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    • 21. 发明授权
    • Preparation process of electrode for battery
    • 电池电极的制备工艺
    • US08734538B2
    • 2014-05-27
    • US13572297
    • 2012-08-10
    • Kenta HiramatsuMasakazu Sanada
    • Kenta HiramatsuMasakazu Sanada
    • H01M4/82H01M6/00
    • H01M4/139H01M4/0404Y10T29/49108Y10T29/49115Y10T29/49204
    • Preparation process of electrode for battery, comprising first application step for forming first linear part by relatively moving first nozzle which discharges first active material linearly with respect to current collector to form a plural of first linear parts on current collector, first drying step for drying first linear parts, second application step for forming second linear part between first linear parts by relatively moving second nozzle which discharges second active material with respect to current collector, and second drying step for drying first linear part and second linear part, wherein height H1 of first linear part and height H2 of second linear part satisfies the relational inequality (1): H1
    • 电池用电极的制造方法,包括:第一施加步骤,通过相对移动的第一喷嘴形成第一线性部,所述第一喷嘴相对于集电体线性排放第一活性物质,以在集电体上形成多个第一直线部,第一干燥步骤, 直线部分,用于通过相对于集流体排出第二活性材料的相对移动的第二喷嘴形成第一直线部分之间的第二直线部分的第二施加步骤,以及用于干燥第一直线部分和第二直线部分的第二干燥步骤,其中第一直线部分的高度H1 第二线性部分的线性部分和高度H2满足关系不等式(1):H1
    • 22. 发明授权
    • Substrate processing method
    • 基板加工方法
    • US08696825B2
    • 2014-04-15
    • US13336729
    • 2011-12-23
    • Katsuhiko MiyaAkira Izumi
    • Katsuhiko MiyaAkira Izumi
    • B08B3/04
    • H01L21/67051H01L21/67028Y10S134/902
    • A rinsing liquid (DIW) is discharged from a rinsing liquid discharge port formed in a blocking member to perform rinsing processing to a substrate surface while a nitrogen gas is supplied into a clearance space, and a liquid mixture (IPA+DIW) is discharged from a liquid mixture discharge port formed in the blocking member to replace the rinsing liquid adhering to the substrate surface with the liquid mixture while the nitrogen gas is supplied into the clearance space. Thus, an increase of the dissolved oxygen concentration of the liquid mixture can be suppressed upon replacing the rinsing liquid adhering to the substrate surface with the liquid mixture, which makes it possible to securely prevent from forming an oxide film or generating watermarks on the substrate surface.
    • 从形成在阻挡部件上的冲洗液体排出口排出冲洗液(DIW),在向间隙空间供给氮气的同时,向基板表面进行漂洗处理,并将液体混合物(IPA + DIW)从 形成在所述阻挡构件中的液体混合物排出口,以在将所述氮气供应到所述间隙空间中时,用所述液体混合物代替粘附到所述基板表面的冲洗液。 因此,当用液体混合物代替粘附到基板表面的冲洗液体时,可以抑制液体混合物的溶解氧浓度的增加,这使得可以可靠地防止在基板表面上形成氧化膜或产生水印 。
    • 23. 发明授权
    • Heat treatment apparatus emitting flash of light
    • 热处理设备发出闪光
    • US08686320B2
    • 2014-04-01
    • US13298892
    • 2011-11-17
    • Kenichi Yokouchi
    • Kenichi Yokouchi
    • H01L21/26F27B5/14F27B5/18F27D11/02
    • H01L21/324F27B17/0025F27D5/0037H01L21/02425H01L21/67103H01L21/67115H01L21/68785H01L21/68792
    • Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking.
    • 连接到短脉冲电路的闪光灯和连接到长脉冲电路的闪光灯交替排列成一行。 连接到长脉冲电路的闪光灯的发光持续时间长于连接到短脉冲电路的闪光灯的发光持续时间。 来自闪光灯的短时间闪光和来自闪光灯长时间发光的闪光灯具有高峰值强度的闪光的叠加可以增加即使是 衬底的深部分达到活化温度或更高,而不需要加热衬底表面附近的较浅部分。 这实现了深结的激活,而不会引起基板翘曲或开裂。
    • 29. 发明授权
    • Heat treatment apparatus and method for heating substrate by photo-irradiation
    • 热处理装置及通过光照射加热基板的方法
    • US08559799B2
    • 2013-10-15
    • US12563409
    • 2009-09-21
    • Hideo NishiharaShinichi Kato
    • Hideo NishiharaShinichi Kato
    • F26B19/00
    • H01L21/67115H01L21/26513H01L21/2686
    • Two-step photo-irradiation heat treatment is performed so that a total photo-irradiation time is not more than one second and that a first step of photo-irradiation of a semiconductor wafer is performed with a light-emission output that averages out at a first light-emission output and a second step of photo-irradiation of the semiconductor wafer is performed in accordance with an output waveform that peaks at a second light-emission output that is higher than both average and maximum light-emission outputs in the first step. Performing preliminary photo-irradiation with a relatively low light-emission output in the first step and then performing intense photo-irradiation with a higher peak in the second step enables the surface temperature of a semiconductor wafer to increase further with a smaller amount of energy than in conventional cases, while preventing the semiconductor wafer from shattering.
    • 进行两步光照射热处理,使得总的光照射时间不超过1秒,并且利用平均在a的光发射输出进行半导体晶片的光照射的第一步骤 第一发光输出和半导体晶片的光照射的第二步骤根据在第二发光输出处峰值的输出波形进行,该输出波形高于第一步骤中的平均和最大发光输出 。 在第一步骤中以相对低的发光输出进行初步光照射,然后在第二步骤中用较高的峰进行强光照射使得半导体晶片的表面温度能够以更少量的能量进一步增加, 在常规情况下,同时防止半导体晶片破碎。