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1. 发明授权

US06428328B2 Method of making a connection to a microelectronic element 有权
标题翻译：与微电子元件连接的方法
公开(公告)号：US06428328B2
公开(公告)日：2002-08-06
申请号：US09977803
申请日：2001-10-15
申请人： Belgacem Haba , Anthony B. Faraci
发明人： Belgacem Haba , Anthony B. Faraci
IPC分类号： H01R1201
CPC分类号： H05K3/326 , H01L2224/0401 , H01L2224/05551 , H01L2224/05552 , H01L2224/05557 , H01L2224/16237 , H01L2224/8114 , H01R12/89 , H01R13/193 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the through hole. Contact pads on the second major surface of the dielectric layer overlie the through holes to provide a blind end which is electrically connected to the other contact by means of a metal layer lining the through hole. The resulting connectors provide low or zero insertion force sockets for mounting microelectronic elements having bump leads thereto. The bump leads may be received within corresponding sockets without engagement with the contact or projection, and then, by movement in a lateral direction, engaging the contact or projection to provide electrical connection to the socket.
摘要翻译：用于微电子元件的连接器包括具有期望地布置成矩形网格图案的多个通孔的片状电介质层。每个孔设置在一个主表面上，具有大致层状接触，其具有在通孔上向内延伸的至少一个突起。电介质层的第二主表面上的接触焊盘覆盖在通孔上，以提供盲端，该盲端通过衬套穿过通孔的金属层与另一接触电连接。所得到的连接器提供低或零插入力插座，用于安装具有凸起引线的微电子元件。凸起引线可以被接收在相应的插座中，而不与触点或突起接合，然后通过沿横向的移动来接合触点或突起以提供到插座的电连接。

2. 发明授权

US06261863B1 Components with releasable leads and methods of making releasable leads 有权
标题翻译：具有可释放引线的部件和制造可释放引线的方法
公开(公告)号：US06261863B1
公开(公告)日：2001-07-17
申请号：US09471973
申请日：1999-12-23
申请人： Masud Beroz , Thomas H. DiStefano , Anthony B. Faraci , Joseph Fjelstad , Belgacem Haba
发明人： Masud Beroz , Thomas H. DiStefano , Anthony B. Faraci , Joseph Fjelstad , Belgacem Haba
IPC分类号： H01L2144
CPC分类号： H05K3/4092 , H01L23/49811 , H01L23/4985 , H01L23/5387 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions. A method of making a connection component includes removing material from the conductive structures or the support layer or both to form the anchors.
摘要翻译：用于诸如半导体芯片的微电子器件的连接部件包括支撑层和延伸穿过支撑层的表面的导电结构。导电结构具有将它们连接到支撑层，以及可释放或未锚定部分的锚固件。制造连接部件的方法包括从导电结构或支撑层或两者移除材料以形成锚固件。

3. 发明授权

US4985870A Apparatus for connecting electronic modules containing integrated circuits and backup batteries 失效
标题翻译：用于连接包含集成电路和备用电池的电子模块的装置
公开(公告)号：US4985870A
公开(公告)日：1991-01-15
申请号：US290825
申请日：1988-12-22
申请人： Anthony B. Faraci
发明人： Anthony B. Faraci
IPC分类号： G11C5/00 , G11C5/14 , H05K1/11 , H05K1/18 , H05K5/02
CPC分类号： H05K5/026 , G11C5/00 , G11C5/143 , H05K1/117 , H05K1/18 , H05K2201/094 , H05K2201/10037 , H05K2201/10159
摘要： Apparatus for connecting a data storage module to an external circuit. A power supply terminal is connected between the module and the external circiut before signal terminals are connected. Apparatus includes a printed circuit board male card edge connector having selected card edge pins that extend farther than other card edge pins.
摘要翻译：用于将数据存储模块连接到外部电路的装置。在连接信号端子之前，电源端子连接在模块和外部电路之间。装置包括印刷电路板公卡边缘连接器，其具有比其他卡缘销更远的选择的卡边缘销。

