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1. 发明授权

US08508022B2 Ultra thin package for electric acoustic sensor chip of micro electro mechanical system 有权
标题翻译：微电子机械系统电声传感器芯片超薄封装
公开(公告)号：US08508022B2
公开(公告)日：2013-08-13
申请号：US12172900
申请日：2008-07-14
申请人： Tzong-Che Ho , Jason Pan , Pin Chang , Chin-Horng Wang , Jung-Tai Chen , Hsin-Li Lee , Kai-Hsiang Yen
发明人： Tzong-Che Ho , Jason Pan , Pin Chang , Chin-Horng Wang , Jung-Tai Chen , Hsin-Li Lee , Kai-Hsiang Yen
IPC分类号： H01L23/552 , H01L21/00 , H05K7/00
CPC分类号： H04R19/005 , B81B7/0058 , B81B2201/0257 , H01L2924/0002 , H01L2924/00
摘要： An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.
摘要翻译：提供了一种用于微机电系统的电声传感器芯片的超薄封装。衬底具有与第一衬底表面相对的第一衬底表面和第二衬底表面。在第二基板表面上形成至少一个导体凸块。提供具有与第一芯片表面相对的第一芯片表面和第二芯片表面的电声传感器芯片。第一芯片表面电连接到导体凸块。导体凸块位于第二基板表面和第一芯片表面之间以产生空间。导体凸块用于将信号从传感器芯片传送到基板。形成通过基板的声学开口。

2. 发明申请

US20090161901A1 ULTRA THIN PACKAGE FOR ELECTRIC ACOUSTIC SENSOR CHIP OF MICRO ELECTRO MECHANICAL SYSTEM 有权
标题翻译：微电子机械系统电声传感器芯片超薄包
公开(公告)号：US20090161901A1
公开(公告)日：2009-06-25
申请号：US12172900
申请日：2008-07-14
申请人： Tzong-Che Ho , Jason Pan , Pin Chang , Chin-Horng Wang , Jung-Tai Chen , Hsin-Li Lee , Kai-Hsiang Yen
发明人： Tzong-Che Ho , Jason Pan , Pin Chang , Chin-Horng Wang , Jung-Tai Chen , Hsin-Li Lee , Kai-Hsiang Yen
IPC分类号： H04R1/00
CPC分类号： H04R19/005 , B81B7/0058 , B81B2201/0257 , H01L2924/0002 , H01L2924/00
摘要： An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.
摘要翻译：提供了一种用于微机电系统的电声传感器芯片的超薄封装。衬底具有与第一衬底表面相对的第一衬底表面和第二衬底表面。在第二基板表面上形成至少一个导体凸块。提供具有与第一芯片表面相对的第一芯片表面和第二芯片表面的电声传感器芯片。第一芯片表面电连接到导体凸块。导体凸块位于第二基板表面和第一芯片表面之间以产生空间。导体凸块用于将信号从传感器芯片传送到基板。形成通过基板的声学开口。

3. 发明申请

US20100139767A1 CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME 有权
标题翻译：芯片包装结构及其制造方法
公开(公告)号：US20100139767A1
公开(公告)日：2010-06-10
申请号：US12472359
申请日：2009-05-26
申请人： Jui-Ching Hsieh , Pin Chang , Chung-De Chen , Li-Chi Pan , Yu-Jen Wang , Chin-Horng Wang
发明人： Jui-Ching Hsieh , Pin Chang , Chung-De Chen , Li-Chi Pan , Yu-Jen Wang , Chin-Horng Wang
IPC分类号： H01L31/024 , H01L23/34 , H01L33/00 , H01L21/50
CPC分类号： H01L23/3672 , H01L23/42 , H01L31/052 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/16 , Y02E10/50 , H01L2924/00014 , H01L2924/0105 , H01L2924/013
摘要： A chip package structure including a heat dissipation substrate, a chip and a heterojunction heat conduction buffer layer is provided. The chip is disposed on the heat dissipation substrate. The heterojunction heat conduction buffer layer is disposed between the heat dissipation substrate and the chip. The heterojunction heat conduction buffer layer includes a plurality of pillars perpendicular to the heat dissipation substrate. The aspect ratio of each pillar is between about 3:1 and 50:1.
摘要翻译：提供了包括散热基板，芯片和异质结导热缓冲层的芯片封装结构。芯片设置在散热基板上。异质结导热缓冲层设置在散热基板和芯片之间。异质结导热缓冲层包括垂直于散热基板的多个支柱。每个柱的纵横比在约3:1至50:1之间。

