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    • 5. 发明申请
    • Current-perpendicular-to-plane magnetoresistive sensor with free layer stabilized against vortex magnetic domains generated by the sense current
    • 电流垂直于平面的磁阻传感器,具有由感应电流产生的涡流磁畴的自由层
    • US20050174701A1
    • 2005-08-11
    • US10776484
    • 2004-02-10
    • Prakash KasirajStefan Maat
    • Prakash KasirajStefan Maat
    • G11B5/39G01R33/09G11B5/127G11B5/33H01F10/06H01F41/14H01L43/08H01L43/12
    • G11B5/39G11B5/1278
    • A current-perpendicular-to-the-plane (CPP) magnetoresistive sensor has additional layers for stabilizing the free layer against sense-current-generated magnetic fields. A ferromagnetic stabilizing layer is spaced from the free layer by a spacer layer and is exchange coupled with a second antiferromagnetic layer, the first antiferromagnetic layer being the conventional one for pinning the pinned layer in the CPP sensor. The stabilizing layer is in a vortex or other non-longitudinal magnetization pattern that is fixed by exchange coupling with the second antiferromagnetic layer. The stabilizing layer is also ferromagnetically coupled to the free layer across the spacer layer so that in the absence of both a sense current and an external magnetic field, the free and stabilization layers have similarly shaped vortex or other non-longitudinal magnetization patterns. The sense current generates a vortex magnetic field in the free layer opposite to the fixed vortex magnetization pattern in the stabilizing layer and essentially erases the effect of the vortex magnetization pattern in the free layer.
    • 电流垂直平面(CPP)磁阻传感器具有用于使自由层稳定于感测电流产生的磁场的附加层。 铁磁稳定层通过间隔层与自由层间隔开并与第二反铁磁层交换耦合,第一反铁磁层是用于固定CPP传感器中被钉扎层的常规的。 稳定层是通过与第二反铁磁层的交换耦合固定的涡流或其它非纵向磁化模式。 稳定层还通过间隔层铁磁耦合到自由层,使得在不存在感测电流和外部磁场的情况下,自由和稳定层具有类似形状的涡流或其它非纵向磁化模式。 感应电流在自由层中产生与稳定层中的固定涡流磁化模式相反的涡流磁场,并且基本上消除了自由层中的涡流磁化模式的影响。
    • 9. 发明授权
    • Bubble device fabrication
    • 气泡装置制造
    • US4272348A
    • 1981-06-09
    • US962251
    • 1978-11-20
    • Daniel E. CoxSusan M. KaneJohn V. Powers
    • Daniel E. CoxSusan M. KaneJohn V. Powers
    • G11C11/14G11C19/08H01F10/06H01F10/12H01F10/13H01F41/14H01F41/34C23C15/00C23F1/02
    • H01F41/34G11C19/0808H01F10/06Y10T29/49069
    • A single level masking process for producing microelectronic structures, such as magnetic bubble domain devices, which require very fine line widths. This is a subtractive dry process using a very thin, additively plated mask in order to obtain optimum lithographic resolution. Use of the very thin plated mask eliminates the need for a thick resist layer which would adversely affect resolution. In one example, a double layer metallurgy comprising a conductor layer (such as Au) and an overlying magnetically soft layer (such as NiFe) is patterned using a thin Ti (or Cr) mask. The Ti mask is subtractively patterned using a NiFe mask which is itself patterned by electroplating through a thin resist layer. The double layer NiFe/Au structure is patterned to provide devices having high aspect ratio, good pattern acuity, and uniform thicknesses, where the minimum feature is 1 micron or less.
    • 用于产生需要非常细线宽的微电子结构的单层掩模工艺,例如磁性气泡域装置。 这是使用非常薄的附加电镀掩模的减法干法,以获得最佳的光刻分辨率。 使用非常薄的电镀掩模消除了对分辨率的不利影响的厚抗蚀剂层的需要。 在一个实例中,使用薄的Ti(或Cr)掩模来图案化包括导体层(例如Au)和上覆的软磁性层(例如NiFe)的双层冶金。 使用NiFe掩模对Ti掩模进行减法图案化,NiFe掩模本身通过电镀通过薄的抗蚀剂层进行图案化。 将双层NiFe / Au结构图案化以提供具有高纵横比,良好图案敏锐度和均匀厚度的器件,其中最小特征为1微米或更小。