4. 发明授权

US07491069B1 Self-cleaning socket for microelectronic devices 有权
标题翻译：微电子器件自清洁插座
公开(公告)号：US07491069B1
公开(公告)日：2009-02-17
申请号：US11970394
申请日：2008-01-07
申请人： Thomas H. Di Stefano , Anthony B. Faraci , Konstantine Karavakis , Peter T. Di Stefano
发明人： Thomas H. Di Stefano , Anthony B. Faraci , Konstantine Karavakis , Peter T. Di Stefano
IPC分类号： H01R12/00
CPC分类号： H01R13/2407 , G01R1/0491 , G01R1/06722 , G01R1/07314 , G01R3/00 , H01R13/111
摘要： A self-cleaning socket for contacting terminals on a microelectronic device wherein the first end of compliant tubular contactors rotate and wipe against terminals urged downwardly against the first end of the contactors. A rotational wipe of a contactor against a mating terminal breaks through any surface contamination layers on the terminal, thereby producing good electrical contact therebetween. Rotation of the first end of a contactor is caused by a downward deflection of a collar supported by two or more helical legs along a midsection of the contactor. Deflection of the collar distorts the resilient helical legs, each of which exerts a force on the collar which add up to produce a torsional force on the collar, thereby providing a rotational wipe in response to a downward urging of a terminal against the contactor. A void along the axis of the tubular contactor provides a reservoir to hold debris dislodged from the terminal and to keep the debris from interfering with operation of the contactor.
摘要翻译：一种用于接触微电子装置上的端子的自清洁插座，其中柔性管状接触器的第一端旋转并且擦拭抵靠接触器的第一端向下的端子。接触器抵靠配合端子的旋转擦拭物破坏端子上的任何表面污染层，从而在它们之间产生良好的电接触。接触器第一端的旋转是由沿着接触器的中部两个或更多个螺旋腿支撑的轴环的向下偏转引起的。衣领的偏转扭曲了弹性螺旋腿，每个弹性螺旋腿在颈圈上施加一个力，加在轴环上产生扭转力，从而响应于端子向着接触器的向下推动而提供旋转擦拭物。沿着管状接触器的轴线的空隙提供储存器以保持从端子移出的碎屑并且保持碎屑免受接触器的操作的干扰。

5. 发明授权

US06374487B1 Method of making a connection to a microelectronic element 有权
标题翻译：与微电子元件连接的方法
公开(公告)号：US06374487B1
公开(公告)日：2002-04-23
申请号：US09590338
申请日：2000-06-08
申请人： Belgacem Haba , Anthony B. Faraci
发明人： Belgacem Haba , Anthony B. Faraci
IPC分类号： H05K334
CPC分类号： H05K3/326 , H01L2224/0401 , H01L2224/05551 , H01L2224/05552 , H01L2224/05557 , H01L2224/16237 , H01L2224/8114 , H01R12/89 , H01R13/193 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49165 , Y10T29/49213
摘要： A connector for microelectronic elements includes a sheetlike dielectric layer having a plurality of through holes desirably arranged in a rectangular grid pattern. Each hole is provided on one major surface with a generally laminar contact having at least one projection extending inwardly over the through hole. Contact pads on the second major surface of the dielectric layer overlie the through holes to provide a blind end which is electrically connected to the other contact by means of a metal layer lining the through hole. The resulting connectors provide low or zero insertion force sockets for mounting microelectronic elements having bump leads thereto. The bump leads may be received within corresponding sockets without engagement with the contact or projection, and then, by movement in a lateral direction, engaging the contact or projection to provide electrical connection to the socket. The dielectric layer may be formed from flexible and/or compressible materials, such as polyimide, whereby deflection of the connector will cause the top contacts surrounding the through hole to move radially inward into engagement with the bump leads on the microelectronic element.
摘要翻译：用于微电子元件的连接器包括具有期望地布置成矩形网格图案的多个通孔的片状电介质层。每个孔设置在一个主表面上，具有大致层状接触，其具有在通孔上向内延伸的至少一个突起。电介质层的第二主表面上的接触焊盘覆盖在通孔上，以提供盲端，该盲端通过衬套穿过通孔的金属层与另一接触电连接。所得到的连接器提供低或零插入力插座，用于安装具有凸起引线的微电子元件。凸起引线可以被接收在相应的插座中，而不与触点或突起接合，然后通过沿横向的移动来接合触点或突起以提供到插座的电连接。电介质层可以由诸如聚酰亚胺之类的柔性和/或可压缩材料形成，由此连接器的偏转将导致围绕通孔的顶部触点径向向内移动以与微电子元件上的凸起引线接合。

