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21. 发明授权

US4596733A Electroerosion recording material with polyorganosiloxane overlayer 失效
标题翻译：具有聚有机硅氧烷覆盖层的电解记录材料
公开(公告)号：US4596733A
公开(公告)日：1986-06-24
申请号：US567213
申请日：1983-12-30
申请人： Mitchell S. Cohen , Keith S. Pennington , Krishna G. Sachdev , William D. Weber
发明人： Mitchell S. Cohen , Keith S. Pennington , Krishna G. Sachdev , William D. Weber
IPC分类号： B32B15/12 , B41M5/24 , B41N1/14 , D21H19/00 , D21H19/02 , D21H19/32 , G01D15/34
CPC分类号： B41M5/245 , Y10T428/24917 , Y10T428/265 , Y10T428/31663
摘要： For high speed electroerosion recording, this invention provides a polyorganosiloxane overlayer which includes high lubricity solid particles as a filler. The overlayer provides a combination lubricant and protective layer for the thin metal layer which is removed by electroerosion to prevent damage for the areas not removed by electroerosion. The polyorganosiloxane overlayer is preferably crosslinked, and is relatively hard, durable, and especially resistant to thermal degradation by the electroerosion arcing. This is important to avoid debris buildup at the recording electrodes resulting from the high temperature arcing for removal of the overlayer in the areas where recording takes place.
摘要翻译：对于高速电腐蚀记录，本发明提供了一种包含高润滑性固体颗粒作为填料的聚有机硅氧烷覆盖层。该覆盖层为薄金属层提供了组合润滑剂和保护层，该金属层通过电蚀去除，以防止未经电腐蚀除去的区域的损坏。聚有机硅氧烷覆盖层优选是交联的，并且相对硬，耐用，并且特别是耐电腐蚀电弧的热降解。这是重要的，以避免由于在发生记录的区域中的高温电弧而导致的记录电极上的碎屑积聚以去除覆盖层。

22. 发明授权

US4283775A Contiguous disk bubble storage 失效
标题翻译：相邻的磁盘空泡存储
公开(公告)号：US4283775A
公开(公告)日：1981-08-11
申请号：US58718
申请日：1979-07-18
申请人： Mitchell S. Cohen
发明人： Mitchell S. Cohen
IPC分类号： G11C11/14 , G11C19/08
CPC分类号： G11C19/0816 , G11C19/0875
摘要： A bubble storage system using contiguous propagation elements is described using magnetically soft drive layers for movement of the bubble domains in a bubble domain film, in response to the reorientation of a magnetic drive field in the plane of the drive layers. In contrast with prior art contiguous element propagation structures, charged walls are not employed for movement of bubble domains. Instead, magnetic poles along the drive layers are used to move the domains. Two drive layers are used, each of which is comprised of a magnetically soft material, such as permalloy. The drive layers are located at different heights with respect to the layer in which the magnetic bubble domains exist, the bottom drive layer being comprised of contiguous propagation elements defining a generally undulating edge along which the magnetic bubble domains move. This layer can be comprised of permalloy contiguous disks, diamonds, etc. The top layer is comprised of magnetically soft elements located over the cusp regions formed along the undulating edges of the underlying drive layer. For propagation around the disks or diamonds, the bottom drive layer is predominant in determining bubble motion. However, in the art of the cusp regions along the undulating edge defined by the bottom drive layer, the magnetic poles produced by the top drive layer are predominant. These elements in the top drive layer produce potential wells at those locations corresponding to cusps along the undulating edge defined by the contiguous propagation elements in the bottom drive layer, and therefore control bubble motion in the cusp regions. This eliminates a serious problem to satisfactory bubble motion along contiguous propagation element devices. A single level masking fabrication process is described where the top and bottom drive layers can be fabricated through the same mask, and a total chip design is shown which provides all functions required in a complete storage chip.
摘要翻译：使用磁软驱动层来描述使用连续传播元件的气泡存储系统，以响应于在驱动层的平面中的磁驱动场的重新定向来响应气泡区膜中的气泡域的移动。与现有技术的连续元件传播结构不同，带电壁不用于气泡畴的移动。相反，沿着驱动层的磁极用于移动域。使用两个驱动层，每个驱动层由柔软的材料构成，例如坡莫合金。驱动层相对于其中存在磁性气泡区域的层位于不同的高度，底部驱动层由限定磁性泡区域沿其移动的大致起伏的边缘的连续传播元件组成。该层可以由坡莫合金连续盘，金刚石等组成。顶层由位于沿着下驱动层的起伏边缘形成的尖端区域上方的软磁元件构成。为了在盘或钻石周围传播，底部驱动层主要用于确定气泡运动。然而，在由底部驱动层限定的起伏边缘的尖端区域的领域中，由顶部驱动层产生的磁极是主要的。顶部驱动层中的这些元件在沿着由底部驱动层中的连续传播元件限定的起伏边缘的尖端对应的那些位置产生势阱，因此控制尖端区域中的气泡运动。这消除了沿连续传播元件装置令人满意的气泡运动的严重问题。描述了单层屏蔽制造工艺，其中顶部和底部驱动层可以通过相同的掩模制造，并且示出了提供完整存储芯片中所需的所有功能的总芯片设计。

