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1. 发明申请

US20010047880A1 Double sided flexible circuit for integrated circuit packages and method of manufacture 有权
标题翻译：用于集成电路封装的双面柔性电路和制造方法
公开(公告)号：US20010047880A1
公开(公告)日：2001-12-06
申请号：US09514762
申请日：2000-02-28
发明人： Donald C. Abbott , John E. Cotugno , Robert M. Fritzsche , Robert A. Sabo , Christopher M. Sullivan , David W. West
IPC分类号： H05K001/11 , H05K001/00 , H05K001/02
CPC分类号： H01L23/4985 , H01L24/48 , H01L24/73 , H01L2224/16 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/00015 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/30107 , H05K1/0393 , H05K3/005 , H05K3/064 , H05K3/102 , H05K3/20 , H05K3/205 , H05K3/207 , H05K3/4038 , H05K2201/09563 , H05K2201/09981 , H05K2203/0108 , H05K2203/0195 , H05K2203/033 , H05K2203/0338 , H05K2203/0369 , H05K2203/0522 , H05K2203/1189 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T29/49167 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A double-sides electrical interconnection flexible circuit particularly useful as a substrate for an area array integrated circuit package is described. A circuit having interconnection patterns on one surface and solder ball contact pads on the second surface are interconnected by solid copper vias formed from an array of raised studs etched from a metal matrix. In reel to reel format, the etched metal matrix is adhered to one surface of the film and forms the base metal for the solder ball contact pads. The matrix with studs are presses through the dielectric film with a copper layer on the opposite surface, thereby forming an intermediate structure for a flex circuit with self-aligned solid copper vias in a one step process. The contacts are reinforced by plating both surfaces with a layer of copper, and conventional processes are used to complete the circuit patterning.
摘要翻译：描述了特别可用作面阵列集成电路封装的衬底的双面电互连柔性电路。在一个表面上具有互连图案的电路和第二表面上的焊球接触焊盘通过由从金属基体蚀刻的凸起螺柱阵列形成的固体铜通孔互连。在卷对卷格式中，蚀刻的金属基体粘附到膜的一个表面并形成用于焊球接触焊盘的基底金属。具有螺柱的矩阵是在相对表面上通过介电膜压制铜层，从而在一步法中形成具有自对准固体铜通孔的柔性电路的中间结构。通过用铜层镀覆两个表面来增强触点，并且使用常规工艺来完成电路图案化。

2. 发明申请

US20030102152A1 Electrical circuit board and a method for making the same 失效
公开(公告)号：US20030102152A1
公开(公告)日：2003-06-05
申请号：US10300049
申请日：2002-11-20
发明人： Lawrence Leroy Kneisel , Mohan Paruchuri , Vivek Jairazbhoy , Vladimir Stoica
IPC分类号： H05K001/02
CPC分类号： H05K3/4641 , H05K3/386 , H05K3/4038 , H05K3/445 , H05K2201/0195 , H05K2201/0305 , H05K2201/0361 , H05K2201/0397 , H05K2201/09554 , H05K2201/09581 , H05K2203/1438
摘要： A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26, and which includes grooves or troughs 20, 22 which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures 26.

3. 发明申请

US20020020549A1 Component for use in forming printed circuit boards 审中-公开
标题翻译：用于形成印刷电路板的组件
公开(公告)号：US20020020549A1
公开(公告)日：2002-02-21
申请号：US09826623
申请日：2001-04-05
申请人： GA-TEK Inc. (dba Gould Electronics Inc.)
发明人： Michael A. Centanni , Mark Kusner
IPC分类号： H05K001/02
CPC分类号： H05K3/388 , H05K3/025 , H05K3/4611
摘要： A component for use in manufacturing printed circuits that in a finished printed circuit constitutes a functional element. The component is comprised of a film substrate formed of a first polymeric material having a first side and a second side. At least one layer of a tiecoat metal is applied to the first side of the film substrate. At least one layer of copper on the at least one layer of a tiecoat metal, the layer of copper having an essentially uncontaminated exposed surface facing away from the at least one layer of tiecoat metal. A plurality of spaced apart, adhesion promoting areas of a tiecoat metal are provided on the second side of the film substrate defining regions of exposed polymeric material on the second side of the film substrate.
摘要翻译：用于制造印刷电路的部件，其在成品印刷电路中构成功能元件。该部件由具有第一侧面和第二侧面的第一聚合物材料形成的薄膜基底构成。将至少一层涂层金属施加到膜基材的第一侧。至少一层铜层，在所述至少一层涂层金属上，所述铜层具有基本上未受污染的暴露表面，其背离所述至少一层粘结金属层。在薄膜基材的第二面上设置多个间隔开的粘合促进区域，该膜基材在薄膜基材的第二面上限定暴露的聚合物材料的区域。