6. 发明授权

US5913109A Fixtures and methods for lead bonding and deformation 失效
标题翻译：引线键合和变形的夹具和方法
公开(公告)号：US5913109A
公开(公告)日：1999-06-15
申请号：US690532
申请日：1996-07-31
申请人： Thomas Distefano , John W. Smith , Anthony B. Faraci
发明人： Thomas Distefano , John W. Smith , Anthony B. Faraci
IPC分类号： H01L21/60 , H01L21/30 , H01L21/48 , H01L21/603 , H01L23/12 , H01L23/22 , H01L23/48 , H01L23/498 , H01L23/50 , H01L23/64 , H01R12/71 , H05K1/11 , H05K3/36 , H05K3/40 , H01L21/44
CPC分类号： H01L23/4985 , H01L21/4839 , H01L23/22 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/642 , H01L24/72 , H05K3/4084 , H01L2224/16 , H01L2224/45124 , H01L2224/73253 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01066 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/351 , H05K1/118 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , H05K3/361 , Y10T29/49126 , Y10T29/49144 , Y10T29/49158
摘要： In a method for mounting a sheet-like multi-layer element for producing a microelectronic component, the sheet-like element is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. The assembly is then cooled, and the expansion ring is cut away. In another embodiment, a method is provided for bonding bond pads on a sheet-like microelectronic element to terminal pads on a microelectronic component. The microelectronic element is first placed on a rigid plate and the sheet-like element, which has been bonded to a frame ring, is placed over the microelectronic component. A disk is then placed on the sheet-like element, and force is applied to the disk, bringing the bond pads on the sheet-like element into contact with the terminal pads on the microelectronic element. Heat is then applied, forming the bonds.
摘要翻译：在用于安装用于制造微电子部件的片状多层元件的方法中，首先将片状元件接合到膨胀环。然后将膨胀环加热以拉伸片状元件。然后将具有小于膨胀环内径的外径的框架环结合到片状元件。然后将组件冷却，并将膨胀环切掉。在另一个实施例中，提供了一种用于将片状微电子元件上的接合焊盘接合到微电子部件上的端子焊盘的方法。首先将微电子元件放置在刚性板上，将已经结合到框架环的片状元件放置在微电子元件上。然后将盘放置在片状元件上，并且将力施加到盘上，使得片状元件上的接合焊盘与微电子元件上的端子焊盘接触。然后施加热量，形成粘结。

