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21. 发明申请

US20090161901A1 ULTRA THIN PACKAGE FOR ELECTRIC ACOUSTIC SENSOR CHIP OF MICRO ELECTRO MECHANICAL SYSTEM 有权
标题翻译：微电子机械系统电声传感器芯片超薄包
公开(公告)号：US20090161901A1
公开(公告)日：2009-06-25
申请号：US12172900
申请日：2008-07-14
申请人： Tzong-Che Ho , Jason Pan , Pin Chang , Chin-Horng Wang , Jung-Tai Chen , Hsin-Li Lee , Kai-Hsiang Yen
发明人： Tzong-Che Ho , Jason Pan , Pin Chang , Chin-Horng Wang , Jung-Tai Chen , Hsin-Li Lee , Kai-Hsiang Yen
IPC分类号： H04R1/00
CPC分类号： H04R19/005 , B81B7/0058 , B81B2201/0257 , H01L2924/0002 , H01L2924/00
摘要： An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.
摘要翻译：提供了一种用于微机电系统的电声传感器芯片的超薄封装。衬底具有与第一衬底表面相对的第一衬底表面和第二衬底表面。在第二基板表面上形成至少一个导体凸块。提供具有与第一芯片表面相对的第一芯片表面和第二芯片表面的电声传感器芯片。第一芯片表面电连接到导体凸块。导体凸块位于第二基板表面和第一芯片表面之间以产生空间。导体凸块用于将信号从传感器芯片传送到基板。形成通过基板的声学开口。

22. 发明申请

US20080278337A1 URINE DETECTION SYSTEM AND METHOD 审中-公开
标题翻译：尿液检测系统和方法
公开(公告)号：US20080278337A1
公开(公告)日：2008-11-13
申请号：US11966880
申请日：2007-12-28
申请人： Tsun-Che Huang , Tzong-Che Ho , Chun-Hsun Chu , Kevin Lee
发明人： Tsun-Che Huang , Tzong-Che Ho , Chun-Hsun Chu , Kevin Lee
IPC分类号： G08B23/00
CPC分类号： A61F13/42
摘要： A urine detection system is provided for detecting degree of wetness of a diaper, comprising a plane printing electrode, a sensor, and a display unit. The plane printing electrode comprises a first electrode area and a second electrode area. The sensor comprises a first sensor electrode, a second sensor electrode and a processor. Wherein the first sensor electrode and the first electrode area forms a first capacitor, and the second sensor electrode and the second electrode area forms a second capacitor. The processor, detects capacitance of the first and second capacitors, and determines a signal representing degree of wetness of the diaper. The display unit receives the signal and displays the degree of wetness corresponding to the signal.
摘要翻译：提供尿检测系统，用于检测尿布的湿度，包括平面印刷电极，传感器和显示单元。平面印刷电极包括第一电极区域和第二电极区域。传感器包括第一传感器电极，第二传感器电极和处理器。其中，第一传感器电极和第一电极区域形成第一电容器，第二传感器电极和第二电极区域形成第二电容器。处理器检测第一和第二电容器的电容，并且确定代表尿布湿度的信号。显示单元接收信号并显示与信号相对应的湿度。

23. 发明授权

US08421216B2 Vacuum hermetic organic packaging carrier 有权
标题翻译：真空密封有机包装载体
公开(公告)号：US08421216B2
公开(公告)日：2013-04-16
申请号：US13111960
申请日：2011-05-20
申请人： Lung-Tai Chen , Tzong-Che Ho , Li-Chi Pan , Yu-Wen Fan
发明人： Lung-Tai Chen , Tzong-Che Ho , Li-Chi Pan , Yu-Wen Fan
IPC分类号： H01L23/12
CPC分类号： H01L41/0533 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/16152 , H01L2924/00014
摘要： A vacuum hermetic organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and an inorganic hermetic insulation film. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and exposes a portion of the first surface. The inorganic hermetic insulation film at least covers the exposed first surface to achieve an effect of completely hermetically sealing the organic packaging carrier.
摘要翻译：提供真空密封有机包装载体。有机包装载体包括有机基板，导电电路层和无机密封绝缘膜。有机基板具有第一表面。导电电路层位于第一表面上并暴露第一表面的一部分。无机密封绝缘膜至少覆盖暴露的第一表面，以实现完全气密密封有机包装载体的效果。

24. 发明申请

US20120241938A1 ORGANIC PACKAGING CARRIER 有权
标题翻译：有机包装机
公开(公告)号：US20120241938A1
公开(公告)日：2012-09-27
申请号：US13490480
申请日：2012-06-07
申请人： Lung-Tai Chen , Tzong-Che Ho , Li-Chi Pan , Yu-Wen Fan
发明人： Lung-Tai Chen , Tzong-Che Ho , Li-Chi Pan , Yu-Wen Fan
IPC分类号： H01L23/12
CPC分类号： H01L41/0533 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H03H9/0509 , H03H9/1014 , H01L2924/00014 , H01L2924/00
摘要： An organic packaging carrier is provided. The organic packaging carrier includes an organic substrate, a conductive circuit layer, and a sealing metal layer. The organic substrate has a first surface. The conductive circuit layer is located on the first surface and includes at least a conductive layer and a sealing ring. The sealing ring is a closed ring. The sealing metal layer is located on the sealing ring, wherein a meterial of the sealing metal layer includes AgSn and is lead-free.
摘要翻译：提供有机包装载体。有机包装载体包括有机基板，导电电路层和密封金属层。有机基板具有第一表面。导电电路层位于第一表面上并且至少包括导电层和密封环。密封环是封闭环。密封金属层位于密封环上，其中密封金属层的一部分包括AgSn并且是无铅的。