23. 发明授权

US06762119B2 Method of preventing solder wetting in an optical device using diffusion of Cr 失效
标题翻译：使用Cr的扩散防止光学装置中的焊料润湿的方法
公开(公告)号：US06762119B2
公开(公告)日：2004-07-13
申请号：US09885791
申请日：2001-06-20
申请人： Sudipta K. Ray , Mitchell S. Cohen , Lester Wynn Herron , Mario J. Interrante , Thomas E. Lombardi , Subhash L. Shinde
发明人： Sudipta K. Ray , Mitchell S. Cohen , Lester Wynn Herron , Mario J. Interrante , Thomas E. Lombardi , Subhash L. Shinde
IPC分类号： H01L2144
CPC分类号： H01S5/02272 , G02B6/4238 , H01L24/45 , H01L2224/45144 , H01L2224/48137 , H01L2224/48227 , H01L2224/73265 , H01L2924/01079 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01S5/02236 , H01S5/02268 , H01L2924/00 , H01L2924/00014
摘要： A process and structure for forming an optical subassembly in an integrated circuit, comprising: defining electrically conducting lines and bonding pads in a metallization layer on a substrate; depositing a passivation layer over the metallization layer; etching the passivation layer to remove the passivation layer from each of the bonding pads and a portion of the metallization layer associated with each of the bonding pads; diffusing Cr from the lines proximate said bonding pads to prevent solder wetting down lines; bonding an optical device to one of the bonding pads; and attaching the substrate to a carrier utilizing solder bond attachment.
摘要翻译：一种用于在集成电路中形成光学子组件的工艺和结构，包括：在衬底上的金属化层中限定导电线和焊盘; 在所述金属化层上沉积钝化层; 蚀刻钝化层以从每个接合焊盘和与每个焊盘相关联的金属化层的一部分去除钝化层; 从靠近所述接合焊盘的线扩散Cr，以防止焊料向下润湿; 将光学器件接合到所述接合焊盘之一; 以及使用焊料粘合附着将衬底附接到载体上。

