuit structures includes at least two patterned circuit layers, an insulation layer located between the patterned circuit layers, and a plurality of conductive through hole structures penetrating the insulation layer and electrically connected with the patterned circuit layers.

24. 发明授权

US09706650B1 Catalytic laminate apparatus and method 有权
公开(公告)号：US09706650B1
公开(公告)日：2017-07-11
申请号：US15240133
申请日：2016-08-18
申请人： Sierra Circuits, Inc.
发明人： Kenneth S. Bahl , Konstantine Karavakis
IPC分类号： H05K1/03 , H05K3/18 , H05K1/02 , H05K1/09 , H05K3/42 , H05K3/46 , H05K1/11 , H05K3/38
CPC分类号： H05K1/0313 , H05K1/0296 , H05K1/0353 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/09 , H05K1/115 , H05K3/18 , H05K3/181 , H05K3/182 , H05K3/387 , H05K3/422 , H05K3/429 , H05K3/4632 , H05K2201/0209 , H05K2201/0227 , H05K2201/0242 , H05K2201/0376 , H05K2203/0716
摘要： A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

25. 发明申请

US20160224143A1 METHOD OF FABRICATING TOUCH SCREEN PANEL 审中-公开
标题翻译：制作触摸屏面板的方法
公开(公告)号：US20160224143A1
公开(公告)日：2016-08-04
申请号：US15096543
申请日：2016-04-12
申请人： SAMSUNG DISPLAY CO., LTD.
发明人： Akira HIRAI , Mikiya ITAKURA , Dong Ho LEE
IPC分类号： G06F3/041 , H05K3/12 , H05K3/42 , H05K3/18
CPC分类号： G06F3/041 , G06F3/044 , G06F2203/04103 , H05K1/117 , H05K3/1275 , H05K3/18 , H05K3/243 , H05K3/244 , H05K3/42 , H05K2201/0108 , H05K2201/0326 , H05K2201/0949 , H05K2203/0361 , H05K2203/0574 , Y10T29/49155 , Y10T29/49165
摘要： A touch screen panel includes a film substrate defined by a touch active area and a non-touch active area and the touch area is arranged outside the touch active area. The touch screen panel includes a plurality of sensing electrodes arranged in the touch active area on an upper surface and a lower surface of the film substrate, and outer lines arranged in the non-touch active area on the upper and the lower surfaces of the film substrate. The outer lines are connected to the sensing electrodes along one of a first direction and a second direction, and the outer lines include a transparent electrode layer and a plating layer on the transparent electrode layer.
摘要翻译：触摸屏面板包括由触摸有源区域和非触摸有源区域限定的薄膜基板，并且触摸区域布置在触摸有源区域的外部。触摸屏面板包括布置在薄膜基板的上表面和下表面上的触摸有源区域中的多个感测电极，以及布置在薄膜的上表面和下表面上的非触摸有源区域中的外线基质。外线沿着第一方向和第二方向连接到感测电极，并且外线在透明电极层上包括透明电极层和镀层。

