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21. 发明授权

US06255738B1 Encapsulant for microelectronic devices 失效
标题翻译：微电子器件用密封剂
公开(公告)号：US06255738B1
公开(公告)日：2001-07-03
申请号：US08940477
申请日：1997-09-30
申请人： Thomas H. Distefano , Craig Mitchell , Mark Thorson , Zlata Kovac
发明人： Thomas H. Distefano , Craig Mitchell , Mark Thorson , Zlata Kovac
IPC分类号： H01L2329
CPC分类号： H01L23/4985 , H01L23/24 , H01L23/293 , H01L2924/0002 , H01L2924/00
摘要： Filled, curable siloxane encapsulant compositions containing a curable siloxane base resin with functional groups reactive with functional groups of a hardener compound to form a polysiloxane, and filler particles with surface functional groups reactive with the hardener compound functional groups, wherein the filler particles have at least a bi-modal particle packing distribution of first filler particles having a first diameter and second filler particles having a second diameter smaller than the first diameter, and the first and second filler particles are present in amounts effective to provide a particle packing distribution with a relative bulk volume of at least about 90 percent. Tri-modal particle packing distributions of the first and second filler particles with third filler particles having a third diameter smaller than the second diameter are preferred, with the first, second and third filler particles being present in amounts effective to provide a tri-modal particle packing distribution with a relative bulk volume of at least about 95 percent. Encapsulant kits, cured encapsulant compositions in which filler particles are individually covalently bonded to one or more polysiloxane polymer chains, microelectronic assemblies incorporating the cured encapsulant compositions, and methods for preparing the curable encapsulant compositions are also disclosed.
摘要翻译：含有具有与硬化剂化合物的官能团反应形成聚硅氧烷的官能团的可固化硅氧烷基础树脂的填充的可固化的硅氧烷密封剂组合物和具有与硬化剂化合物官能团反应的表面官能团的填料颗粒，其中填料颗粒至少具有具有第一直径的第一填料颗粒和具有小于第一直径的第二直径的第二填料颗粒的双模式颗粒填充分布，并且第一和第二填料颗粒以有效提供颗粒填充分布的量存在于相对体积至少约90％。优选具有第三直径小于第二直径的第三填料颗粒的第一和第二填料颗粒的三模式颗粒填充分布，其中第一，第二和第三填料颗粒以有效提供三模式颗粒的量存在填料分布的相对体积体积至少约95％。还公开了封装剂试剂盒，固化的密封剂组合物，其中填料颗粒单独地共价键合到一个或多个聚硅氧烷聚合物链上，结合固化的密封剂组合物的微电子组件以及制备可固化的密封剂组合物的方法。

22. 发明授权

US06247228B1 Electrical connection with inwardly deformable contacts 失效
公开(公告)号：US06247228B1
公开(公告)日：2001-06-19
申请号：US08989305
申请日：1997-12-12
申请人： Thomas H. Distefano , Joseph Fjelstad
发明人： Thomas H. Distefano , Joseph Fjelstad
IPC分类号： H05K336
CPC分类号： H05K3/462 , H01L23/49827 , H01L23/5385 , H01L2924/0002 , H01R12/523 , H01R12/714 , H01R13/2414 , H01R43/0256 , H05K1/0272 , H05K1/036 , H05K1/056 , H05K1/116 , H05K3/0032 , H05K3/326 , H05K3/4623 , H05K3/4641 , H05K2201/0195 , H05K2201/0382 , H05K2201/0397 , H05K2201/09536 , H05K2201/09554 , H05K2201/096 , H05K2201/09827 , H05K2201/10378 , H05K2203/0554 , H05K2203/0582 , H05K2203/135 , H05K2203/308 , Y10T29/49126 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/49155 , Y10T29/49165 , Y10T156/1744 , H01L2924/00
摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