24. 发明授权

US5155777A Scattered light blocking layer for optoelectronic receivers 失效
标题翻译：用于光电接收器的散射光阻挡层
公开(公告)号：US5155777A
公开(公告)日：1992-10-13
申请号：US721731
申请日：1991-06-26
申请人： Marie Angelopoulos , Mitchell S. Cohen , Andrew T. S. Pomerene , Dennis L. Rogers
发明人： Marie Angelopoulos , Mitchell S. Cohen , Andrew T. S. Pomerene , Dennis L. Rogers
IPC分类号： H01L21/027 , G02B6/122 , G02B6/42 , H01L31/10
CPC分类号： G02B6/122
摘要： Methods, apparatus and manufacturing processes are set forth which reduce the affects of scattered light in electro-optical devices, fiber optic links, etc., through the use of radiation sensitive compounds which, for example, can be easily applied to a semiconductor wafer when fabricating a solid state integrated receiver. According to the invention, a given radiation sensitive compound is transformed into a light blocking material (i.e., a material that will not transmit light) as a result of a lithographic (and in some cases a photolithographic) process. The resultant blocking material may be easily removed from any regions which is designed to receive transmitted light (for example, detector regions); while any other light sensitive regions remain covered (i.e., are protected) by the blocking material at the conclusion of the process.
摘要翻译：提出了通过使用例如可以容易地应用于半导体晶片的辐射敏感化合物来减少电光装置，光纤链路等中的散射光的影响的方法，装置和制造方法，制造固态集成接收机。根据本发明，由于光刻（并且在一些情况下是光刻）工艺，给定的辐射敏感化合物被转化成阻光材料（即，不透光的材料）。所得到的阻挡材料可以容易地从被设计成接收透射光的区域（例如，检测器区域）中去除; 而在该过程结束时，任何其它光敏区域仍然被封闭材料覆盖（即被保护）。

25. 发明授权

US5042709A Methods and apparatus for precise alignment of objects 失效
标题翻译：用于精确对准物体的方法和装置
公开(公告)号：US5042709A
公开(公告)日：1991-08-27
申请号：US542271
申请日：1990-06-22
申请人： Michael F. Cina , Mitchell S. Cohen , Ephraim B. Flint , Kurt R. Grebe , Douglas J. Hall , Kenneth P. Jackson , Modest M. Oprysko
发明人： Michael F. Cina , Mitchell S. Cohen , Ephraim B. Flint , Kurt R. Grebe , Douglas J. Hall , Kenneth P. Jackson , Modest M. Oprysko
IPC分类号： H01L21/30 , G02B6/42 , H01L21/027 , H01L21/68 , H01S5/00
CPC分类号： H01L21/681 , G02B6/4224 , G02B6/4236 , G02B6/4249 , G02B6/4226 , Y10T29/49131 , Y10T29/49133
摘要： Methods and apparatus are set forth for passively and precisely aligning pairs of objects, in particular, microelectronic components such as semiconductor lasers and fibers, utilizing fiducial marks. Additionally, methods and apparatus are set forth for combining passive and active alignment techniques where high degrees of alignment precision are required. Still further, techniques are described for fixing prealigned objects, independent of how the objects are prealigned, to a mounting surface in a manner that maintains the relative (aligned) position of the objects. Further yet, in order to help minimize manufacturing costs with respect to production of, for example, microelectronic assemblies, batch processing techniques are described which utilize the novel alignment procedures contemplated by the invention.

26. 发明授权

US4567490A Electroerosion recording medium of improved lubricity 失效
标题翻译：电润滑记录介质具有改善的润滑性
公开(公告)号：US4567490A
公开(公告)日：1986-01-28
申请号：US567300
申请日：1983-12-30
申请人： Ali Afzali-Ardakani , Mitchell S. Cohen , Keith S. Pennington , Krishna G. Sachdev
发明人： Ali Afzali-Ardakani , Mitchell S. Cohen , Keith S. Pennington , Krishna G. Sachdev
IPC分类号： B41M5/24 , B41N1/14 , H05K3/00 , H05K3/08 , H05K3/28 , G01D15/34 , B05D5/12 , B32B5/16 , G03C5/24
CPC分类号： B41M5/245 , H05K3/0002 , H05K3/08 , Y10T428/25 , Y10T428/254 , Y10T428/31692
摘要： Electroerosion recording materials are provided with a surface lubricant film of particulate lubricating nonconductive graphite fluoride and optional conductive materials in a polymeric binder. The lubricating agents reduce stylus scratching of the conductive layer during electroerosion printing, improve contrast, provide a beneficial coating on the writing electrode or stylus and improve the handling and writing characteristics of the recording material. The lubricating agents/polymer films are especially useful (1) where the substrate of the recording material is light transmissive and, after the electroerosion process, the resulting product is suitable for direct-negative applications and (2) where direct offset masters are produced by removal of noneroded lubricant film.
摘要翻译：电解记录材料在聚合物粘合剂中设置有颗粒润滑非导电氟化石墨和可选导电材料的表面润滑剂膜。润滑剂在电腐蚀印刷期间降低导电层的触针刮擦，改善对比度，在书写电极或触控笔上提供有益的涂层，并提高记录材料的处理和书写特性。润滑剂/聚合物膜是特别有用的（1）其中记录材料的基底是透光的，并且在电腐蚀过程之后，所得到的产品适用于直接阴性应用，和（2）其中直接偏移主体由去除非润滑油膜。

