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21. 发明授权

US3768144A Process for ceramic composites 失效
标题翻译：陶瓷复合材料工艺
公开(公告)号：US3768144A
公开(公告)日：1973-10-30
申请号：US3768144D
申请日：1971-03-04
申请人： AMERICAN LAVA CORP
发明人： HEINSS B
IPC分类号： H05K1/03 , H05K1/09 , H05K3/40 , B23P11/00
CPC分类号： H05K3/4061 , H05K1/0306 , H05K1/092 , H05K2203/0108 , H05K2203/033 , Y10T29/49833
摘要： A process is provided by which metal, or other non-ceramic material, is inset into a ceramic structure to produce a composite structure having properties not attainable by previously available processes.
摘要翻译：提供了一种通过哪种金属或其它非陶瓷材料插入到陶瓷结构中以产生具有以前可获得的工艺不能达到的性能的复合结构的方法。

22. 发明授权

US3465435A Method of forming an interconnecting multilayer circuitry 失效
标题翻译：形成互连多层电路的方法
公开(公告)号：US3465435A
公开(公告)日：1969-09-09
申请号：US3465435D
申请日：1967-05-08
申请人： IBM
发明人： STERANKO JAMES J
IPC分类号： H01R12/55 , H05K3/02 , H05K3/20 , H05K3/40 , H05K3/46 , B23K31/02 , B23P19/02 , H05K3/00
CPC分类号： H05K3/4007 , H05K3/025 , H05K3/205 , H05K3/4038 , H05K3/4614 , H05K3/4647 , H05K3/4652 , H05K2201/0355 , H05K2201/0367 , H05K2201/0382 , H05K2201/0394 , H05K2201/09481 , H05K2203/0108 , H05K2203/033 , H05K2203/0338 , H05K2203/063 , H05K2203/0726 , Y10T29/49126 , Y10T29/49149 , Y10T29/4981 , Y10T29/49904

23. 发明授权

US10015886B2 Method for producing portable data carriers 有权
公开(公告)号：US10015886B2
公开(公告)日：2018-07-03
申请号：US14891108
申请日：2014-04-29
申请人： GIESECKE & DEVRIENT GMBH
发明人： Thomas Tarantino
IPC分类号： G06K19/06 , H05K1/18 , G06K19/077 , H05K3/00 , H05K3/10 , H05K3/14 , H05K3/20 , H05K3/32
CPC分类号： H05K1/186 , G06K19/07718 , G06K19/07722 , G06K19/07732 , G06K19/07747 , H05K3/0014 , H05K3/0052 , H05K3/10 , H05K3/14 , H05K3/202 , H05K3/32 , H05K2201/10007 , H05K2201/10128 , H05K2201/10151 , H05K2203/033
摘要： A method for producing a portable data carrier includes a spatial structure printed on a first foil. Electroconductive lines are applied first, and components are subsequently inserted in the structure, wherein the structure corresponds to the dimensions or the shape and size of the inserted components. The components are electroconductively connected to the lines therein. A cover is printed over the components. A second foil can be applied to the cover, wherein a design print can be applied to both foils. A gap can be incorporated in the structure and the foils, in order to insert a chip module.

24. 发明授权

US09961765B2 Security mesh and method of making 有权
公开(公告)号：US09961765B2
公开(公告)日：2018-05-01
申请号：US15271800
申请日：2016-09-21
申请人： International Business Machines Corporation
发明人： Charles L. Arvin , Brian M. Erwin
IPC分类号： H05K1/02 , H05K1/09 , H05K1/11 , H05K3/06 , H05K3/40 , H05K1/03 , H05K3/28 , B05D3/10 , B41N1/08 , C23C22/76 , C23C22/66 , C23C22/78
CPC分类号： H05K1/0275 , B05D3/102 , B41N1/083 , C23C22/66 , C23C22/76 , C23C22/78 , C25D11/04 , C25D11/045 , C25D11/16 , H01L23/57 , H05K1/00 , H05K1/0306 , H05K1/0393 , H05K1/09 , H05K1/115 , H05K1/16 , H05K3/06 , H05K3/28 , H05K3/4038 , H05K3/4602 , H05K3/4644 , H05K3/4682 , H05K3/4697 , H05K2201/07 , H05K2201/09681 , H05K2203/0307 , H05K2203/0315 , H05K2203/033 , H05K2203/0369 , H05K2203/0392 , H05K2203/0733 , H05K2203/1142
摘要： A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.