23. 发明授权

US06218215B1 Methods of encapsulating a semiconductor chip using a settable encapsulant 有权
标题翻译：使用可固化密封剂封装半导体芯片的方法
公开(公告)号：US06218215B1
公开(公告)日：2001-04-17
申请号：US09520357
申请日：2000-03-07
申请人： Thomas H. Distefano , Craig S. Mitchell
发明人： Thomas H. Distefano , Craig S. Mitchell
IPC分类号： H01L2144
CPC分类号： H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A method of making a semiconductor chip package by attaching a chip to a dielectric layer; placing the dielectric layer and chip into a mold; disposing a thixotropic composition that has bee sheared to reduced its viscosity into the mold and curing the thixotropic composition after the chip and dielectric layer have been removed from the mold. A method of making a semiconductor chip package without using a mold by disposing a sheared thixotropic composition between a semiconductor chip and a dielectric layer and then curing the thixotropic composition to form a cured encapsulant. A method of making a semiconductor chip package without using a mold during the curing step and without the need to use a thixotropic composition by placing a semiconductor chip attached to a dielectric layer into a mold and disposing a liquid composition between the chip and the dielectric layer, forming a cured skin on the liquid composition, removing the work-piece from the mold and then completely the cure of the liquid composition.
摘要翻译：一种通过将芯片附着到电介质层来制造半导体芯片封装的方法; 将介电层和芯片放置在模具中; 在将芯片和电介质层从模具中除去之后，设置具有剪切力的触变组合物以将其粘度降低到模具中并固化触变组合物。一种制备半导体芯片封装而不使用模具的方法是通过设置剪切的触变在半导体芯片和电介质层之间的组成，然后固化触变组合物以形成固化的密封剂。一种在固化步骤期间不使用模具制造半导体芯片封装的方法，并且不需要通过将半导体芯片将电介质层附着到模具中并在芯片和电介质层之间设置液体组合物，在液体组合物上形成固化的皮肤，从模具中除去工件，然后完全固化液体组合物。

24. 发明授权

US06202297B1 Socket for engaging bump leads on a microelectronic device and methods therefor 失效
标题翻译：用于接合微电子器件上的突起引线的插座及其方法
公开(公告)号：US06202297B1
公开(公告)日：2001-03-20
申请号：US09079336
申请日：1998-05-14
申请人： Anthony B. Faraci , James B. Zaccardi , Thomas H. Distefano , John W. Smith
发明人： Anthony B. Faraci , James B. Zaccardi , Thomas H. Distefano , John W. Smith
IPC分类号： H05K330
CPC分类号： H05K7/1084 , H01R12/714 , H01R13/24 , H05K3/326 , H05K3/4092 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144
摘要： A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.
摘要翻译：具有凸起引线的微电子器件的连接器和用于制造和使用连接器的方法。电介质基板具有从前表面向上延伸的多个柱。柱可以以每组在其间限定间隙的柱组的排列布置。大体层状接触从每个顶部延伸。凸块引线各自插入在相应的间隙内，从而使其接触，当其继续插入时，触头抵靠凸起引线。通常，当凸块引线插入到间隙中时，触头的远端部分向下偏转朝向基板并向外远离间隙的中心。