27. 发明授权

US4187553A Pedestal bubble domain chip and processes for making same 失效
标题翻译：基座泡泡域芯片及其制作工艺
公开(公告)号：US4187553A
公开(公告)日：1980-02-05
申请号：US863829
申请日：1977-12-23
申请人： Kie Y. Ahn , Mitchell S. Cohen , John V. Powers , Lung-jo Tao
发明人： Kie Y. Ahn , Mitchell S. Cohen , John V. Powers , Lung-jo Tao
IPC分类号： G11C11/14 , G11C19/08 , H01F10/06 , H01F41/34 , H01F10/02
CPC分类号： G11C19/085 , G11C19/0841 , H01F10/06 , H01F41/34 , Y10S428/90 , Y10S428/928 , Y10T428/1291
摘要： An improved magnetic bubble domain chip and processes for making the chip are described. The chip is comprised of a magnetic bubble domain film in which small bubble domains can be moved, and overlying layers of metallurgy. The layer of metallurgy closest to the bubble film is an electrically conductive layer having apertures (or recesses) therein. This layer is patterned to provide current carrying conductors. The next overlayer is a layer of magnetic material having in-plane magnetization which is patterned to provide the propagation elements used to move the bubble domains. In a particular embodiment, the magnetic layer is comprised of a magnetically soft material, such as permalloy. The chip is characterized by the provision of insulating pedestals located in the apertures of the conductive layer. These insulating pedestals are located in the regions of the chip used for sensing (and/or bubble generation). That is, they take the place of the thick conductive material in those areas of the chip. The sensor and bubble generators are usually portions of the in-plane magnetic layer. If the height of the insulating pedestals is the same as the height of the conductive layer, planarization is achieved and each overlayer lies in a single plane, where the planes are parallel to one another. However, the pedestal can be of any desired height. This chip is particularly advantageous for use with bubble domains having diameters of about 1 micron and less, since the pedestal magnetic chip can be provided by single level masking techniques in which only a single critical masking step is required. The insulating pedestal can be formed prior to deposition of the current carrying conductive layer, or subsequent to deposition of this layer.
摘要翻译：描述了改进的磁泡区域芯片和制造芯片的工艺。该芯片由可以移动小气泡区域的磁性气泡区域薄膜和上覆的冶金层构成。最靠近气泡膜的冶金层是其中具有孔（或凹槽）的导电层。图案化该层以提供载流导体。下一个覆盖层是具有面内磁化的磁性材料层，其被图案化以提供用于移动气泡畴的传播元件。在一个具体实施例中，磁性层由诸如坡莫合金之类的软磁材料构成。芯片的特征在于设置位于导电层的孔中的绝缘基座。这些绝缘基座位于用于感测（和/或气泡产生）的芯片的区域中。也就是说，它们代替了芯片的那些区域中的厚导电材料。传感器和气泡发生器通常是面内磁性层的一部分。如果绝缘基座的高度与导电层的高度相同，则实现平坦化，并且每个覆盖层位于平面彼此平行的单个平面中。然而，基座可以是任何期望的高度。该芯片对于直径约为1微米和更小的气泡区域是特别有利的，因为可以通过单层屏蔽技术提供基座磁性芯片，其中仅需要单个临界屏蔽步骤。绝缘基座可以在沉积载流导电层之前或之后沉积该层形成。

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