4. 发明授权

US07989948B2 Chip package structure and method of fabricating the same 有权
标题翻译：芯片封装结构及其制造方法
公开(公告)号：US07989948B2
公开(公告)日：2011-08-02
申请号：US12472359
申请日：2009-05-26
申请人： Jui-Ching Hsieh , Pin Chang , Chung-De Chen , Li-Chi Pan , Yu-Jen Wang , Chin-Horng Wang
发明人： Jui-Ching Hsieh , Pin Chang , Chung-De Chen , Li-Chi Pan , Yu-Jen Wang , Chin-Horng Wang
IPC分类号： H01L21/50
CPC分类号： H01L23/3672 , H01L23/42 , H01L31/052 , H01L33/62 , H01L33/641 , H01L33/642 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/16 , Y02E10/50 , H01L2924/00014 , H01L2924/0105 , H01L2924/013
摘要： A chip package structure including a heat dissipation substrate, a chip and a heterojunction heat conduction buffer layer is provided. The chip is disposed on the heat dissipation substrate. The heterojunction heat conduction buffer layer is disposed between the heat dissipation substrate and the chip. The heterojunction heat conduction buffer layer includes a plurality of pillars perpendicular to the heat dissipation substrate. The aspect ratio of each pillar is between about 3:1 and 50:1.
摘要翻译：提供了包括散热基板，芯片和异质结导热缓冲层的芯片封装结构。芯片设置在散热基板上。异质结导热缓冲层设置在散热基板和芯片之间。异质结导热缓冲层包括垂直于散热基板的多个支柱。每个柱的纵横比在约3:1至50:1之间。

5. 发明授权

US08390399B2 Resonator and periodic structure 有权
标题翻译：谐振器和周期性结构
公开(公告)号：US08390399B2
公开(公告)日：2013-03-05
申请号：US12781112
申请日：2010-05-17
申请人： Tsun-Che Huang , Pin Chang , Feng-Chia Hsu , Chin-Hung Wang
发明人： Tsun-Che Huang , Pin Chang , Feng-Chia Hsu , Chin-Hung Wang
IPC分类号： H03H9/05 , H03H9/24 , H03H9/46
CPC分类号： H03H9/2431 , H03H9/02338 , H03H9/2405 , H03H9/2463 , H03H2009/02354
摘要： A resonator includes a resonating body and at least one periodic structure having one end connected to the resonating body. The periodic structure includes at least two basic structure units with duplicated configuration. The periodic structure blocks wave propagation caused by the vibration of the resonating body. The resonating body has a resonance frequency f0. The periodic structure has a band gap characteristic or a deaf band characteristic within a particular frequency range, and the resonance frequency f0 falls within the particular frequency range of the periodic structure.
摘要翻译：谐振器包括谐振体和至少一个周期性结构，其一端连接到谐振体。周期性结构包括具有重复配置的至少两个基本结构单元。周期性结构阻止由共振体的振动引起的波传播。共振体具有共振频率f0。周期性结构在特定频率范围内具有带隙特性或聋带特性，并且谐振频率f0落在周期性结构的特定频率范围内。