25. 发明授权

US6133627A Semiconductor chip package with center contacts 失效
标题翻译：具有中心触点的半导体芯片封装
公开(公告)号：US6133627A
公开(公告)日：2000-10-17
申请号：US984615
申请日：1997-12-03
申请人： Igor Y. Khandros , Thomas H. Distefano
发明人： Igor Y. Khandros , Thomas H. Distefano
IPC分类号： H01L21/60 , H01L21/822 , H01L21/98 , H01L23/13 , H01L23/31 , H01L23/485 , H01L23/498 , H01L23/58 , H01L25/16 , H01L23/48 , H01L23/52
CPC分类号： H01L21/6836 , H01L21/822 , H01L22/32 , H01L23/13 , H01L23/3107 , H01L23/3164 , H01L23/49805 , H01L23/49827 , H01L23/49838 , H01L23/4985 , H01L23/49861 , H01L24/27 , H01L24/50 , H01L24/81 , H01L25/16 , H01L25/50 , H01L2221/68327 , H01L2224/16145 , H01L2224/274 , H01L2224/48091 , H01L2224/4824 , H01L2224/81801 , H01L2225/0651 , H01L2225/06517 , H01L2225/0652 , H01L2225/06579 , H01L2225/06596 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H05K2201/10378
摘要： A semiconductor chip having contacts on the central region of its top surface is provided with a dielectric element overlying the central portion of the top surface. The dielectric element has a first surface facing toward the chip and a second surface facing away from the chip, a hole encompassing the central contacts and an edge bounding the hole. Central contact leads extend from the central contacts on the chip to central terminals on the dielectric element. The terminals on the dielectric element may be connected to a substrate using techniques commonly employed in surface mounting of electrical devices, such as solder bonding. The leads, and preferably the dielectric element, are flexible so that the terminals are moveable with respect to the contacts on the chip, to compensate for differential thermal expansion of the chip and substrate. The dielectric element may be provided with a compliant layer disposed between the terminals and the chip. The entire assembly is compact.
摘要翻译：在其顶表面的中心区域上具有触点的半导体芯片设置有覆盖在顶表面的中心部分上的电介质元件。电介质元件具有面向芯片的第一表面和背离芯片的第二表面，包围中心触点的孔和限定孔的边缘。中心接触引线从芯片上的中心触点延伸到介质元件上的中心端子。电介质元件上的端子可以使用通常用于电气装置的表面安装（例如焊接）的技术连接到基板。引线，优选地介电元件是柔性的，使得端子可相对于芯片上的触点移动，以补偿芯片和基板的不同的热膨胀。电介质元件可以设置有设置在端子和芯片之间的柔性层。整个组件紧凑。

26. 发明授权

US5934914A Microelectronic contacts with asperities and methods of making same 失效
公开(公告)号：US5934914A
公开(公告)日：1999-08-10
申请号：US845016
申请日：1997-04-22
申请人： Joseph Fjelstad , John W. Smith , Thomas H. Distefano , James Zaccardi , A. Christian Walton
发明人： Joseph Fjelstad , John W. Smith , Thomas H. Distefano , James Zaccardi , A. Christian Walton
IPC分类号： B23K1/19 , G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/48 , H01L23/48 , H01L23/498 , H01R4/02 , H01R12/00 , H01R12/52 , H01R12/57 , H01R12/70 , H01R12/71 , H01R13/24 , H01R43/16 , H05K1/11 , H05K3/32 , H05K3/34 , H05K3/40 , H05K7/08 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1084 , G01R1/0466 , G01R1/06744 , G01R1/07357 , H01L21/4853 , H01L23/49816 , H01L23/49827 , H01R13/2485 , H05K3/326 , H05K3/3436 , H05K7/1069 , G01R1/06711 , G01R1/06727 , G01R1/06733 , G01R3/00 , H01L2224/16237 , H01L2224/45144 , H01L2224/8114 , H01L2224/81385 , H01L2224/81899 , H01L24/81 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042 , H01L2924/14 , H01L2924/30107 , H01R12/7076 , H05K1/118 , H05K2201/0382 , H05K2201/0397 , H05K2201/1059 , H05K2201/10734 , H05K3/3431 , H05K3/4092 , Y02P70/613 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49156 , Y10T29/49204 , Y10T29/4921 , Y10T29/49222 , Y10T29/49224
摘要： Microelectronic contacts, such as flexible, tab-like, cantilever contacts, are provided with asperities disposed in a regular pattern. Each asperity has a sharp feature at its tip remote from the surface of the contact. As mating microelectronic elements are engaged with the contacts, a wiping action causes the sharp features of the asperities to scrape the mating element, so as to provide effective electrical interconnection and, optionally, effective metallurgical bonding between the contact and the mating element upon activation of a bonding material.

