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1. 发明申请

US20110150261A1 CAPACITIVE TRANSDUCER AND FABRICATION METHOD 有权
标题翻译：电容式传感器和制造方法
公开(公告)号：US20110150261A1
公开(公告)日：2011-06-23
申请号：US12643417
申请日：2009-12-21
申请人： Tzong-Che HO , Lung-Tai Chen , Yao-Jung Lee , Chao-Ta Huang , Li-Chi Pan , Yu-Sheng Hsieh
发明人： Tzong-Che HO , Lung-Tai Chen , Yao-Jung Lee , Chao-Ta Huang , Li-Chi Pan , Yu-Sheng Hsieh
IPC分类号： H04R9/08 , H01G7/00
CPC分类号： H01G5/011 , H04R19/005 , H04R19/04 , H04R31/00
摘要： A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.
摘要翻译：公开了一种电容式换能器和制造方法。所述电容式换能器包括基板，安装在所述基板上的第一电极，具有通孔和所述通孔旁边的空腔的盖，穿过所述通孔安装在所述盖上的第二电极。第二电极响应于通过通孔施加到其上的压力波动而变形，并与第一电极一起限定为电容器。电容器包括具有压力波动的电容变量，并且空腔限定用于可变形的第二电极的后室。

2. 发明申请

US20070152689A1 Modular probe card 有权
标题翻译：模块式探针卡
公开(公告)号：US20070152689A1
公开(公告)日：2007-07-05
申请号：US11322408
申请日：2006-01-03
申请人： Yi-Chang Lee , An-Hong Liu , Hsiang-Ming Huang , Yao-Jung Lee , Yeong-Her Wang
发明人： Yi-Chang Lee , An-Hong Liu , Hsiang-Ming Huang , Yao-Jung Lee , Yeong-Her Wang
IPC分类号： G01R31/02
CPC分类号： G01R1/07378
摘要： A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circuit board and the probe head where the interposer includes a substrate and a plurality of pogo pins. The substrate has a first surface, a second surface, and a plurality of through holes penetrating from the first surface to the second surface. The pogo pins are secured in the through holes of the substrate. Each of the pogo pins has a first contact point, a second contact point, and a spring therebetween, whereby the first contact points are elastically extruded from the first surface to contact the first contact pad, and the second contact points are elastically extruded from the second surface to contact the second contact pad, so as to overcome the poor electrical connections between the printed circuit board and the probe head through the interposer due to poor coplanarity of the first contact pads of the printed circuit board.
摘要翻译：模块化探针卡包括印刷电路板，插入件和探针头，其中印刷电路板具有多个第一接触焊盘，探头具有多个第二接触焊盘。插入器设置在印刷电路板和探针头之间，其中插入器包括基板和多个弹簧销。基板具有从第一表面到第二表面的第一表面，第二表面和多个通孔。弹簧销固定在基板的通孔中。每个弹簧销具有第一接触点，第二接触点和它们之间的弹簧，由此第一接触点从第一表面弹性挤出以接触第一接触垫，并且第二接触点从第二表面接触第二接触焊盘，以便克服印刷电路板和探针头之间通过插入器的不良电连接，因为印刷电路板的第一接触焊盘的共面性差。

3. 发明申请

US20060091510A1 Probe card interposer 审中-公开
标题翻译：探头卡插件
公开(公告)号：US20060091510A1
公开(公告)日：2006-05-04
申请号：US11076935
申请日：2005-03-11
申请人： An-Hong Liu , Yeong-Her Wang , Yao-Jung Lee
发明人： An-Hong Liu , Yeong-Her Wang , Yao-Jung Lee
IPC分类号： H01L23/02
CPC分类号： G01R31/2889 , G01R1/0416 , H05K3/326 , H05K3/4092 , H05K2201/0397 , H05K2201/09909 , H05K2201/10378
摘要： A probe card interposer includes a substrate with a plurality of conductive bumps disposed on first surface of the substrate. Each conductive bump comprises a dielectric core and a plurality of conductive leads. The suspended ends of the conductive wires extend toward the centers of the corresponding dielectric cores and are elastically supported by the corresponding dielectric cores. Therefore, the interposer can be installed between a probe head and a multi-layer PCB to make good electrical contacts to the probe head through the conductive bumps. In the embodiment, a plurality of symmetric conductive bumps are disposed on second surface of the substrate and are electrically connected to the conductive bumps on first surface of the substrate through vias or conductive posts. The conductive bumps can electrically contact the multi-layer PCB.
摘要翻译：探针卡插入件包括具有设置在基板的第一表面上的多个导电凸块的基板。每个导电凸块包括介质芯和多个导电引线。导线的悬挂端部朝向相应介质芯的中心延伸，并被相应的介质芯片弹性地支撑。因此，插入器可以安装在探针头和多层PCB之间，以通过导电凸块与探头头形成良好的电接触。在本实施例中，多个对称导电凸块设置在基板的第二表面上，并且通过通孔或导电柱与基板的第一表面上的导电凸块电连接。导电凸块可以电接触多层PCB。

