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1. 发明授权

US08508022B2 Ultra thin package for electric acoustic sensor chip of micro electro mechanical system 有权
标题翻译：微电子机械系统电声传感器芯片超薄封装
公开(公告)号：US08508022B2
公开(公告)日：2013-08-13
申请号：US12172900
申请日：2008-07-14
申请人： Tzong-Che Ho , Jason Pan , Pin Chang , Chin-Horng Wang , Jung-Tai Chen , Hsin-Li Lee , Kai-Hsiang Yen
发明人： Tzong-Che Ho , Jason Pan , Pin Chang , Chin-Horng Wang , Jung-Tai Chen , Hsin-Li Lee , Kai-Hsiang Yen
IPC分类号： H01L23/552 , H01L21/00 , H05K7/00
CPC分类号： H04R19/005 , B81B7/0058 , B81B2201/0257 , H01L2924/0002 , H01L2924/00
摘要： An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.
摘要翻译：提供了一种用于微机电系统的电声传感器芯片的超薄封装。衬底具有与第一衬底表面相对的第一衬底表面和第二衬底表面。在第二基板表面上形成至少一个导体凸块。提供具有与第一芯片表面相对的第一芯片表面和第二芯片表面的电声传感器芯片。第一芯片表面电连接到导体凸块。导体凸块位于第二基板表面和第一芯片表面之间以产生空间。导体凸块用于将信号从传感器芯片传送到基板。形成通过基板的声学开口。

2. 发明授权

US08261105B2 Switching power circuit and computer system 有权
标题翻译：开关电源电路和计算机系统
公开(公告)号：US08261105B2
公开(公告)日：2012-09-04
申请号：US12631053
申请日：2009-12-04
申请人： Sheng-Chieh Su , Jung-Tai Chen
发明人： Sheng-Chieh Su , Jung-Tai Chen
IPC分类号： G06F1/00 , G05F1/00 , H03K17/00
CPC分类号： H02M1/34 , H02M3/156 , H02M2001/346 , Y02B70/1491
摘要： The invention relates to a switching power circuit connected to a motherboard of a computer system. The switching power circuit includes a PWM circuit and a snubber circuit. The PWM circuit includes a phase terminal, and it may output an output voltage to the motherboard via the phase terminal. The snubber circuit includes a zener diode. A negative terminal of the zener diode is connected to the phase terminal, and a positive terminal is connected to the ground terminal. The level of a breakdown voltage of the zener diode is equal to the level of the output voltage in a steady state.
摘要翻译：本发明涉及连接到计算机系统的主板的开关电源电路。开关电源电路包括PWM电路和缓冲电路。 PWM电路包括相位端子，并且可以经由相位端子将输出电压输出到母板。缓冲电路包括齐纳二极管。齐纳二极管的负端子连接到相位端子，正极端子连接到接地端子。齐纳二极管的击穿电压的电平等于稳定状态下输出电压的电平。

3. 发明申请

US20100176774A1 METHOD FOR ADJUSTING SUPPLIED POWER IN COMPUTER SYSTEM BACKGROUND OF THE INVENTION 审中-公开
标题翻译：用于调整计算机系统中的供电的方法背景技术
公开(公告)号：US20100176774A1
公开(公告)日：2010-07-15
申请号：US12639273
申请日：2009-12-16
申请人： Jung-Tai Chen , Ko-Shu Chen
发明人： Jung-Tai Chen , Ko-Shu Chen
IPC分类号： G05F1/565
CPC分类号： G06F1/3287 , G06F1/3203 , Y02D10/171
摘要： A method for adjusting supplied power is used at a computer system and a multi-phase power supply. The multi-phase power supply includes a plurality of power converting units. The method includes the following steps. First, a load state of the computer system is detected. Second, the number of the actuated multi-phase power supply in the power converting units is adjusted according to the load state.
摘要翻译：在计算机系统和多相电源中使用调节供电的方法。多相电源包括多个电力转换单元。该方法包括以下步骤。首先，检测计算机系统的负载状态。第二，根据负载状态来调整功率转换单元中的致动多相电源的数量。