6. 发明申请

US20110074563A1 Swinging device and apparatus for detecting rotating status and information displaying device using the same 有权
标题翻译：用于检测旋转状态的摆动装置和装置以及使用其的信息显示装置
公开(公告)号：US20110074563A1
公开(公告)日：2011-03-31
申请号：US12631502
申请日：2009-12-04
申请人： Pin Chang , Yu-Jen Wang , Chien Li , Chung-De Chen , Pei-Fen Wu
发明人： Pin Chang , Yu-Jen Wang , Chien Li , Chung-De Chen , Pei-Fen Wu
IPC分类号： B62J6/00 , B62J6/06 , F03G7/08 , G01P3/16
CPC分类号： G01P3/16 , B62J6/003 , B62J6/06 , B62J6/20 , F03G7/08
摘要： The present disclosure provides a swinging device having a swinging mechanism disposed on an energy provider, wherein volume and shape of the swinging mechanism and a distance between the swinging mechanism and the energy provider are adjusted so as to control the ratio of the distance and a characteristic value corresponding to the swinging mechanism in a specific range such that the swinging mechanism is capable of resonating with respect to the rotation of the energy provider. The swinging mechanism is capable of detecting the rotating frequency of the energy provider as well as combining with a display unit which is capable of displaying information with respect to the rotating status or displaying image patterns controlled according to the rotating status.
摘要翻译：本公开提供了一种具有设置在能量提供者上的摆动机构的摆动装置，其中调节摆动机构的体积和形状以及摆动机构和能量提供者之间的距离，以便控制距离和特性的比率相应于摆动机构的特定范围的值，使得摆动机构能够相对于能量提供者的旋转而谐振。摆动机构能够检测能量提供者的旋转频率，以及与能够显示关于旋转状态的信息的显示单元或显示根据旋转状态控制的图像模式的组合。

7. 发明申请

US20100078062A1 METHOD AND SYSTEM FOR LIGHT COLLECTION AND LIGHT ENERGY CONVERTING APPARATUS 有权
标题翻译：光收集和光能转换装置的方法和系统
公开(公告)号：US20100078062A1
公开(公告)日：2010-04-01
申请号：US12358228
申请日：2009-01-22
申请人： Liang-De Wang , Yuan-Xiang Zou , Li-Chi Pan , Pin Chang
发明人： Liang-De Wang , Yuan-Xiang Zou , Li-Chi Pan , Pin Chang
IPC分类号： H01L31/052 , G02B5/08
CPC分类号： F24S23/00 , F24S23/30 , F24S23/31 , F24S23/79 , F24S2023/832 , H01L31/0543 , H01L31/0547 , Y02E10/44 , Y02E10/52
摘要： A light collection system including a light concentrating device and a reflective curving-surface device is provided. The light concentrating device receives at least a portion of an incident light and forwardly emits the portion of the incident light after concentrating and passing it through a first focal region, so as to obtain a first-stage output light. The reflective curving-surface device has an entrance aperture for receiving the first-stage output light. The reflective curving-surface device includes a reflective inner curving surface, and at least a portion of the reflective inner curving surface has a second focal region. The first focal region and the second focal region are confocal or approximately confocal within a range. As a result, at least a portion of the first-stage output light is confocally converted into a forwardly emitted second-stage output light.
摘要翻译：提供了一种包括聚光装置和反射弯曲表面装置的集光系统。聚光装置接收入射光的至少一部分，并且在聚焦并使其通过第一焦点区域之后向前发射入射光的一部分，以获得第一级输出光。反射弯曲表面装置具有用于接收第一级输出光的入口孔。反射弯曲表面装置包括反射内弯曲表面，并且反射内弯曲表面的至少一部分具有第二焦点区域。第一焦点区域和第二聚焦区域在一个范围内是共焦的或近似共焦的。结果，第一级输出光的至少一部分被共焦地转换成向前发射的第二级输出光。

8. 发明申请

US20050057711A1 Bi-display mode liquid crystal display 有权
标题翻译：双显示模式液晶显示
公开(公告)号：US20050057711A1
公开(公告)日：2005-03-17
申请号：US10894011
申请日：2004-07-20
申请人： Pin Chang , Cheng Liu , Chun Chao
发明人： Pin Chang , Cheng Liu , Chun Chao
IPC分类号： G02B5/20 , G02F1/1335 , G02F1/13357 , G02F1/13363
CPC分类号： G02F1/133555 , G02F1/133514
摘要： A bi-display mode liquid crystal display comprises a top and a bottom transparent substrate that are arranged in a parallel way, and between the two transparent substrates are a liquid crystal layer, a semi-reflector and a color filter sequentially, in addition, a top and a bottom polarizer are set on the outer surface of the top and the bottom transparent substrate respectively; by setting the semi-reflector upon the color filter, it makes the light not pass through the color filter and increase the reflection rate. Therefore, the present invention not only provides a reflective mode of high brightness gray scale display, but has a transmissive mode of beautiful color, and has the advantage of power saving and easy to use.
摘要翻译：双显示模式液晶显示器包括以平行方式布置的顶部和底部透明基板，并且在两个透明基板之间是液晶层，半反射器和滤色器，另外，顶部和底部偏振器分别设置在顶部和底部透明基底的外表面上; 通过将半反射器设置在滤色器上，使得光不通过滤色器并增加反射率。因此，本发明不仅提供了高亮度灰度显示的反射模式，而且具有美观的透射模式，并且具有省电且易于使用的优点。