4. 发明申请

US20060086890A1 Package structure of image sensor device 审中-公开
标题翻译：图像传感器装置的封装结构
公开(公告)号：US20060086890A1
公开(公告)日：2006-04-27
申请号：US11254660
申请日：2005-10-21
申请人： Yeong-Ching Chao , An-Hong Liu , Yao-Jung Lee
发明人： Yeong-Ching Chao , An-Hong Liu , Yao-Jung Lee
IPC分类号： H01L27/00
CPC分类号： H01L27/14618 , H01L2224/48091 , H01L2224/73265 , H01L2924/16195 , H01L2924/00014
摘要： An image sensor package mainly includes a substrate cover having a chip cavity, an image sensor chip, a flexible circuit, and a transparent carrier. The flexible circuit is attached to the transparent carrier. The image sensor chip is flip-chip mounted on the flexible circuit, and then the substrate cover is mounted on the flexible circuit. The flexible circuit has a plurality of first leads electrically connected to bumps of the image sensor chip, and a plurality of second leads to inner terminals of the substrate cover, so that the electrical connection is established between the image sensor chip and the substrate cover through the flexible circuit. A plurality of outer terminals are formed on the opposing surface of the substrate cover corresponding to the inner terminals. Accordingly, the image sensor package provides the excellent electrical transmission and the protection of the image sensor chip. Preferably, a liquid sealant, NCP, or ACP is disposed between the substrate cover and the flexible circuit for hermetically sealing the image sensor chip in the chip cavity. In another embodiment, a glass substrate can replace the assembly of the flexible circuit and the transparent carrier.
摘要翻译：图像传感器封装主要包括具有芯片腔的衬底盖，图像传感器芯片，柔性电路和透明载体。柔性电路连接到透明载体上。图像传感器芯片被倒装安装在柔性电路上，然后将基板盖安装在柔性电路上。柔性电路具有与图像传感器芯片的凸块电连接的多个第一引线和多个第二引线到基板盖的内部端子，从而在图像传感器芯片和基板盖之间建立电连接灵活电路。多个外部端子形成在与内部端子对应的基板盖的相对表面上。因此，图像传感器封装提供优异的电传输和图像传感器芯片的保护。优选地，液体密封剂NCP或ACP设置在衬底盖和柔性电路之间，用于密封芯片腔中的图像传感器芯片。在另一个实施例中，玻璃基板可以代替柔性电路和透明载体的组件。

5. 发明授权

US06853205B1 Probe card assembly 有权
标题翻译：探头卡组合
公开(公告)号：US06853205B1
公开(公告)日：2005-02-08
申请号：US10620448
申请日：2003-07-17
申请人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
发明人： Shih-Jye Cheng , An-Hong Liu , Yeong-Her Wang , Yuan-Ping Tseng , Yao-Jung Lee
IPC分类号： G01R1/073 , G01R1/18 , G01R31/28 , G01R31/02
CPC分类号： G01R1/07342 , G01R1/06733 , G01R1/18 , G01R31/2889
摘要： A probe card assembly is disclosed. The probe card assembly comprises a stiffener ring combining respectively with an upper printed circuit board and a lower printed circuit board. A plurality of coaxial transmitters are installed in the stiffener ring, and connect to the upper and lower printed circuit boards by cable connectors. The lower printed circuit board is assembled with a detachable probe head which comprises a silicon substrate with probing points and a probe head carrier. A downset is formed at the center of the probe head carrier. The standardized coaxial transmitters, printed circuit boards and probe heads are then assembled as a probe card assembly for testing all sorts of IC products.
摘要翻译：公开了一种探针卡组件。探针卡组件包括分别与上印刷电路板和下印刷电路板组合的加强环。多个同轴发射器安装在加强环中，并通过电缆连接器连接到上下印刷电路板。下部印刷电路板组装有可拆卸的探针头，该探头包括具有探测点的硅衬底和探针头托架。在探针头托架的中心处形成一个凹陷。然后将标准化的同轴发射器，印刷电路板和探头组装成用于测试各种IC产品的探针卡组件。