7. 发明授权

US5810609A Socket for engaging bump leads on a microelectronic device and methods therefor 失效
标题翻译：用于接合微电子器件上的突起引线的插座及其方法
公开(公告)号：US5810609A
公开(公告)日：1998-09-22
申请号：US519828
申请日：1995-08-28
申请人： Anthony B. Faraci , James B. Zaccardi , Thomas H. DiStefano , John W. Smith
发明人： Anthony B. Faraci , James B. Zaccardi , Thomas H. DiStefano , John W. Smith
IPC分类号： H01R13/24 , H01R33/74 , H05K3/32 , H05K3/40 , H05K7/10 , H01R9/09
CPC分类号： H05K7/1084 , H05K3/326 , H05K3/4092 , H01R12/714 , H01R13/24 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144
摘要： A connector for microelectronic devices having bump leads and methods for fabricating and using the connector. A dielectric substrate has a plurality of posts extending upwardly from a front surface. The posts may be arranged in an array of post groups each group defining a gap therebetween. A generally laminar contact extends from each post top. The bump leads are each inserted within a respective gap thereby engaging the contacts which wipe against the bump lead as it continues to be inserted. Typically, distal portions of the contacts deflect downwardly toward the substrate and outwardly away from the center of the gap as the bump lead is inserted into a gap.
摘要翻译：具有凸起引线的微电子器件的连接器和用于制造和使用连接器的方法。电介质基板具有从前表面向上延伸的多个柱。柱可以以每组在其间限定间隙的一组柱组的形式排列。大体层状接触从每个顶部延伸。凸块引线各自插入在相应的间隙内，从而使其接触，当其继续插入时，触头抵靠凸起引线。通常，当凸块引线插入到间隙中时，触头的远端部分向下偏转朝向基板并向外远离间隙的中心。

8. 发明授权

US06286205B1 Method for making connections to a microelectronic device having bump leads 有权
标题翻译：连接到具有凸点引线的微电子器件的方法
公开(公告)号：US06286205B1
公开(公告)日：2001-09-11
申请号：US09209226
申请日：1998-12-10
申请人： Anthony B. Faraci , James B. Zaccardi , Thomas H. Distefano , John W. Smith
发明人： Anthony B. Faraci , James B. Zaccardi , Thomas H. Distefano , John W. Smith
IPC分类号： H05K330
CPC分类号： H05K7/1084 , H01R12/714 , H01R13/24 , H05K3/326 , H05K3/4092 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144
摘要： A method for making connections to a microelectronic device having bump leads thereon. A substrate is provided having a front surface and a plurality of electrically conductive posts extending upwardly from the front surface. The posts are disposed in groups, wherein the posts of each group define a gap therebetween. Contacts are provided extending generally horizontally outwardly from each post remote from the front surface of the substrate. The microelectronic device is assembled to the substrate and posts so that the bump leads penetrate into the gaps and engage the contacts which wipe against the bump leads as they are inserted.
摘要翻译：一种用于连接到其上具有凸块引线的微电子器件的方法。提供了具有前表面和从前表面向上延伸的多个导电柱的衬底。柱被分组地布置，其中每组的柱在它们之间限定了间隙。提供从远离基板的前表面的每个支柱大致水平向外延伸的触点。微电子器件被组装到衬底上并且固定，使得凸起引线插入到间隙中并且接合触头，这些接触件在它们被插入时擦拭凸起引线。

9. 发明授权

US6080603A Fixtures and methods for lead bonding and deformation 有权
标题翻译：引线键合和变形的夹具和方法
公开(公告)号：US6080603A
公开(公告)日：2000-06-27
申请号：US268286
申请日：1999-03-15
申请人： Thomas Distefano , John W. Smith , Anthony B. Faraci
发明人： Thomas Distefano , John W. Smith , Anthony B. Faraci
IPC分类号： H01L21/60 , H01L21/30 , H01L21/48 , H01L21/603 , H01L23/12 , H01L23/22 , H01L23/48 , H01L23/498 , H01L23/50 , H01L23/64 , H01R12/71 , H05K1/11 , H05K3/36 , H05K3/40 , H01L21/44
CPC分类号： H01L23/4985 , H01L21/4839 , H01L23/22 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/642 , H01L24/72 , H05K3/4084 , H01L2224/16 , H01L2224/45124 , H01L2224/73253 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01066 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H01L2924/3025 , H01L2924/351 , H05K1/118 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , H05K3/361 , Y10T29/49126 , Y10T29/49144 , Y10T29/49158
摘要： In a method for mounting a sheet-like microelectronic element, the sheet-like element comprises a dielectric layer having a top surface and a bottom surface and is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. A plurality of leads are formed on the bottom surface of the sheet-like element, the leads including bonding pads. In other embodiments, a method is provided for bonding bond pads on a sheet-like microelectronic element to contacts on a microelectronic component.
摘要翻译：在安装片状微电子元件的方法中，片状元件包括具有顶表面和底表面的电介质层，并且首先接合到膨胀环。然后将膨胀环加热以拉伸片状元件。然后将具有小于膨胀环内径的外径的框架环结合到片状元件。多个引线形成在片状元件的底表面上，引线包括接合焊盘。在其他实施例中，提供了一种用于将片状微电子元件上的接合焊盘接合到微电子部件上的接触的方法。