9. 发明授权

US08754573B2 Ultrasonic transducer detector with resonant unit having a thickness of half-wavelength of the operating frequency 有权
标题翻译：具有谐振单元的超声波换能器检测器具有工作频率的半波长的厚度
公开(公告)号：US08754573B2
公开(公告)日：2014-06-17
申请号：US13039279
申请日：2011-03-02
申请人： Pin Chang , Feng-Chia Hsu , Di-Bao Wang , Chin-Hung Wang
发明人： Pin Chang , Feng-Chia Hsu , Di-Bao Wang , Chin-Hung Wang
IPC分类号： H01L41/08 , B06B1/06
CPC分类号： B06B1/064 , A61B8/4483 , A61N7/02 , A61N2007/0078 , B06B1/0607
摘要： An ultrasonic transducer detector having a high operating frequency is provided. The ultrasonic transducer detector comprises a substrate and an ultrasonic transducer array. The substrate has a plurality of openings, and the ultrasonic transducer array is disposed on the substrate. The ultrasonic transducer array has a plurality of resonance units, and the thickness of each resonance unit is equivalent to ½ wavelength of the operating frequency of the ultrasonic transducer. Each resonance unit comprises an oscillating element and a piezoelectric element. The oscillating element has a first surface adjacent to the substrate, and the piezoelectric element is disposed on the first surface and located in the corresponding opening.
摘要翻译：提供具有高工作频率的超声换能器检测器。超声换能器检测器包括基底和超声换能器阵列。基板具有多个开口，超声波换能器阵列设置在基板上。超声波换能器阵列具有多个谐振单元，每个谐振单元的厚度等于超声换能器的工作频率的1/2波长。每个谐振单元包括振荡元件和压电元件。振荡元件具有与基板相邻的第一表面，并且压电元件设置在第一表面上并且位于相应的开口中。

10. 发明授权

US08471651B2 Microelectromechanical filter 有权
标题翻译：微机电滤波器
公开(公告)号：US08471651B2
公开(公告)日：2013-06-25
申请号：US12940054
申请日：2010-11-05
申请人： Tsun-Che Huang , Feng-Chia Hsu , Pin Chang , Chin-Hung Wang
发明人： Tsun-Che Huang , Feng-Chia Hsu , Pin Chang , Chin-Hung Wang
IPC分类号： H03H9/46 , H03H9/00
CPC分类号： H03H9/02228 , H03H9/462 , H03H9/505 , H03H9/54
摘要： A microelectromechanical filter is provided. The microelectromechanical filter includes an input electrode, an output electrode, one or several piezoelectric resonators, one or several high quality factor resonators, and one or several coupling beams. The input electrode and the output electrode are disposed on the piezoelectric resonators. The high quality factor resonator is silicon or of piezoelectric materials, and there is no metal electrode on top of the resonator. The coupling beam is connected between the piezoelectric resonator and the high quality factor resonator. The coupling beam transmits an acoustic wave among the resonators, and controls a bandwidth of filter. The microelectromechanical filter with low impedance and high quality factor fits the demand for next-generation communication systems.
摘要翻译：提供了微机电滤波器。微机电滤波器包括输入电极，输出电极，一个或多个压电谐振器，一个或多个高品质因子谐振器以及一个或多个耦合光束。输入电极和输出电极设置在压电谐振器上。高品质因子谐振器是硅或压电材料，谐振器顶部没有金属电极。耦合光束连接在压电谐振器和高品质因子谐振器之间。耦合光束在谐振器之间传播声波，并控制滤波器的带宽。具有低阻抗和高品质因数的微机电滤波器适合下一代通信系统的需求。

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