25. 发明授权

US09565777B1 Security mesh and method of making 有权
标题翻译：安全网格和制作方法
公开(公告)号：US09565777B1
公开(公告)日：2017-02-07
申请号：US14970165
申请日：2015-12-15
申请人： International Business Machines Corporation
发明人： Charles L. Arvin , Brian M. Erwin
IPC分类号： H05K3/46 , H05K1/09 , H05K1/11 , H05K3/06 , C25D11/04 , C25D11/16 , H05K1/00 , H05K1/16 , H05K1/03
CPC分类号： H05K1/0275 , B05D3/102 , B41N1/083 , C23C22/66 , C23C22/76 , C23C22/78 , C25D11/04 , C25D11/045 , C25D11/16 , H01L23/57 , H05K1/00 , H05K1/0306 , H05K1/0393 , H05K1/09 , H05K1/115 , H05K1/16 , H05K3/06 , H05K3/28 , H05K3/4038 , H05K3/4602 , H05K3/4644 , H05K3/4682 , H05K3/4697 , H05K2201/07 , H05K2201/09681 , H05K2203/0307 , H05K2203/0315 , H05K2203/033 , H05K2203/0369 , H05K2203/0392 , H05K2203/0733 , H05K2203/1142
摘要： A method of making a security mesh comprises forming on a conductive substrate an alumina film having through-holes in which metal, e.g., copper, through-wires are formed. First surface wires are formed on one surface of the alumina film and second surface wires are formed on the second, opposite surface of the alumina film in order to connect selected through-wires into a continuous undulating electrical circuit embedded within the alumina film. The security mesh product comprises an alumina film having a continuous undulating electrical circuit comprising copper or other conductive metal extending therethrough. A stacked security mesh comprises two or more of the mesh products being stacked one above the other.
摘要翻译：制造安全网的方法包括在导电基板上形成具有通孔的氧化铝膜，其中形成有例如铜的通孔。第一表面线形成在氧化铝膜的一个表面上，并且第二表面线形成在氧化铝膜的第二相对表面上，以便将所选择的通孔连接到嵌入在氧化铝膜内的连续起伏的电路中。安全网产品包括氧化铝膜，其具有包括铜或延伸穿过其中的其它导电金属的连续波形电路。堆叠的安全网格包括两个或多个网格产品，一个彼此堆叠。

26. 发明授权

US09332638B2 Wiring board and method for manufacturing wiring board 有权
标题翻译：接线板及制造接线板的方法
公开(公告)号：US09332638B2
公开(公告)日：2016-05-03
申请号：US14118636
申请日：2012-05-23
申请人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Harumitsu Sato , Hiroki Watanabe , Tadayoshi Kachi , Takahiro Suzuki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
发明人： Kiminori Ozaki , Yasuhiro Koike , Hiroaki Asano , Harumitsu Sato , Hiroki Watanabe , Tadayoshi Kachi , Takahiro Suzuki , Hitoshi Shimadu , Tetsuya Furuta , Masao Miyake , Takahiro Hayakawa , Tomoaki Asai , Ryou Yamauchi
IPC分类号： H05K1/11 , H05K3/00 , H05K3/40 , H05K1/02
CPC分类号： H05K1/11 , H05K1/0263 , H05K1/115 , H05K3/0094 , H05K3/4038 , H05K3/4046 , H05K3/4084 , H05K2201/0305 , H05K2201/09509 , H05K2201/0969 , H05K2203/033 , H05K2203/1178 , Y10T29/49165
摘要： An electrically conductive path is configured from a first copper plate, a second copper plate, and solder. The first copper plate has a first bent section extended from a first joining section joined to an electrically insulative board and bent toward the rear surface of the electrically insulative board. The second copper plate has a second bent section which is extended from a second joining section joined to the electrically insulative board, is bent toward the front surface of the electrically insulative board, and is disposed so as to cover, together with the first bent section, the inner wall surface of a base-material through-hole. Through-holes are provided in the portions of the second copper plate which face the inside of the base-material through-hole. Solder is filled between the first bent section and the second bent section.
摘要翻译：导电路径由第一铜板，第二铜板和焊料构成。第一铜板具有从接合到电绝缘板的第一接合部延伸并朝向电绝缘板的后表面弯曲的第一弯曲部。第二铜板具有从连接到电绝缘板的第二接合部延伸的第二弯曲部，朝向电绝缘板的前表面弯曲，并且与第一弯曲部一起覆盖，基材通孔的内壁表面。在第二铜板的与基材通孔的内侧相对的部分设有通孔。焊料填充在第一弯曲部分和第二弯曲部分之间。