27. 发明授权

US5776796A Method of encapsulating a semiconductor package 失效
标题翻译：封装半导体封装的方法
公开(公告)号：US5776796A
公开(公告)日：1998-07-07
申请号：US726697
申请日：1996-10-07
申请人： Thomas H. Distefano , John W. Smith , Joseph Fjelstad , Craig S. Mitchell , Konstantine Karavakis
发明人： Thomas H. Distefano , John W. Smith , Joseph Fjelstad , Craig S. Mitchell , Konstantine Karavakis
IPC分类号： H01L21/56 , H01L21/68 , H01L23/24 , H01L23/31 , H01L23/495 , H01L21/44
CPC分类号： H01L21/568 , H01L21/56 , H01L21/565 , H01L21/6835 , H01L23/24 , H01L23/3107 , H01L23/3114 , H01L23/49572 , H01L24/32 , H01L24/50 , H01L24/97 , H01L2224/11003 , H01L2224/83102 , H01L2224/92125 , H01L2224/97 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01058 , H01L2924/01082 , H01L2924/01322 , H01L2924/12042
摘要： A method of encapsulating a semiconductor device. The encapsulation method includes a semiconductor chip package assembly having a spacer layer between a top surface of a sheet-like substrate and a contact bearing surface of a semiconductor chip, wherein the substrate has conductive leads thereon, the leads being electrically connected to terminals on a first end and bonded to respective chip contacts on a second end. Typically, the spacer layer is comprised of a compliant or elastomeric material. A protective layer is attached on a bottom surface of the substrate so as to cover the terminals on the substrate. A flowable, curable encapsulant material is deposited around a periphery of the semiconductor chip after the attachment of the protective layer so as to encapsulate the leads. The encapsulant material is then cured. Typically, this encapsulation method is performed on a plurality of chip assemblies simultaneously.
摘要翻译：一种封装半导体器件的方法。封装方法包括：半导体芯片封装组件，其具有在片状基板的顶表面和半导体芯片的接触支承表面之间的间隔层，其中，所述基板在其上具有导电引线，所述引线电连接到第一端并且在第二端上结合到各个芯片触点。通常，间隔层由顺应性或弹性体材料构成。保护层附着在基板的底面，以覆盖基板上的端子。在安装保护层以便封装引线之后，可流动的可固化的密封剂材料围绕半导体芯片的周边沉积。然后固化密封材料。通常，这种封装方法同时在多个芯片组件上执行。

28. 发明授权

US5663106A Method of encapsulating die and chip carrier 失效
标题翻译：封装芯片和芯片载体的方法
公开(公告)号：US5663106A
公开(公告)日：1997-09-02
申请号：US246113
申请日：1994-05-19
申请人： Konstantine Karavakis , Thomas H. Distefano , John W. Smith, Jr. , Craig Mitchell
发明人： Konstantine Karavakis , Thomas H. Distefano , John W. Smith, Jr. , Craig Mitchell
IPC分类号： H01L21/56 , H01L21/68 , H01L23/24 , H01L23/31 , H01L21/60
CPC分类号： H01L21/568 , H01L21/56 , H01L21/6835 , H01L23/24 , H01L23/3114 , H01L24/97 , H01L2224/11003 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/3025 , Y10T29/49146
摘要： A method of packaging a semiconductor chip assembly includes the encapsulation of the same after establishing an encapsulation area and providing a physical barrier for protecting the terminals of a chip carrier. An alternative or supplement to providing a physical barrier is to provide a preform of an encapsulation material which includes a predetermined volume of such material so that only the encapsulation area is filled. For a semiconductor chip assembly which does not yet have an elastomeric layer, a method of simultaneously forming such an elastomeric layer and encapsulating a semiconductor chip assembly is also provided.
摘要翻译：封装半导体芯片组件的方法包括在建立封装区域之后对其进行封装，并提供用于保护芯片载体的端子的物理屏障。提供物理屏障的替代或补充是提供包含材料的预成型件，其包括预定体积的这种材料，使得仅填充封装区域。对于还没有弹性体层的半导体芯片组件，还提供了同时形成这种弹性体层并封装半导体芯片组件的方法。

