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1. 发明申请

US20140283882A1 SUBSTRATE PROCESSING METHOD 有权
标题翻译：基板处理方法
公开(公告)号：US20140283882A1
公开(公告)日：2014-09-25
申请号：US14300354
申请日：2014-06-10
申请人： Dainippon Screen MFG. Co., Ltd.
发明人： Masahiro KIMURA , Tomonori KOJIMARU , Tetsuya EMOTO , Manabu OKUTANI , Masayuki OTSUJI
IPC分类号： B08B3/08 , H05K3/22 , H01L21/02
CPC分类号： H01L21/02057 , B08B3/08 , F26B1/00 , H01L21/02068 , H01L21/306 , H01L21/3105 , H01L21/321 , H01L21/67028 , H01L21/67051 , H01L21/6708 , H05K3/227
摘要： A hydrophobizing agent is supplied to a substrate and a surface of the substrate is hydrophobized. Thereafter, the substrate is dried. The substrate to be processed is maintained in a state of not contacting water until it is dried after being hydrophobized. Collapse of a pattern formed on the substrate surface is thereby suppressed or prevented.
摘要翻译：将疏水化剂供给至基材，将基材的表面疏水化。之后，干燥基板。待处理的基材保持在不接触水的状态，直到其被疏水化后干燥。由此抑制或防止在基板表面上形成的图案的折叠。

2. 发明申请

US20140065295A1 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20140065295A1
公开(公告)日：2014-03-06
申请号：US14011285
申请日：2013-08-27
申请人： DAINIPPON SCREEN MFG. CO., LTD
发明人： Tetsuya EMOTO , Manabu OKUTANI
IPC分类号： B05D1/00 , B05C9/12
CPC分类号： B05D1/005 , B05C9/12 , B05D3/02 , B05D3/0254 , B05D3/0493 , B05D5/08 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/6715
摘要： A substrate treatment method is provided, which includes: a liquid film forming step of forming a liquid film of a treatment liquid on a front surface of a substrate; a hydrophobization liquid supplying step of supplying a hydrophobization liquid to a center portion of the front surface of the substrate for hydrophobizing the front surface of the substrate, while rotating the substrate; an inactivation suppressing step of suppressing inactivation of the supplied hydrophobization liquid on a peripheral edge portion of the front surface of the substrate simultaneously with the hydrophobization liquid supplying step; and a drying step of drying the substrate to which the hydrophobization liquid has been supplied.
摘要翻译：提供了一种基板处理方法，其包括：在基板的前表面上形成处理液的液膜的液膜形成步骤; 疏水化液体供给步骤，在旋转所述基板的同时，将疏水化液体供给到所述基板的前表面的中心部分，以使所述基板的前表面疏水化; 在疏水化液供给工序的同时，抑制供给的疏水化液在基材的表面的周缘部的失活的失活抑制工序; 以及干燥步骤，干燥已经提供疏水化液体的基材。

3. 发明申请

US20140127908A1 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS 有权
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20140127908A1
公开(公告)日：2014-05-08
申请号：US14075623
申请日：2013-11-08
申请人： DAINIPPON SCREEN MFG. CO., LTD
发明人： Manabu OKUTANI
IPC分类号： H01L21/02
CPC分类号： H01L21/0206 , B08B3/04 , H01L21/02068 , H01L21/67051 , H01L21/6708 , H01L21/67109 , H01L21/67115 , H01L21/68792
摘要： The inventive substrate treatment method includes: an organic solvent supplying step of supplying an organic solvent having a smaller surface tension than a rinse liquid to the upper surface of a substrate so that rinse liquid adhering to the upper surface of the substrate is replaced with the organic solvent; a higher temperature maintaining step of maintaining the upper surface of the substrate at a predetermined temperature higher than the boiling point of the organic solvent to thereby form a gas film of the organic solvent on the entire upper surface of the substrate including the gap of the minute pattern and to form a liquid film of the organic solvent on the gas film, the higher temperature maintaining step being performed after the organic solvent supplying step is started; and an organic solvent removing step of removing the organic solvent liquid film from the upper surface of the substrate.
摘要翻译：本发明的基板处理方法包括：有机溶剂供给步骤，将具有比冲洗液更小的表面张力的有机溶剂供给到基板的上表面，使得附着到基板的上表面的冲洗液体被有机物溶剂; 将基板的上表面保持在高于有机溶剂的沸点的规定温度的高温保持步骤，从而在基板的整个上表面上形成有机溶剂的气膜，该气体膜包括分钟的间隙在气膜上形成有机溶剂的液膜，在开始有机溶剂供给工序后进行高温保持工序; 以及从基板的上表面除去有机溶剂液膜的有机溶剂除去工序。

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