6. 发明授权

US06689638B2 Substrate-on-chip packaging process 有权
标题翻译：基片上封装工艺
公开(公告)号：US06689638B2
公开(公告)日：2004-02-10
申请号：US10227341
申请日：2002-08-26
申请人： Chung-Hung Lin , Cho-Liang Chung , Jesse Huang , Yao-Jung Lee
发明人： Chung-Hung Lin , Cho-Liang Chung , Jesse Huang , Yao-Jung Lee
IPC分类号： H01L2144
CPC分类号： H01L24/97 , H01L23/3114 , H01L23/4951 , H01L23/49513 , H01L24/29 , H01L24/31 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/73257 , H01L2224/83192 , H01L2224/83855 , H01L2224/83856 , H01L2224/92147 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01087 , H01L2924/15311 , H01L2224/85 , H01L2224/83 , H01L2924/00014 , H01L2924/00
摘要： A SOC (Substrate-On-Chip) packaging process is disclosed. A layer of two-stage thermosetting mixture with solvent is coating on an upside of a substrate. Thereafter, the substrate is heated for removing solvent so that the two-stage thermosetting mixture becomes a B-stage dry adhesive film without solvent. Thus, the bonding pads of the chip are not covered by the dry adhesive film and a better operating flexibility is obtained in the SOC packaging process.
摘要翻译：公开了一种SOC（片上片上）封装工艺。将一层具有溶剂的两阶段热固性混合物涂覆在基材的上侧。此后，加热基板以除去溶剂，使得两阶段热固性混合物成为没有溶剂的B阶干式粘合剂膜。因此，芯片的焊盘不被干燥的粘合膜覆盖，并且在SOC封装工艺中获得更好的操作灵活性。

7. 发明授权

US08693711B2 Capacitive transducer and fabrication method 有权
标题翻译：电容式传感器及其制造方法
公开(公告)号：US08693711B2
公开(公告)日：2014-04-08
申请号：US12643417
申请日：2009-12-21
申请人： Tzong-Che Ho , Lung-Tai Chen , Yao-Jung Lee , Chao-Ta Huang , Li-Chi Pan , Yu-Sheng Hsieh
发明人： Tzong-Che Ho , Lung-Tai Chen , Yao-Jung Lee , Chao-Ta Huang , Li-Chi Pan , Yu-Sheng Hsieh
IPC分类号： H04R25/00
CPC分类号： H01G5/011 , H04R19/005 , H04R19/04 , H04R31/00
摘要： A capacitive transducer and fabrication method are disclosed. The capacitive transducer includes a substrate, a first electrode mounted on the substrate, a cap having a through-hole and a cavity beside the through-hole, a second electrode mounted on the cap across the through-hole. The second electrode is deformable in response to pressure fluctuations applied thereto via the through-hole and defines, together with the first electrode, as a capacitor. The capacitor includes a capacitance variable with the pressure fluctuations and the cavity defines a back chamber for the deformable second electrode.
摘要翻译：公开了一种电容式换能器和制造方法。所述电容式换能器包括基板，安装在所述基板上的第一电极，具有通孔和所述通孔旁边的空腔的盖，穿过所述通孔安装在所述盖上的第二电极。第二电极响应于通过通孔施加到其上的压力波动而变形，并与第一电极一起限定为电容器。电容器包括具有压力波动的电容变量，并且空腔限定用于可变形的第二电极的后室。

8. 发明授权

US07936032B2 Film type package for fingerprint sensor 有权
标题翻译：指纹传感器胶片式包装
公开(公告)号：US07936032B2
公开(公告)日：2011-05-03
申请号：US11727200
申请日：2007-03-23
申请人： Ming-Liang Huang , Yao-Jung Lee , Ming-Hsun Li
发明人： Ming-Liang Huang , Yao-Jung Lee , Ming-Hsun Li
IPC分类号： H01L31/107
CPC分类号： G06K9/00026 , G06K9/00973 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15311 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A thin-film fingerprint sensor package primarily comprises a fingerprint sensor chip, a plurality of bumps, a wiring film with a plurality of leads and at least an encapsulant to encapsulate the bumps. A sensing area is formed on an active surface of the fingerprint sensor chip. The bumps are disposed on the active surface and located at two opposing sides of the sensing area. The wiring film has an opening to expose the sensing area. Each lead has an inner end and an outer end. The inner ends are located at two opposing sides of the opening and are bonded to the bumps. Preferably, the wiring film has a flexible extension and the outer ends of the leads are rerouted to the extension for external electrical connections.
摘要翻译：薄膜指纹传感器封装主要包括指纹传感器芯片，多个凸块，具有多个引线的布线膜和至少封装凸块的密封剂。感测区域形成在指纹传感器芯片的有效表面上。凸起设置在活动表面上并且位于感测区域的两个相对侧。布线膜具有暴露感测区域的开口。每个引线都有一个内端和一个外端。内端位于开口的两个相对侧并且接合到凸起。优选地，布线膜具有柔性延伸部分，并且引线的外端重新路由到用于外部电连接的延伸部分。