29. 发明授权

US06700072B2 Electrical connection with inwardly deformable contacts 有权
标题翻译：与内部可变形触点的电气连接
公开(公告)号：US06700072B2
公开(公告)日：2004-03-02
申请号：US09779117
申请日：2001-02-08
申请人： Thomas H. Distefano , Joseph Fjelstad
发明人： Thomas H. Distefano , Joseph Fjelstad
IPC分类号： H05K103
CPC分类号： H05K3/462 , H01L23/49827 , H01L23/5385 , H01L2924/0002 , H01R12/523 , H01R12/714 , H01R13/2414 , H01R43/0256 , H05K1/0272 , H05K1/036 , H05K1/056 , H05K1/116 , H05K3/0032 , H05K3/326 , H05K3/4623 , H05K3/4641 , H05K2201/0195 , H05K2201/0382 , H05K2201/0397 , H05K2201/09536 , H05K2201/09554 , H05K2201/096 , H05K2201/09827 , H05K2201/10378 , H05K2203/0554 , H05K2203/0582 , H05K2203/135 , H05K2203/308 , Y10T29/49126 , Y10T29/49133 , Y10T29/49137 , Y10T29/49139 , Y10T29/49155 , Y10T29/49165 , Y10T156/1744 , H01L2924/00
摘要： An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.
摘要翻译：用于微电子电路板之间的互连的插入件在其表面具有接触。每个接触件从中心导体延伸，并且具有适于从中心导体径向向内收缩的外围部分，以响应由在所接合的电路板上限定中心孔的接触垫施加的力。因此，当电路板被内插件压缩时，触头径向向内收缩并且擦拭穿过焊盘。擦拭动作有助于通过摩擦焊接将接触件接合到焊盘，或者通过接触件本身承载的导电接合材料。

30. 发明授权

US06458628B1 Methods of encapsulating a semiconductor chip using a settable encapsulant 有权
标题翻译：使用可固化密封剂封装半导体芯片的方法
公开(公告)号：US06458628B1
公开(公告)日：2002-10-01
申请号：US09712635
申请日：2000-11-14
申请人： Thomas H. Distefano , Craig S. Mitchell
发明人： Thomas H. Distefano , Craig S. Mitchell
IPC分类号： H01L2144
CPC分类号： H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A method of making a semiconductor chip package by attaching a chip to a dielectric layer; placing the dielectric layer and chip into a mold; disposing a thixotropic composition that has been sheared to reduce its viscosity into the mold and curing the thixotropic composition after the chip and dielectric layer have been removed from the mold. A method of making a semiconductor chip package without using a mold by disposing a sheared thixotropic composition between a semiconductor chip and a dielectric layer and then curing the thixotropic composition to form a cured encapsulant. A method of making a semiconductor chip package without using a mold during the curing step and without the need to use a thixotropic composition by placing a semiconductor chip attached to a dielectric layer into a mold and disposing a liquid composition between the chip and the dielectric layer, forming a cured skin on the liquid composition, removing the work-piece from the mold and then complete the cure of the liquid composition.
摘要翻译：一种通过将芯片附着到电介质层来制造半导体芯片封装的方法; 将介电层和芯片放置在模具中; 设置已经剪切以将其粘度降低到模具中并在芯片和电介质层已经从模具中去除之后固化触变组合物的触变组合物。一种通过在半导体芯片和电介质层之间设置剪切的触变组合物然后固化触变组合物以形成固化的密封剂来制造半导体芯片封装而不使用模具的方法。一种在固化步骤中不使用模具制造半导体芯片封装的方法，并且不需要通过将附着到电介质层的半导体芯片放置在模具中并且在芯片和电介质层之间设置液体组合物来使用触变组合物在液体组合物上形成固化的皮肤，从模具中取出工件，然后完成液体组合物的固化。

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