4. 发明申请

US20090161901A1 ULTRA THIN PACKAGE FOR ELECTRIC ACOUSTIC SENSOR CHIP OF MICRO ELECTRO MECHANICAL SYSTEM 有权
标题翻译：微电子机械系统电声传感器芯片超薄包
公开(公告)号：US20090161901A1
公开(公告)日：2009-06-25
申请号：US12172900
申请日：2008-07-14
申请人： Tzong-Che Ho , Jason Pan , Pin Chang , Chin-Horng Wang , Jung-Tai Chen , Hsin-Li Lee , Kai-Hsiang Yen
发明人： Tzong-Che Ho , Jason Pan , Pin Chang , Chin-Horng Wang , Jung-Tai Chen , Hsin-Li Lee , Kai-Hsiang Yen
IPC分类号： H04R1/00
CPC分类号： H04R19/005 , B81B7/0058 , B81B2201/0257 , H01L2924/0002 , H01L2924/00
摘要： An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.
摘要翻译：提供了一种用于微机电系统的电声传感器芯片的超薄封装。衬底具有与第一衬底表面相对的第一衬底表面和第二衬底表面。在第二基板表面上形成至少一个导体凸块。提供具有与第一芯片表面相对的第一芯片表面和第二芯片表面的电声传感器芯片。第一芯片表面电连接到导体凸块。导体凸块位于第二基板表面和第一芯片表面之间以产生空间。导体凸块用于将信号从传感器芯片传送到基板。形成通过基板的声学开口。

5. 发明申请

US20070222008A1 METHOD FOR MANUFACTURING PLASTIC PACKAGING OF MEMS DEVICES AND STRUCTURE THEREOF 审中-公开
标题翻译：制造MEMS器件的塑料包装及其结构的方法
公开(公告)号：US20070222008A1
公开(公告)日：2007-09-27
申请号：US11616766
申请日：2006-12-27
申请人： Jung-Tai Chen , Wen-Yang Chang , Yii-Tay Chiou , Chun-Hsun Chu
发明人： Jung-Tai Chen , Wen-Yang Chang , Yii-Tay Chiou , Chun-Hsun Chu
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： B81C1/00896 , B81C2203/0154 , H01L2224/48091 , H01L2224/48247 , H01L2924/10155 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： A plastic packaging of MEMS device and a method therefore are provided. The method includes the steps of: provide a carrier having a surface; provide at least one MEMS device having an active surface with a sensitive area and bonding pads thereon and a back surface; proceed a photoresist process to form a sacrificial layer on the sensitive area; bind and electrically connect the MEMS device to the surface of the carrier; form at least one molding compound, to which the upper surface of the sacrificial layer is exposed. Finally, decompose the sacrificial layer by a solvent to expose the MEMS device on the sensitive area, so as to let the sensitive area contact with ambient atmosphere.
摘要翻译：提供了MEMS器件的塑料封装及其方法。该方法包括以下步骤：提供具有表面的载体; 提供至少一个MEMS器件，其具有活性表面和敏感区域及其上的接合焊盘和背面; 进行光致抗蚀剂处理以在敏感区域上形成牺牲层; 将MEMS器件绑定并电连接到载体的表面; 形成至少一个模塑料，牺牲层的上表面暴露于该模塑料。最后，通过溶剂分解牺牲层，使敏感区域上的MEMS器件暴露，使敏感区域与环境大气接触。

