专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明申请

US20110260320A1 METHOD OF MAKING A CONNECTION COMPONENT WITH POSTS AND PADS 有权
标题翻译：制造与POSTS和PADS的连接部件的方法
公开(公告)号：US20110260320A1
公开(公告)日：2011-10-27
申请号：US13155825
申请日：2011-06-08
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
IPC分类号： H01L23/498
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译：封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48））暴露在介电层的外表面处，焊盘通过迹线连接到柱。电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。还公开了制造连接部件的方法。

22. 发明申请

US20080185705A1 Microelectronic packages and methods therefor 审中-公开
标题翻译：微电子封装及其方法
公开(公告)号：US20080185705A1
公开(公告)日：2008-08-07
申请号：US11895191
申请日：2007-08-23
申请人： Philip R. Osborn , Belgacem Haba , Ellis Chau , Giles Humpston , Masud Beroz , Teck-Gyu Kang , Dat Nghe Duong , Jae M. Park , Jesse Burl Thompson , Richard Dewitt Crisp
发明人： Philip R. Osborn , Belgacem Haba , Ellis Chau , Giles Humpston , Masud Beroz , Teck-Gyu Kang , Dat Nghe Duong , Jae M. Park , Jesse Burl Thompson , Richard Dewitt Crisp
IPC分类号： H01L23/48
CPC分类号： H01L23/4985 , H01L23/49811 , H01L23/49816 , H01L24/16 , H01L24/31 , H01L24/48 , H01L24/73 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/1357 , H01L2224/13582 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2224/83194 , H01L2224/83365 , H01L2224/83385 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/19041 , H01L2924/3011 , H01L2224/13099 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of the conductive terminals and the conductive posts being electrically interconnected and at least some of the conductive terminals being offset from the conductive posts. The first surface of the flexible substrate is juxtaposed with the first face of the microelectronic element so that the conductive posts project from the flexible substrate toward the first face of the microelectronic element. The conductive posts are electrically interconnected with the contacts of the microelectronic element and at least some of the conductive terminals are movable relative to the microelectronic element.
摘要翻译：微电子封装包括具有包括触点的第一面的微电子元件和具有第一表面和第二表面的柔性基板，从第一表面突出的导电柱和在第二表面可接触的导电端子，至少一些导电端子并且所述导电柱电互连，并且所述导电端子中的至少一些偏离所述导电柱。柔性基板的第一表面与微电子元件的第一面并置，使得导电柱从柔性基板朝向微电子元件的第一面突出。导电柱与微电子元件的触点电互连，并且至少一些导电端子可相对于微电子元件移动。

23. 发明授权

US5507872A Contact sensor-based microdispensing tool 失效
标题翻译：接触传感器微分辨工具
公开(公告)号：US5507872A
公开(公告)日：1996-04-16
申请号：US343151
申请日：1994-11-22
申请人： Annette B. Antenucci , Michael Berger , Judy E. Lambert , David T. Naugle , Stephen A. Olson , Jae M. Park , Thomas Rednour , Benoit Ventimiglia , Richard J. Weckesser
发明人： Annette B. Antenucci , Michael Berger , Judy E. Lambert , David T. Naugle , Stephen A. Olson , Jae M. Park , Thomas Rednour , Benoit Ventimiglia , Richard J. Weckesser
IPC分类号： B05C11/10 , B05C5/00
CPC分类号： B05C11/1034 , Y10T156/1798
摘要： A contact-based microdispensing tool for delivering extremely minute globules of epoxy material to repaired sites on high circuit density modules. The tool includes a solid probe integrally mounted in a contact sensor assembly incorporating an air-levitated core of a linear voltage differential transducer. The levitated core and the probe connected thereto are supported in neutral equilibrium by an air bearing assembly. As the assembly probe is brought into contact with one of the sites, the globule flows upon the site, the equilibrium is disturbed and a signal is produced by the transducer to halt movement of the probe relative to the site.
摘要翻译：一种基于接触的微型分配工具，用于将高分辨环氧树脂材料的小球提供给高电压密度模块上的修复位置。该工具包括整体地安装在包含线性电压差分换能器的空气悬浮芯的接触传感器组件中的固体探头。悬浮的芯和与其连接的探针通过空气轴承组件支撑在中性平衡中。当组装探针与其中一个部位接触时，球体流过现场，平衡受到干扰，传感器产生信号，以阻止探针相对于部位的移动。