25. 发明授权

US07915065B2 Wafer level sensing package and manufacturing process thereof 有权
标题翻译：晶圆级感测封装及其制造工艺
公开(公告)号：US07915065B2
公开(公告)日：2011-03-29
申请号：US12331539
申请日：2008-12-10
申请人： Lung-Tai Chen , Chun-Hsun Chu , Tzong-Che Ho , Bor-Chen Tsai
发明人： Lung-Tai Chen , Chun-Hsun Chu , Tzong-Che Ho , Bor-Chen Tsai
IPC分类号： H01L21/00
CPC分类号： B81C1/00793 , B81B7/0054 , B81B2201/0292 , B81B2207/07 , B81C1/00182 , B81C2201/053 , H01L2224/0401 , H01L2224/05548 , H01L2224/13023 , H01L2924/1461 , H01L2924/00
摘要： A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.
摘要翻译：描述了晶片级感测封装及其制造工艺。该过程包括提供具有感测芯片的晶片，其中每个感测芯片具有感测区域和焊盘; 在晶片表面上形成应力释放层; 在应力释放层上包覆光致抗蚀剂层; 图案化光致抗蚀剂层以暴露垫和应力释放层的一部分，而不暴露感测区域的开口区域; 在由光致抗蚀剂层暴露的应力释放层的部分上形成再分布焊盘的导电金属层; 去除光致抗蚀剂层; 在所述应力释放层和所述导电金属层上形成再包覆光致抗蚀剂层; 在再分布的焊盘区域上方的再包层光致抗蚀剂层中形成孔; 以及在所述孔中形成导电凸块以电连接到所述导电金属层。

26. 发明申请

US20090124074A1 WAFER LEVEL SENSING PACKAGE AND MANUFACTURING PROCESS THEREOF 有权
标题翻译： WAFER水平感测包装及其制造工艺
公开(公告)号：US20090124074A1
公开(公告)日：2009-05-14
申请号：US12331539
申请日：2008-12-10
申请人： Lung-Tai Chen , Chun-Hsun Chu , Tzong-Che Ho , Bor-Chen Tsai
发明人： Lung-Tai Chen , Chun-Hsun Chu , Tzong-Che Ho , Bor-Chen Tsai
IPC分类号： H01L21/768
CPC分类号： B81C1/00793 , B81B7/0054 , B81B2201/0292 , B81B2207/07 , B81C1/00182 , B81C2201/053 , H01L2224/0401 , H01L2224/05548 , H01L2224/13023 , H01L2924/1461 , H01L2924/00
摘要： A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.
摘要翻译：描述了晶片级感测封装及其制造工艺。该过程包括提供具有感测芯片的晶片，其中每个感测芯片具有感测区域和焊盘; 在晶片表面上形成应力释放层; 在应力释放层上包覆光致抗蚀剂层; 图案化光致抗蚀剂层以暴露垫和应力释放层的一部分，而不暴露感测区域的开口区域; 在由光致抗蚀剂层暴露的应力释放层的部分上形成再分布焊盘的导电金属层; 去除光致抗蚀剂层; 在所述应力释放层和所述导电金属层上形成再包覆光致抗蚀剂层; 在再分布的焊盘区域上方的再包层光致抗蚀剂层中形成孔; 并且在所述孔中形成导电凸块以电连接到所述导电金属层。

27. 发明申请

US20080074274A1 Diaper 审中-公开
标题翻译：尿布
公开(公告)号：US20080074274A1
公开(公告)日：2008-03-27
申请号：US11654559
申请日：2007-01-18
申请人： Ying-Chiang Hu , Hung-Hsin Tsai , Chun-Hsun Chu , Tzong-Che Ho
发明人： Ying-Chiang Hu , Hung-Hsin Tsai , Chun-Hsun Chu , Tzong-Che Ho
IPC分类号： G08B23/00
CPC分类号： A61F13/42
摘要： The present invention provides a diaper including a body, a sensing module disposed on the body for detecting humidity of the body and wirelessly transmitting an electrical signal converted from the humidity and a receiving module for receiving the electrical signal transmitted by the sensing module and generating an alarm signal.
摘要翻译：本发明提供了一种尿布，其包括主体，设置在身体上用于检测身体湿度的无线传感器的感测模块，以及从湿度转换的电信号和接收模块，用于接收由感测模块发送的电信号，报警信号。