6. 发明申请

US20060110106A1 Fiber waveguide optical subassembly module 有权
标题翻译：光纤波导光学组件模块
公开(公告)号：US20060110106A1
公开(公告)日：2006-05-25
申请号：US11105514
申请日：2005-04-14
申请人： Ming-Lang Tsai , Ming-Jie Chou , Bor-Chen Tsai , Zong-Yuan Wu , Chih-Hsiang Ko , Chin-Sheng Chang , Yii-Tay Chiou , Chun-Hsun Chu , Jung-Tai Chen
发明人： Ming-Lang Tsai , Ming-Jie Chou , Bor-Chen Tsai , Zong-Yuan Wu , Chih-Hsiang Ko , Chin-Sheng Chang , Yii-Tay Chiou , Chun-Hsun Chu , Jung-Tai Chen
IPC分类号： G02B6/36
CPC分类号： G02B6/4246
摘要： A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.
摘要翻译：光纤波导光学子组件使用多模光纤来增加有源光学元件与波导之间的对准公差。由于光耦合间隙，滤光片较薄以降低色散。该子组件进一步组合光学台以实现被动定位。因此降低成本，提高传输速率。

7. 发明授权

US08850233B2 Multi-phase voltage regulator module system 有权
标题翻译：多相电压调节器模块系统
公开(公告)号：US08850233B2
公开(公告)日：2014-09-30
申请号：US12652072
申请日：2010-01-05
申请人： Sheng-Chieh Su , Jung-Tai Chen
发明人： Sheng-Chieh Su , Jung-Tai Chen
IPC分类号： G06F1/26 , G06F1/30 , H02M3/158
CPC分类号： G06F1/26 , H02M3/1584
摘要： A multi-phase voltage regulator module system includes a VRM and a phase control circuit. The VRM is capable of outputting a load detecting voltage which is direct proportion to the load of the CPU. The phase control circuit outputs a first level phase switching signal to the VRM, and a core voltage outputted by the VRM to the CPU is changed from N phases to M phases when the load detecting voltage increases to a first voltage. The phase control circuit a second level phase switching signal to the VRM, and the core voltage outputted by the VRM to the CPU from M phases to N phases when the load detecting voltage decreases to a second voltage. The first voltage is higher than the second voltage. M is larger than N.
摘要翻译：多相电压调节器模块系统包括VRM和相位控制电路。 VRM能够输出与CPU的负载成正比的负载检测电压。相位控制电路向VRM输出第一电平相位切换信号，并且当负载检测电压增加到第一电压时，由VRM输出到CPU的核心电压从N相变为M相。当负载检测电压降低到第二电压时，相位控制电路将VRM的第二电平相位切换信号和由VRM输出到CPU的M电压的核心电压从M相输出到N相。第一电压高于第二电压。 M大于N.

8. 发明授权

US07770449B2 Resistive-type humidity sensing structure with microbridge and method therefor 有权
标题翻译：具有微桥的电阻式湿度感测结构及其方法
公开(公告)号：US07770449B2
公开(公告)日：2010-08-10
申请号：US11808660
申请日：2007-06-12
申请人： Jung-Tai Chen , Chia-Yen Lee , Yii-Tay Chiou , Chun-Hsun Chu
发明人： Jung-Tai Chen , Chia-Yen Lee , Yii-Tay Chiou , Chun-Hsun Chu
IPC分类号： G01N27/12
CPC分类号： G01N27/048 , Y10T29/49101
摘要： A resistive-type humidity sensing structure with microbridge includes a substrate, a sensing portion, and two measuring electrodes. An isolated layer and a bridge are respectively formed on the substrate. The sensing portion includes a resistive and humidity sensing layer. Two measuring electrodes are formed on the resistive sensing layer corresponding to the bridge, so as to fix the sensing portion on the first isolated layer for measuring resistance values of the resistive sensing layer. The material of the humidity sensing layer changes its volume according to humidity, the length of the resistive sensing layer covered by the humidity sensing layer is warped, and the changes of the length of the material for the resistive sensing layer causes variations of the resistance value. Finally, two measuring electrodes are used to measure the humidity value.
摘要翻译：具有微桥的电阻型湿度检测结构包括基板，感测部分和两个测量电极。在基板上分别形成隔离层和桥。感测部分包括电阻和湿度感测层。在与电桥相对应的电阻感测层上形成两个测量电极，以将感测部分固定在第一隔离层上，以测量电阻感测层的电阻值。湿度传感层的材料根据湿度改变其体积，由湿度感测层覆盖的电阻感测层的长度变形，并且电阻感测层的材料长度的变化导致电阻值的变化。最后，使用两个测量电极来测量湿度值。