4. 发明申请

US20010018986A1 Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound 失效
标题翻译：树脂复合物，粘合膜，金属包覆粘合膜，电路板和组装结构，使用树脂化合物
公开(公告)号：US20010018986A1
公开(公告)日：2001-09-06
申请号：US09788465
申请日：2001-02-21
发明人： Akira Nagai , Masayuki Noda
IPC分类号： H05K001/02
CPC分类号： H05K3/4655 , C08L33/00 , C08L79/08 , C08L2666/02 , C09J7/10 , C09J179/08 , C09J2433/00 , C09J2479/08 , H01L23/49894 , H01L2924/0002 , H05K3/4602 , H05K3/4652 , H05K2201/0154 , H05K2201/0358 , Y10T428/24917 , H01L2924/00
摘要： The present invention provides a resin compound, which causes very little thermal stress even when a flip chip is mounted, is of low elastic modulus, and has high heat resistance enough for solder floating at 300null C., and also an adhesive film, metal-clad adhesive film, circuit board, and assembly structure using the resin compound. The present invention is a resin compound containing (A) polyamide imide with siloxane bond, (B) acrylic polymer with weight-average molecular weight of 500,000 or more, (C) thermoset resin, and (D) solvent; an adhesive film and a metal-clad adhesive film using the resin compound; and also a circuit board and an assembly structure made with these films.
摘要翻译：本发明提供一种树脂化合物，即使安装倒装芯片也导致极少的热应力，其弹性模量低，并且具有足够高的耐热性，足以在300℃下漂浮，还有粘合剂膜，金属 - 使用该树脂化合物的粘合膜，电路板和组装结构。本发明是含有（A）具有硅氧烷键的聚酰胺酰亚胺，（B）重均分子量为500,000以上的丙烯酸类聚合物，（C）热固性树脂和（D）溶剂）的树脂化合物，粘合剂膜和使用该树脂化合物的金属包覆粘合膜; 以及由这些膜制成的电路板和组装结构。

5. 发明申请

US20030172525A1 Interconnect structure and method of making same 失效
公开(公告)号：US20030172525A1
公开(公告)日：2003-09-18
申请号：US10436592
申请日：2003-05-12
申请人： International Business Machines Corporation
发明人： Christina M. Boyko , Donald S. Farquhar , Konstantinos I. Papathomas
IPC分类号： H05K001/02 , H05K001/11
CPC分类号： H01L23/49827 , H01L2224/16 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/3011 , H01L2924/3025 , H05K1/112 , H05K3/429 , H05K3/4602 , H05K2201/09472 , H05K2201/09509 , H05K2201/096 , H05K2201/10674 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： An interconnect structure having an increased chip connector pad and plated through hole density is provided. In particular, the interconnect structure includes a substrate having at least one plated through hole therein, and a first conductive layer sealing the at least one plated through hole. The substrate includes a layer of dielectric material thereon. The dielectric layer includes at least one aperture selectively positioned directly over the at least one plated through hole. The substrate further includes a metal layer, at least a pair of conductive layers that can carry signals, and at least another pair of conductive layers that can carry power, wherein the pair of conductive layers are shielded by the metal layer and the other pair of conductive layers.