24. 发明授权

US5300208A Fabrication of printed circuit boards using conducting polymer 失效
标题翻译：使用导电聚合物制造印刷电路板
公开(公告)号：US5300208A
公开(公告)日：1994-04-05
申请号：US393605
申请日：1989-08-14
申请人： Marie Angelopoulos , Wu-Song Huang , Jae M. Park , James R. White
发明人： Marie Angelopoulos , Wu-Song Huang , Jae M. Park , James R. White
IPC分类号： C08G73/02 , C25D5/54 , H05K3/00 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/42 , C25D5/02 , C23C28/00
CPC分类号： H05K3/188 , C08G73/0266 , C25D5/54 , H05K3/424 , H05K2201/0329 , H05K3/108 , H05K3/426
摘要： A process for fabricating a printed circuit board concerns the use of a soluble, air-stable conducting polymer applied to plated through holes, blind holes or vias or to a predetermined portion of the printed circuit board surface for selectively metal plating on the polymer without the necessity of either an electroless plating bath or the use of precious metal seeds. A preferred conducting polymer is polyaniline. A preferred metal plating is preferably copper or a noble metal such as palladium or silver.
摘要翻译：用于制造印刷电路板的方法涉及使用可涂覆的空气稳定的导电聚合物，其应用于电镀通孔，盲孔或通孔或印刷电路板表面的预定部分，用于选择性地在聚合物上镀金而不使用无电镀浴或使用贵金属种子的必要性。优选的导电聚合物是聚苯胺。优选的金属镀层优选为铜或贵金属如钯或银。

25. 发明授权

US5122439A Forming a pattern on a substrate 失效
标题翻译：在基板上形成图案
公开(公告)号：US5122439A
公开(公告)日：1992-06-16
申请号：US399058
申请日：1989-08-28
申请人： Ekkehard F. Miersch , Jae M. Park
发明人： Ekkehard F. Miersch , Jae M. Park
IPC分类号： G03C1/00 , C25F5/00 , G03F1/08 , H01L21/48 , H05K3/04 , H05K3/06 , H05K3/10 , H05K3/16 , H05K3/24
CPC分类号： H05K3/045 , H01L21/4846 , H05K2201/0317 , H05K2203/0195 , H05K2203/025 , H05K2203/0353 , H05K3/06 , H05K3/107
摘要： A pattern is formed on a substrate by providing on the substrate a dielectric composition; defining a pattern in said dielectric; depositing metal and then micromachining the metal to provide the desired pattern on the substrate.

26. 发明授权

US4781970A Strengthening a ceramic by post sinter coating with a compressive surface layer 失效
标题翻译：用压缩表面层通过后烧结涂层来加强陶瓷
公开(公告)号：US4781970A
公开(公告)日：1988-11-01
申请号：US73620
申请日：1987-07-15
申请人： Steven G. Barbee , Hung-Chang Huang , Donald J. Hunt , Jungihl Kim , Jae M. Park , Charles H. Perry , Da-Yuan Shih
发明人： Steven G. Barbee , Hung-Chang Huang , Donald J. Hunt , Jungihl Kim , Jae M. Park , Charles H. Perry , Da-Yuan Shih
IPC分类号： B32B18/00 , C03C17/22 , C03C17/23 , C03C17/245 , C04B41/50 , C04B41/87 , H01L23/15 , H05K1/03 , B32B3/00 , B32B9/00 , B32B15/00 , C03B29/00
CPC分类号： C04B41/009 , C03C17/225 , C03C17/23 , C04B41/5035 , C04B41/5062 , C04B41/87 , H01L23/15 , C03C2217/213 , C03C2217/281 , C03C2218/152 , C03C2218/154 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , Y10S428/901 , Y10T428/24926
摘要： Strengthened ceramic and a method for increasing the mechanical strength of fully sintered ceramic articles, in particular alumina type ceramic and glass-ceramic articles. Such articles are strengthened by forming a compresssive material layer of amorphous silicon dioxide or refractory metal nitride on the surface of the article to be strengthened.