27. 发明申请

US20140154894A1 Method and Device for Producing an Electric Contact Sensor Plate 审中-公开
标题翻译：用于生产电气接触传感器板的方法和装置
公开(公告)号：US20140154894A1
公开(公告)日：2014-06-05
申请号：US14007127
申请日：2012-03-23
申请人： Andreas Heise
发明人： Andreas Heise
IPC分类号： H05K3/20 , H05K13/04 , H05K1/11
CPC分类号： H05K3/20 , H01R43/205 , H05K1/117 , H05K1/118 , H05K3/202 , H05K3/4015 , H05K13/04 , H05K13/0417 , H05K13/046 , H05K2201/1028 , H05K2203/033 , Y10T29/49147 , Y10T29/49204 , Y10T29/53174
摘要： A method for producing an electric contact sensor plate and for populating an electric or electronic module with the contact sensor plate in an automated manner is provided. An end piece of a metal foil strip is fed in a feeding step, in which the contact sensor plate is positioned on the electric or electronic module in a positioning step, and in which the contact sensor plate is fastened on the electric or electronic module in a fastening step. The method is characterized in that the contact sensor plate is produced by being severed from the foil strip in a severing step that follows the feeding step and precedes the positioning step.
摘要翻译：提供了一种用于制造电接触传感器板并且用自动方式用接触传感器板填充电气或电子模块的方法。在馈电步骤中馈送金属箔条的端部，其中接触传感器板在定位步骤中位于电气或电子模块上，并且其中接触传感器板被紧固在电气或电子模块上紧固步骤。该方法的特征在于，接触传感器板通过在跟随进给步骤并在定位步骤之前的切断步骤中从箔条切断而制造。

28. 发明申请

US20130112233A1 INTERDIGITATED FOIL INTERCONNECT FOR REAR-CONTACT SOLAR CELLS 审中-公开
标题翻译：用于后接触太阳能电池的互联箔互连
公开(公告)号：US20130112233A1
公开(公告)日：2013-05-09
申请号：US13663273
申请日：2012-10-29
申请人： Kevin Michael Coakley
发明人： Kevin Michael Coakley
IPC分类号： H05K1/02 , H05K1/09 , H01L31/18 , H01L31/0224
CPC分类号： H05K1/02 , H01L31/049 , H01L31/0516 , H05K1/113 , H05K1/189 , H05K3/202 , H05K2201/10143 , H05K2203/033 , H05K2203/175 , Y02E10/50 , Y10T156/10
摘要： Layers of conductive foil and insulating material are configured to interconnect an array of rear-contact solar cells. An embodiment provides that the layer of conductive foil may be patterned to form repeating sets of electrically isolated, interdigitated fingers. Each set of interdigitated fingers may be used to connect the positive polarity contacts of a first rear-contact solar cell to the negative polarity contacts of a second, adjacent rear-contact cell. The insulating layer is attached to the patterned conductive foil and provides mechanical support and/or electrical isolation. In some embodiments, a protective backsheet may be disposed beneath the conductive foil and/or insulating layer to provide further mechanical support and environmental protection. In some embodiments, the layers of conductive foil and insulating material may be incorporated as an interconnect circuit in a rear-contact PV module.
摘要翻译：导电箔和绝缘材料层被配置成互连后接触太阳能电池阵列。一个实施例提供了导电箔层可以被图案化以形成重复的电隔离的叉指指状物。每组交叉指状物可以用于将第一后接触太阳能电池的正极性触点连接到第二相邻的后接触电池的负极触点。绝缘层连接到图案化的导电箔并提供机械支撑和/或电隔离。在一些实施例中，保护性底片可以设置在导电箔和/或绝缘层下方，以提供进一步的机械支撑和环境保护。在一些实施例中，导电箔和绝缘材料层可以作为互连电路并入在后接触PV模块中。