9. 发明授权

US07696443B2 Electronic device with a warped spring connector 有权
标题翻译：具有翘曲弹簧连接器的电子设备
公开(公告)号：US07696443B2
公开(公告)日：2010-04-13
申请号：US11188860
申请日：2005-07-26
申请人： Yi-Chang Lee , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
发明人： Yi-Chang Lee , An-Hong Liu , Yeong-Her Wang , Yeong-Ching Chao , Yao-Jung Lee
IPC分类号： H01R12/04 , H05K1/11
CPC分类号： H01L24/72 , G01R1/06727 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/3025 , H01L2924/351 , H01R13/2407 , H05K1/0216 , H05K3/4092 , H01L2924/00
摘要： An electronic device comprises a substrate and at least a warped spring connector. The substrate has a signal bonding pad and a ground plane. The warped spring connector is disposed on the substrate and is connected to the bonding pad. The warped spring connector includes at least a ground lead electrically connected to the ground plane, a dielectric layer on the ground lead, and a transmitting lead on the dielectric layer. The transmitting lead is bonded to the bonding pad. The ground lead is isolated from and close to the transmitting lead to solve cross-talk and noise problem. Furthermore, the coefficient of thermal expansion of the transmitting lead is different from that of the dielectric layer or the ground lead such that the warped spring connector has a suspending end suspending away from the substrate.
摘要翻译：电子设备包括基板和至少一个翘曲的弹簧连接器。衬底具有信号焊盘和接地层。翘曲弹簧连接器设置在基板上并连接到接合垫。翘曲弹簧连接器至少包括电连接到接地平面的接地引线，接地引线上的电介质层和介电层上的传输引线。传输引线接合到焊盘。接地线与发射线隔离并靠近发射线，以解决串扰和噪声问题。此外，传输引线的热膨胀系数与电介质层或接地引线的热膨胀系数不同，使得翘曲弹簧连接器具有悬挂远离基板的悬挂端。

10. 发明授权

US07372286B2 Modular probe card 有权
标题翻译：模块式探针卡
公开(公告)号：US07372286B2
公开(公告)日：2008-05-13
申请号：US11322408
申请日：2006-01-03
申请人： Yi-Chang Lee , An-Hong Liu , Hsiang-Ming Huang , Yao-Jung Lee , Yeong-Her Wang
发明人： Yi-Chang Lee , An-Hong Liu , Hsiang-Ming Huang , Yao-Jung Lee , Yeong-Her Wang
IPC分类号： G01R1/073
CPC分类号： G01R1/07378
摘要： A modular probe card comprises a printed circuit board, an interposer, and a probe head where the printed circuit board has a plurality of first contact pads, the probe head has a plurality of second contact pads. The interposer is disposed between the printed circuit board and the probe head where the interposer includes a substrate and a plurality of pogo pins. The substrate has a first surface, a second surface, and a plurality of through holes penetrating from the first surface to the second surface. The pogo pins are secured in the through holes of the substrate. Each of the pogo pins has a first contact point, a second contact point, and a spring therebetween, whereby the first contact points are elastically extruded from the first surface to contact the first contact pad, and the second contact points are elastically extruded from the second surface to contact the second contact pad, so as to overcome the poor electrical connections between the printed circuit board and the probe head through the interposer due to poor coplanarity of the first contact pads of the printed circuit board.
摘要翻译：模块化探针卡包括印刷电路板，插入件和探针头，其中印刷电路板具有多个第一接触焊盘，探头具有多个第二接触焊盘。插入器设置在印刷电路板和探针头之间，其中插入器包括基板和多个弹簧销。基板具有从第一表面到第二表面的第一表面，第二表面和多个通孔。弹簧销固定在基板的通孔中。每个弹簧销具有第一接触点，第二接触点和它们之间的弹簧，由此第一接触点从第一表面弹性挤出以接触第一接触垫，并且第二接触点从第二表面接触第二接触焊盘，以便克服印刷电路板和探针头之间通过插入器的不良电连接，因为印刷电路板的第一接触焊盘的共面性差。

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