27. 发明授权

US4493725A Fertilizer product with sustained action and process therefor 失效
标题翻译：化肥产品具有持续的作用和过程
公开(公告)号：US4493725A
公开(公告)日：1985-01-15
申请号：US495531
申请日：1983-05-17
申请人： Sang H. Moon , Jae M. Park , Sung S. Suh
发明人： Sang H. Moon , Jae M. Park , Sung S. Suh
IPC分类号： C05G3/00 , C05D9/00 , C05D9/02
CPC分类号： C05G3/0041
摘要： A fertilizer product in granular form with sustained action is provided by spraying a silicate-based solution on the surface of the fertilizer granules in a conventional coating machine which is maintained at temperatures ranging from 20.degree. to 100.degree. C. The coating solution comprises 1 to 50% by weight of a silicate and/or silicic acid ester based on the weight of the fertilizer material to be treated, 0.001 to 1.0 part by weight of a metal and/or non-aqueous metallic compound (first additives), 0.001 to 1.0 part by weight of an aqueous metallic compound (second additives), 0.001 to 1.0 part by weight of an inorganic mineral (third additives), and optionally high molecular weight organic compound, wherein all parts described above are based on the weight of the silicate and/or silicic acid ester used. The coated fertilizer granules are subject to heat-treatment for 10 seconds to 10 days under conditions that the relative humidity and the temperature be maintained at 5 to 95% and 10.degree. to 250.degree. C., respectively.
摘要翻译：通过在保持在20℃至100℃的常规涂布机中将硅酸盐基溶液喷洒在肥料颗粒表面上来提供具有持续作用的颗粒形式的肥料产品。涂布溶液包含1至 50重量％的硅酸盐和/或硅酸酯，基于待处理的肥料的重量，0.001至1.0重量份的金属和/或非水性金属化合物（第一添加剂），0.001至1.0 水溶性金属化合物（第二添加剂）重量份，0.001〜1.0重量份的无机矿物（第三添加剂）和任选的高分子量有机化合物，其中所有上述部分均以硅酸盐的重量为基准， /或硅酸酯。在相对湿度和温度分别保持在5至95％和10至250℃的条件下，将涂覆的肥料颗粒进行10秒至10天的热处理。

28. 发明授权

US08604348B2 Method of making a connection component with posts and pads 有权
标题翻译：使用柱和垫制作连接部件的方法
公开(公告)号：US08604348B2
公开(公告)日：2013-12-10
申请号：US13155825
申请日：2011-06-08
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
IPC分类号： H05K1/00 , H05K1/16
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译：封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48））暴露在介电层的外表面处，焊盘通过迹线连接到柱。电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。还公开了制造连接部件的方法。

29. 发明授权

US08207604B2 Microelectronic package comprising offset conductive posts on compliant layer 有权
标题翻译：微电子封装包括柔性层上的偏移导电柱
公开(公告)号：US08207604B2
公开(公告)日：2012-06-26
申请号：US10985126
申请日：2004-11-10
申请人： Belgacem Haba , Masud Beroz , Giles Humpston , Jae M. Park
发明人： Belgacem Haba , Masud Beroz , Giles Humpston , Jae M. Park
IPC分类号： H01L23/485
CPC分类号： H01L23/13 , H01L21/4846 , H01L2924/0002 , H01R13/2414 , H01R13/2464 , H01L2924/00
摘要： A microelectronic package includes a mounting structure, a microelectronic element associated with the mounting structure, and a plurality of conductive posts physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts project from the mounting structure in an upward direction, at least one of the conductive posts being an offset post. Each offset post has a base connected to the mounting structure, the base of each offset post defining a centroid. Each offset post also defines an upper extremity having a centroid, the centroid of the upper extremity being offset from the centroid of the base in a horizontal offset direction transverse to the upward direction. The mounting structure is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities may wipe across a contact pad of an opposing circuit board.
摘要翻译：微电子封装包括安装结构，与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱。导电柱从安装结构沿向上的方向突出，至少一个导电柱是偏移柱。每个偏移柱具有连接到安装结构的基座，每个偏置柱的基部限定质心。每个偏移柱还限定具有质心的上肢，上肢的质心在垂直于向上方向的水平偏移方向上偏离基部的质心。安装结构适于允许每个偏移柱绕水平轴线倾斜，使得上端部可以擦过相对电路板的接触垫。

30. 发明授权

US08046912B2 Method of making a connection component with posts and pads 有权
标题翻译：使用柱和垫制作连接部件的方法
公开(公告)号：US08046912B2
公开(公告)日：2011-11-01
申请号：US12321210
申请日：2009-01-16
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
IPC分类号： H05K3/02
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译：封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48））暴露在介电层的外表面处，焊盘通过迹线连接到柱。电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。还公开了制造连接部件的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式