28. 发明授权

US07119429B2 3-D stackable semiconductor package 有权
标题翻译： 3-D可堆叠半导体封装
公开(公告)号：US07119429B2
公开(公告)日：2006-10-10
申请号：US11074732
申请日：2005-03-09
申请人： Shu-Ming Chang , Tzong-Che Ho
发明人： Shu-Ming Chang , Tzong-Che Ho
IPC分类号： H01L23/02 , H01L23/48
CPC分类号： H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2224/32145 , H01L2224/73267 , H01L2225/1035 , H01L2225/1058 , H01L2225/1094 , H01L2924/0002 , H01L2924/3511 , H01L2924/00
摘要： A 3-D stackable semiconductor package includes a first component and a second component. The semiconductor package is formed by stacking the back of the first component and the back of the second component together. The metal pads on the surfaces of the first component and the second component are redistributed to the edge of the first and the second components by a redistribution layer. A plurality of electric conduction posts is formed at the edge of the first and the second component to transmit electric signals between them. The semiconductor package transmits electric signals to the PCB by the electric conductive bumps.
摘要翻译： 3-D可堆叠半导体封装包括第一部件和第二部件。半导体封装通过将第一部件的背面和第二部件的背面堆叠在一起而形成。第一部件和第二部件的表面上的金属焊盘通过再分布层重新分配到第一和第二部件的边缘。在第一和第二部件的边缘处形成多个导电柱，以在它们之间传输电信号。半导体封装通过导电凸块将电信号传输到PCB。

29. 发明授权

US08763457B2 Sensing device and manufacturing method thereof 有权
标题翻译：检测装置及其制造方法
公开(公告)号：US08763457B2
公开(公告)日：2014-07-01
申请号：US13154426
申请日：2011-06-06
申请人： Lung-Tai Chen , Yu-Wen Hsu , Tzong-Che Ho , Li-Chi Pan
发明人： Lung-Tai Chen , Yu-Wen Hsu , Tzong-Che Ho , Li-Chi Pan
IPC分类号： G01D11/24
CPC分类号： B81C1/00293 , B81C2203/0118 , G01D11/245 , G01L19/0092 , G01L19/147 , G01P1/023 , H01L23/315 , H01L2924/0002 , H01L2924/00
摘要： A sensing device can be provided with sealed and open-type chambers in various conditions for accommodating different types of sensing structural components by stacking multiple substrates, wherein the condition of a sealed chamber depends on condition taken in substrate bonding process. Owing to sealing a channel of the sealed chamber by the substrate, superior sealing performance is achieved as compared to those adopting solder or sealing material, and thus the condition of the sealed chamber can be finely controlled.
摘要翻译：感测装置可以设置有各种条件的密封和开放式室，用于通过堆叠多个基板来容纳不同类型的感测结构部件，其中密封室的状态取决于在基板接合过程中采取的条件。由于通过基板密封密封室的通道，与使用焊料或密封材料的密封室相比，实现了优异的密封性能，因此可以精细地控制密封室的状态。

30. 发明申请

US20120146163A1 MICROPHONE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：麦克风包装结构及其制造方法
公开(公告)号：US20120146163A1
公开(公告)日：2012-06-14
申请号：US13206466
申请日：2011-08-09
申请人： Tzong-Che Ho , Chin-Fu Kuo , Hsin-Li Lee , Yao-Jung Lee , Li-Chi Pan
发明人： Tzong-Che Ho , Chin-Fu Kuo , Hsin-Li Lee , Yao-Jung Lee , Li-Chi Pan
IPC分类号： H01L29/84 , H01L21/30
CPC分类号： B81C1/00309 , B81B2201/0257 , B81C1/0023 , H01L2224/11 , H04R19/005 , H04R19/04 , H04R31/00
摘要： A microphone package structure is provided, including an integrated circuit (IC) structure and a microphone structure disposed thereover and electrically connected therewith. The IC structure includes a first semiconductor substrate with opposite first and second surfaces, and a first through hole disposed in and through the first semiconductor substrate. The microphone structure includes: a second semiconductor substrate with opposite third and fourth surfaces, wherein the third surface faces to the second surface of the first semiconductor substrate; a second through hole disposed in and through the second semiconductor substrate; an acoustic sensing device embedded in the second through hole and adjacent to the third surface; and a sealing layer disposed over the fourth surface of the second semiconductor substrate, defining a back chamber with the sealing layer, wherein the first through hole allows acoustic pressure waves to penetrate and pass therethrough to the acoustic sensing device.
摘要翻译：提供了麦克风封装结构，包括集成电路（IC）结构和设置在其上并与之电连接的麦克风结构。 IC结构包括具有相对的第一和第二表面的第一半导体衬底和设置在第一半导体衬底中并穿过第一半导体衬底的第一通孔。麦克风结构包括：具有相对的第三和第四表面的第二半导体衬底，其中第三表面面对第一半导体衬底的第二表面; 设置在所述第二半导体衬底中并穿过所述第二半导体衬底的第二通孔; 声学传感装置，其嵌入在所述第二通孔中并与所述第三表面相邻; 以及密封层，其设置在所述第二半导体衬底的所述第四表面上，限定具有所述密封层的后室，其中所述第一通孔允许声压波穿透并穿过所述声学感测装置。

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