10. 发明授权

US6086386A Flexible connectors for microelectronic elements 失效
标题翻译：用于微电子元件的柔性连接器
公开(公告)号：US6086386A
公开(公告)日：2000-07-11
申请号：US862151
申请日：1997-05-22
申请人： Joseph Fjelstad , Thomas H. DiStefano , Konstantine Karavakis , Anthony B. Faraci , Tan Nguyen
发明人： Joseph Fjelstad , Thomas H. DiStefano , Konstantine Karavakis , Anthony B. Faraci , Tan Nguyen
IPC分类号： H01R11/01 , G01R31/28 , H01L23/32 , H01L23/48 , H01L23/498 , H01R12/52 , H01R33/76 , H05K3/32 , H05K3/34 , H05K3/40 , H05K7/10 , H01R12/00
CPC分类号： H01L23/32 , H01L23/49827 , H05K3/326 , H05K3/3436 , H05K7/1061 , H01L2224/13111 , H01L2224/16225 , H01L2224/16237 , H01L2224/45144 , H01L2224/73251 , H01L2224/81191 , H01L2224/81385 , H01L2224/81901 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/30107 , H01L2924/3011 , H01L2924/351 , H01R12/52 , H05K2201/0397 , H05K2201/049 , H05K2201/10257 , H05K2201/10378 , H05K2203/041 , H05K3/4092 , Y02P70/613 , Y10T29/49149
摘要： A connector for microelectronic elements includes a sheetlike body having a plurality of active contacts arranged in a regular grid pattern. The active contacts may include several sheetlike metallic projections extending inwardly around a hole in the sheetlike element, on a first major surface of the sheetlike element. A support structure such as a grid array of noncollapsing structural posts is on a second major surface of the sheetlike element, and each of the posts is electrically connected to one of the active contacts. The grid array of posts and the grid array of active contacts are offset from one another so that an active contact is surrounded by several posts. The posts support the sheetlike element spaced away from a substrate to which the posts are attached. A microelectronic element having bump leads thereon may be engaged by contacting the bump leads with the active contacts, and deflecting the sheetlike element between the bump leads on one side and the posts on the other side. The assembly can be tested, and if found acceptable, the bump leads can be permanently bonded to the contacts.
摘要翻译：用于微电子元件的连接器包括具有布置成规则网格图案的多个活动触点的片状体。有源触点可以包括在片状元件的第一主表面上围绕片状元件中的孔向内延伸的几个片状金属突起。支撑结构例如非隔离结构柱的格子阵列在片状元件的第二主表面上，并且每个柱电连接到一个活动触点。柱的网格阵列和活动触点的网格阵列彼此偏移，使得活动触点被多个柱包围。支柱支撑与柱连接的基板间隔开的片状元件。其上具有凸起引线的微电子元件可以通过使凸起引线与活动触头接触，并使片状元件在一侧的凸起引线与另一侧上的柱之间偏转而接合。可以测试组件，如果发现可接受，则凸块引线可以永久地粘合到触点上。

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