26. 发明授权

US09380697B2 Electronic device and manufacturing method for same 有权
标题翻译：电子器件及其制造方法相同
公开(公告)号：US09380697B2
公开(公告)日：2016-06-28
申请号：US14583358
申请日：2014-12-26
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： Yoshihiro Tomita , Mitsuhiro Kasahara
IPC分类号： H05K1/02 , H05K3/28 , H05K3/00 , H01L23/00 , H01L21/56 , H05K3/14 , H05K3/18
CPC分类号： H05K1/0283 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/16225 , H01L2224/16245 , H01L2224/18 , H01L2224/24137 , H01L2224/24195 , H01L2224/45144 , H01L2224/48091 , H01L2224/48092 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/3511 , H05K3/0014 , H05K3/007 , H05K3/146 , H05K3/18 , H05K3/28 , H05K2201/0311 , H05K2201/0314 , H05K2201/0382 , H05K2201/09036 , H05K2201/09118 , H05K2201/09263 , H05K2201/10265 , H05K2201/1028 , H05K2203/0191 , H05K2203/1469 , H05K2203/308 , Y10T29/49146 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic device includes: electronic elements; expandable and contractible conductors each disposed between two of the electronic elements adjacent to each other; a seal which covers the electronic elements and the conductors except principal surfaces of the electronic elements and first surfaces of the conductors, the principal surfaces of the electronic elements and the first surfaces of the conductors being present on a same plane on which surfaces of the seal are present; and leading electrode films each of which is attached in a film-like form to three surfaces which are the surface of the seal positioned between one of the electronic elements and one of the conductors, the first surface of the conductor, and part of the principal surface of the electronic element, to electrically connect the electronic element and the conductor through the leading electrode film.
摘要翻译：电子设备包括：电子元件; 每个电子元件彼此相邻放置在两个电子元件之间; 密封件，其覆盖电子元件和除电子元件的主表面和导体的第一表面之外的导体，电子元件的主表面和导体的第一表面存在于同一平面上，密封件的表面存在; 以及引导电极膜，其各自以薄膜状形式连接到位于一个电子元件之间的密封件表面的三个表面，其中一个导体，导体的第一表面和主体的一部分电子元件的表面，通过前导电极膜电连接电子元件和导体。

27. 发明申请

US20150216037A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD FOR SAME 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20150216037A1
公开(公告)日：2015-07-30
申请号：US14583358
申请日：2014-12-26
申请人： Panasonic Intellectual Property Management Co., Ltd.
发明人： YOSHIHIRO TOMITA , MITSUHIRO KASAHARA
IPC分类号： H05K1/02 , H05K3/28 , H05K3/00
CPC分类号： H05K1/0283 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2224/04105 , H01L2224/16225 , H01L2224/16245 , H01L2224/18 , H01L2224/24137 , H01L2224/24195 , H01L2224/45144 , H01L2224/48091 , H01L2224/48092 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/3511 , H05K3/0014 , H05K3/007 , H05K3/146 , H05K3/18 , H05K3/28 , H05K2201/0311 , H05K2201/0314 , H05K2201/0382 , H05K2201/09036 , H05K2201/09118 , H05K2201/09263 , H05K2201/10265 , H05K2201/1028 , H05K2203/0191 , H05K2203/1469 , H05K2203/308 , Y10T29/49146 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An electronic device includes: electronic elements; expandable and contractible conductors each disposed between two of the electronic elements adjacent to each other; a seal which covers the electronic elements and the conductors except principal surfaces of the electronic elements and first surfaces of the conductors, the principal surfaces of the electronic elements and the first surfaces of the conductors being present on a same plane on which surfaces of the seal are present; and leading electrode films each of which is attached in a film-like form to three surfaces which are the surface of the seal positioned between one of the electronic elements and one of the conductors, the first surface of the conductor, and part of the principal surface of the electronic element, to electrically connect the electronic element and the conductor through the leading electrode film.
摘要翻译：电子设备包括：电子元件; 每个电子元件彼此相邻放置在两个电子元件之间; 密封件，其覆盖电子元件和除电子元件的主表面和导体的第一表面之外的导体，电子元件的主表面和导体的第一表面存在于同一平面上，密封件的表面存在; 以及引导电极膜，其各自以薄膜状形式连接到位于一个电子元件之间的密封件表面的三个表面，其中一个导体，导体的第一表面和主体的一部分电子元件的表面，通过前导电极膜电连接电子元件和导体。