6. 发明申请

US20030121697A1 Copper alloy foil 失效
标题翻译：铜合金箔
公开(公告)号：US20030121697A1
公开(公告)日：2003-07-03
申请号：US10189043
申请日：2002-07-03
发明人： Hifumi Nagai , Toshiteru Nonaka
IPC分类号： H05K001/02
CPC分类号： H05K1/09 , H05K1/0393 , H05K3/282 , H05K3/386 , H05K2201/0355 , Y10T428/12431 , Y10T428/12438 , Y10T428/12993 , Y10T428/31511 , Y10T428/31522 , Y10T428/31678
摘要： For a three-layer flexible board, there is provided a copper alloy foil that requires no roughening processing, that has good adhesion with an adhesive containing an epoxy resin, that can be laminated to form a copper-clad laminate, that has a low surface roughness, and that has high conductivity and strength. The copper alloy of the foil contains at least one of 0.01-2.0 weight percent Cr and 0.01-1.0 weight percent Zr or contains 1.0-4-8 weight percent Ni and 0.2-1.4 weight percent Si. Good adhesion of the copper alloy foil to a resin substrate with an adhesive containing an epoxy resin is obtained by setting the thickness of the anticorrosive coating to less than 3 nm; the surface roughness of the copper alloy foil is below 2 nullm expressed as ten-point average surface roughness (Rz); and, without roughening processing, the 180null C. peel strength, after adhesion of the copper alloy foil to the board film by means of an adhesive containing an epoxy resin, is greater than 8.0 N/cm.
摘要翻译：对于三层柔性板，提供了不需要粗糙化处理的铜合金箔，其与含有环氧树脂的粘合剂具有良好的粘合性，可以层压形成覆铜层压板，其具有低表面粗糙度高，导电性和强度高。箔的铜合金含有0.01-2.0重量％Cr和0.01-1.0重量％Zr中的至少一种，或含有1.0-4-8重量％的Ni和0.2-1.4重量％的Si。通过将防腐涂层的厚度设定为小于3nm，可以获得铜合金箔与含有环氧树脂的粘合剂对树脂基板的良好粘合性; 铜合金箔的表面粗糙度低于2μm，表示为十点平均表面粗糙度（Rz）; 并且在不进行粗糙化处理的情况下，通过含有环氧树脂的粘合剂将铜合金箔粘合到基板上之后的180℃剥离强度大于8.0N / cm。

7. 发明申请

US20020112880A1 Flexible printed circuit board and manufacturing method 有权
标题翻译：柔性印刷电路板及其制造方法
公开(公告)号：US20020112880A1
公开(公告)日：2002-08-22
申请号：US10075379
申请日：2002-02-15
申请人： NIPPON MEKTRON, LTD.
发明人： Yuji Wakimoto , Toshihiro Watanabe , Ryuji Moriya
IPC分类号： H05K001/02
CPC分类号： H05K3/4691 , H05K3/28 , H05K3/386 , H05K2203/063 , Y10T29/49155
摘要： A flexible printed circuit board including a component mount section, which an electronic component is mounted on, and a cable section, which connects to the component mount section; circuit patterns being provided on the cable section, and covered by a soft laminated adhesive.
摘要翻译：一种柔性印刷电路板，包括安装有电子部件的部件安装部和连接到部件安装部的电缆部; 电路图案设置在电缆部分上，并被软层压粘合剂覆盖。

8. 发明申请

US20020033275A1 Paste for filling throughhole and printed wiring board using same 有权
标题翻译：粘贴填充通孔和印刷电路板使用相同
公开(公告)号：US20020033275A1
公开(公告)日：2002-03-21
申请号：US09904097
申请日：2001-07-13
申请人： NGK SPARK PLUG CO., LTD.
发明人： Hiroshi Sumi , Toshihumi Kojima
IPC分类号： H05K001/02
CPC分类号： H05K1/095 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15312 , H05K3/382 , H05K3/4069 , H05K3/4602 , H05K2201/0209 , H05K2201/0959 , Y10T29/49155 , H01L2924/00
摘要： A paste for filling a throughhole, comprises: an epoxy resin; a curing agent; and a metal filler, wherein the metal filler is a powder comprising a base metal, and the curing agent is an imidazole compound represented by the following formula (1): 1 wherein R1 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a hydroxyalkyl group having 1 to 10 carbon atoms or an alkyloxy group having 1 to 10 carbon atoms.
摘要翻译：一种用于填充通孔的浆料，包括：环氧树脂; 固化剂; 和金属填料，其中所述金属填料是包含贱金属的粉末，并且所述固化剂是由下式（1）表示的咪唑化合物：其中R 1表示氢原子，具有1至10个碳原子的烷基，碳原子数1〜10的羟烷基或碳原子数1〜10的烷氧基。