9. 发明授权

US07409124B2 Fiber waveguide optical subassembly module 有权
标题翻译：光纤波导光学组件模块
公开(公告)号：US07409124B2
公开(公告)日：2008-08-05
申请号：US11105514
申请日：2005-04-14
申请人： Ming-Lang Tsai , Ming Jie Chou , Bor-Chen Tsai , Zong-Yuan Wu , Chih-Hsiang Ko , Chin-Sheng Chang , Yii-Tay Chiou , Chun-Hsun Chu , Jung-Tai Chen
发明人： Ming-Lang Tsai , Ming Jie Chou , Bor-Chen Tsai , Zong-Yuan Wu , Chih-Hsiang Ko , Chin-Sheng Chang , Yii-Tay Chiou , Chun-Hsun Chu , Jung-Tai Chen
IPC分类号： G02B6/30 , G02B6/36
CPC分类号： G02B6/4246
摘要： A fiber waveguide optical subassembly uses the multi-mode fiber to increase the alignment tolerance between the active optical element and the waveguide. The filter is thinner to lower the dispersion due to the optical coupling gap. The subassembly further combines the optical bench to achieve passive positioning. Therefore it reduces the cost and enhances the transmission rate.
摘要翻译：光纤波导光学子组件使用多模光纤来增加有源光学元件与波导之间的对准公差。由于光耦合间隙，滤光片较薄以降低色散。该子组件进一步组合光学台以实现被动定位。因此降低成本，提高传输速率。

10. 发明申请

US20070188974A1 Humidity sensing structure having a cantilever resistor and method for fabricating the same 有权
标题翻译：具有悬臂电阻的湿度传感结构及其制造方法
公开(公告)号：US20070188974A1
公开(公告)日：2007-08-16
申请号：US11647216
申请日：2006-12-29
申请人： Jung-Tai Chen , Chia-Yen Lee , Yii-Tay Chiou , Chun-Hsun Chu
发明人： Jung-Tai Chen , Chia-Yen Lee , Yii-Tay Chiou , Chun-Hsun Chu
IPC分类号： H01G5/012
CPC分类号： H01G5/18 , H01C10/14 , Y10T29/49099
摘要： A humidity sensing structure having a cantilever resistor and a method for fabricating the same are disclosed. The method includes providing a substrate having a first surface and a second surface; performing an oxidation process on the first surface and the second surface to form a first oxide layer and a second oxide layer respectively; forming a resistance sensing layer on the first oxide layer; forming a humidity sensing layer on the resistance sensing layer; forming in the substrate a through-hole penetrating the first oxide layer and the second oxide layer; and forming a cantilever in the through-hole such that both the humidity sensing layer and the resistance sensing layer are secured in position on the cantilever. In response to humidity changes, the humidity sensing layer varies in volume and in consequence the resistance sensing layer varies in length, allowing ambient humidity to be measured.
摘要翻译：公开了一种具有悬臂电阻的湿度检测结构及其制造方法。该方法包括提供具有第一表面和第二表面的基底; 在所述第一表面和所述第二表面上进行氧化处理以分别形成第一氧化物层和第二氧化物层; 在所述第一氧化物层上形成电阻感测层; 在电阻感测层上形成湿度感测层; 在基板上形成穿透第一氧化物层和第二氧化物层的通孔; 并且在通孔中形成悬臂，使得湿度感测层和电阻感测层都固定在悬臂上的适当位置。响应于湿度变化，湿度感测层的体积变化，因此电阻感测层的长度变化，允许测量环境湿度。

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