28. 发明授权

US08822833B2 Touch sensor assembly and method of making the same 有权
标题翻译：触摸传感器组件及其制作方法
公开(公告)号：US08822833B2
公开(公告)日：2014-09-02
申请号：US13681651
申请日：2012-11-20
申请人： Cando Corporation
发明人： Fan Hsu , Chi-Kuang Lai
IPC分类号： H05K1/09 , H05K3/20 , C23C16/00 , G06F3/044 , H05K3/18 , H05K1/11 , G06F3/045 , H05K1/02 , H05K3/14 , H05K3/16 , H05K3/46
CPC分类号： H05K3/18 , G06F3/044 , G06F3/045 , H05K1/0274 , H05K1/09 , H05K1/092 , H05K1/11 , H05K3/146 , H05K3/16 , H05K3/4685 , H05K2201/0108 , Y10T29/49128
摘要： A method of making a touch sensor assembly comprises: forming conductive trace elements on a transparent substrate; forming an insulator layer on the transparent substrate such that the insulator layer covers a portion of the conductive trace elements; and forming a plurality of conductive bridging lines such that each of the conductive bridging lines bridges two corresponding ones of the conductive trace elements. Each of the conductive bridging lines includes a plurality of conductor layers stacked one above the other and differing from one another in reflectivity. One of the conductor layers is formed by reacting a reactive gas with a metallic material, and has a reflectivity less than that of the metallic material.
摘要翻译：制造触摸传感器组件的方法包括：在透明基板上形成导电微量元素; 在所述透明基板上形成绝缘体层，使得所述绝缘体层覆盖所述导电微量元素的一部分; 以及形成多个导电桥接线，使得每个导电桥接线桥接两个对应的导电微量元素。每个导电桥接线包括多个彼此层叠并且彼此反射的导体层。导体层之一是通过使反应性气体与金属材料反应形成的，并且反射率小于金属材料的反射率。

29. 发明申请

US20130277097A1 METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：制造印刷电路板的方法
公开(公告)号：US20130277097A1
公开(公告)日：2013-10-24
申请号：US13976289
申请日：2011-12-23
申请人： Il Sang Maeng
发明人： Il Sang Maeng
IPC分类号： H05K3/38 , H05K1/09
CPC分类号： H05K3/388 , H05K1/09 , H05K3/107 , H05K3/18 , H05K3/465 , H05K2203/0723
摘要： The embodiment relates to a printed circuit board. The printed circuit board includes an insulating substrate having a plurality of circuit pattern grooves, a conductive absorption layer including conductive particles absorbed into inner walls of the circuit pattern grooves and circuit patterns formed on the conductive absorption layer such that the circuit pattern grooves are filled with the circuit patterns. Since the electroplating process is selectively performed with respect to inner portions of the pattern grooves by using the conductive absorption layer as a seed layer, the plating layer is not formed on the insulating layer except for the pattern grooves, so that the etching process for the electroplating layer is not necessary and the patterns are stably formed.
摘要翻译：该实施例涉及一种印刷电路板。印刷电路板包括具有多个电路图形凹槽的绝缘基板，包含吸收在电路图案槽的内壁中的导电颗粒的导电吸收层和形成在导电吸收层上的电路图案，使得电路图案槽填充有电路图案。由于通过使用导电吸收层作为种子层，相对于图案凹槽的内部部分选择性地执行电镀工艺，因此除了图案凹槽之外，在绝缘层上不形成镀层，因此，对于电镀层不是必需的，并且图案稳定地形成。

30. 发明申请

US20130213817A1 METHOD FOR SHRINKING LINEWIDTH OF EXTREME DIMENSION 审中-公开
标题翻译：缩小极限尺寸的方法
公开(公告)号：US20130213817A1
公开(公告)日：2013-08-22
申请号：US13470095
申请日：2012-05-11
申请人： Cheng-Yao LO , Kuan-Hsun Liao
发明人： Cheng-Yao LO , Kuan-Hsun Liao
IPC分类号： C25D5/00 , C25D5/56 , C25D5/54
CPC分类号： C25D5/54 , C25D5/02 , C25D5/22 , C25D21/02 , H05K3/18 , H05K2203/0271
摘要： A method for shrinking a linewidth on a substrate includes the steps of applying a stretching force on the substrate, defining a line on a top surface of the substrate and releasing the applied stretching force. The applied force is executed by mechanical stretching or thermal expansion and has a direction parallel to the line.
摘要翻译：用于收缩衬底上的线宽的方法包括以下步骤：在衬底上施加拉伸力，在衬底的顶表面上限定线并释放施加的拉伸力。施加的力通过机械拉伸或热膨胀进行，并且具有平行于该线的方向。

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