29. 发明申请

US20070169960A1 Multilayer stacked wiring board 审中-公开
标题翻译：多层堆叠线路板
公开(公告)号：US20070169960A1
公开(公告)日：2007-07-26
申请号：US10590627
申请日：2005-02-15
申请人： Katsuhiko Hayashi
发明人： Katsuhiko Hayashi
IPC分类号： H05K1/11
CPC分类号： H05K3/462 , H05K3/005 , H05K3/4046 , H05K3/4623 , H05K3/4626 , H05K2201/0154 , H05K2201/0347 , H05K2201/096 , H05K2203/033
摘要： A multilayer wiring board comprising at least two double-sided wiring boards which comprises an insulating substrate and conductive metal wiring patterns on both surfaces of the insulating substrate. The wiring patterns on the insulating substrate are connected through a conductive metal in a through hole through the insulating substrate. The double-sided wiring boards are electrically connected by joining of low-melting conductive metal layers on connection terminals at the mating surfaces of the double-sided wiring boards. The at least two double-sided wiring boards are bonded by means of a polyimide adhesive resin that is selectively applied by screen printing on the double-sided wiring boards other than on the connection terminals. The wiring boards are reliably laminated, and the multilayer wiring board has a reliable electrical connection between the wiring boards.
摘要翻译：一种多层布线板，包括至少两个双面布线板，其包括在绝缘基板的两个表面上的绝缘基板和导电金属布线图案。绝缘基板上的布线图案通过贯通绝缘基板的通孔中的导电金属连接。双面布线板通过在双面布线板的配合表面的连接端子上接合低熔点导电金属层而电连接。所述至少两个双面布线板通过聚酰亚胺粘合树脂粘合，所述聚酰亚胺粘合树脂通过丝网印刷选择性地施加在除了连接端子之外的双面布线板上。布线板可靠地层叠，多层布线基板在布线基板之间具有可靠的电连接。

30. 发明申请

US20010047880A1 Double sided flexible circuit for integrated circuit packages and method of manufacture 有权
标题翻译：用于集成电路封装的双面柔性电路和制造方法
公开(公告)号：US20010047880A1
公开(公告)日：2001-12-06
申请号：US09514762
申请日：2000-02-28
发明人： Donald C. Abbott , John E. Cotugno , Robert M. Fritzsche , Robert A. Sabo , Christopher M. Sullivan , David W. West
IPC分类号： H05K001/11 , H05K001/00 , H05K001/02
CPC分类号： H01L23/4985 , H01L24/48 , H01L24/73 , H01L2224/16 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00015 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H05K1/0393 , H05K3/005 , H05K3/064 , H05K3/102 , H05K3/20 , H05K3/205 , H05K3/207 , H05K3/4038 , H05K2201/09563 , H05K2201/09981 , H05K2203/0108 , H05K2203/0195 , H05K2203/033 , H05K2203/0338 , H05K2203/0369 , H05K2203/0522 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T29/49167 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A double-sides electrical interconnection flexible circuit particularly useful as a substrate for an area array integrated circuit package is described. A circuit having interconnection patterns on one surface and solder ball contact pads on the second surface are interconnected by solid copper vias formed from an array of raised studs etched from a metal matrix. In reel to reel format, the etched metal matrix is adhered to one surface of the film and forms the base metal for the solder ball contact pads. The matrix with studs are presses through the dielectric film with a copper layer on the opposite surface, thereby forming an intermediate structure for a flex circuit with self-aligned solid copper vias in a one step process. The contacts are reinforced by plating both surfaces with a layer of copper, and conventional processes are used to complete the circuit patterning.
摘要翻译：描述了特别可用作面阵列集成电路封装的衬底的双面电互连柔性电路。在一个表面上具有互连图案的电路和第二表面上的焊球接触焊盘通过由从金属基体蚀刻的凸起螺柱阵列形成的固体铜通孔互连。在卷对卷格式中，蚀刻的金属基体粘附到膜的一个表面并形成用于焊球接触焊盘的基底金属。具有螺柱的矩阵是在相对表面上通过介电膜压制铜层，从而在一步法中形成具有自对准固体铜通孔的柔性电路的中间结构。通过用铜层镀覆两个表面来增强触点，并且使用常规工艺来完成电路图案化。

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