9. 发明申请

US20040172814A1 Method for manufacturing printed circuit boards 失效
标题翻译：制造印刷电路板的方法
公开(公告)号：US20040172814A1
公开(公告)日：2004-09-09
申请号：US10788392
申请日：2004-03-01
发明人： Akiji Shibata , Toyoharu Koizumi , Tsuyoshi Ishihara , Takashi Sato
IPC分类号： H05K001/02
CPC分类号： H05K3/0094 , H01L21/4857 , H01L21/486 , H05K1/183 , H05K3/108 , H05K3/421 , H05K2201/0355 , H05K2201/0394 , H05K2201/09581 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： This invention reduces the amount of time required to manufacture double-sided printed circuit boards that contain conductor bridges. A method for producing a printed circuit board comprising the steps of forming a first conductor pattern on a first main side of an insulating board, forming a second conductor pattern which is electrically connected to said first conductor pattern on a side (hereinafter termed a second main side) opposite to said first main side of said insulating board, and forming holes in preset areas of said insulating board, wherein the step of forming the second conductor pattern forms the seconds conductor pattern so that part of said pattern may pass over the holes in the insulating board; wherein said method further comprises the steps of forming holes which pass through said insulating board and said first conductor layer formed on the first main side of the insulating board, bonding a second conductor layer to the second main side of the insulating board having said holes, forming a third conductor layer on the whole first main side of said insulating board after bonding the second conductor layer, masking preset holes among those formed by said hole forming process with a plating resist, plating said first conductor and holes in said insulating board, patterning said first conductor layer to form a first conductor pattern, patterning said second conductor layer to form a second conductor pattern, and removing said plating resist and said third conductor layer from an area which is covered with the plating resist.
摘要翻译：本发明减少制造包含导体桥的双面印刷电路板所需的时间。一种制造印刷电路板的方法，包括以下步骤：在绝缘板的第一主侧上形成第一导体图案，形成第二导体图案，该第二导体图案在侧面电连接到所述第一导体图案（以下称为第二主体侧），并且在所述绝缘板的预设区域中形成孔，其中形成所述第二导体图案的步骤形成所述秒导体图案，使得所述图案的一部分可以越过所述绝缘板的所述孔绝缘板; 其特征在于，所述方法还包括以下步骤：形成穿过所述绝缘板和形成在绝缘板的第一主侧上的第一导体层的孔，将第二导体层接合到具有所述孔的绝缘板的第二主侧，在接合第二导体层之后，在所述绝缘板的整个第一主侧上形成第三导体层，在由所述孔形成工艺形成的那些之间用电镀抗蚀剂掩蔽预定孔，将所述第一导体和所述绝缘板中的孔，所述第一导体层形成第一导体图案，图案化所述第二导体层以形成第二导体图案，并且从被电镀抗蚀剂覆盖的区域移除所述电镀抗蚀剂和所述第三导体层。

10. 发明申请

US20040006869A1 Method of manufacturing sheet material and method of manufacturing circuit device using the same 失效
标题翻译：片材的制造方法及使用该片材的电路装置的制造方法
公开(公告)号：US20040006869A1
公开(公告)日：2004-01-15
申请号：US10617339
申请日：2003-07-10
发明人： Yusuke Igarashi , Noriaki Sakamoto , Takeshi Nakamura , Yoshiyuki Kobayashi
IPC分类号： H05K001/02 , H05K001/11
CPC分类号： H01L21/4832 , C25D5/026 , H01L21/4828 , H01L23/3107 , H01L23/49582 , H01L24/28 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/743 , H01L24/97 , H01L2224/29339 , H01L2224/32245 , H01L2224/3754 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83439 , H01L2224/84 , H01L2224/85439 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01059 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , Y10T29/49117 , Y10T29/49126 , Y10T29/4913 , Y10T29/49142 , Y10T29/49144 , Y10T29/49155 , Y10T29/49156 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： The invention is to form plated films on a conductive foil a thigh precision, and simplify a procedure of forming the plated film. A resin film composed of a thermosetting resin is formed on the surface of the conductive foil. The resin film of parts which become bonding pads and die pads is eliminated by a laser etching. A clamper presses of the periphery of the block so as to form hermetically sealed spaces on the block. The interior of the clamper is filled with a plating liquid by means of an injection means and an evacuation means, and subsequently, and Ag plated film is formed by an electroplating method.
摘要翻译：本发明是在导电箔上形成大面积精密电镀膜，简化了镀膜的形成工序。在导电箔的表面上形成由热固性树脂构成的树脂膜。通过激光蚀刻消除了成为接合焊盘和管芯焊盘的部件的树脂膜。块体的周边的夹持器压制以在块上形成密封的空间。夹持器的内部通过注射装置和排气装置填充电镀液，随后通过电镀法形成Ag镀膜。

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