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21. 发明授权

US07112648B2 Polyimide film excellent in alkali etching processability and punchability 有权
标题翻译：碱蚀刻加工性和冲压性优异的聚酰亚胺膜
公开(公告)号：US07112648B2
公开(公告)日：2006-09-26
申请号：US10480899
申请日：2002-06-17
申请人： Kazuhiro Ono , Kan Fujihara , Kiyokazu Akahori
发明人： Kazuhiro Ono , Kan Fujihara , Kiyokazu Akahori
IPC分类号： C08G69/26
CPC分类号： C08J5/18 , C08G73/10 , C08G73/1067 , C08G73/1071 , C08J2379/08
摘要： A polyimide film according to the present invention satisfies Condition (1) in which a tear propagation resistance variation CH is not more than 1.0 g, and/or Condition (2) in which a swelling coefficient CR after being dipped in an alkaline solution is not more than 20.0. By satisfying these conditions, workability of the polyimide film can be improved and working defects can be effectively prevented, thereby improving productivity of each step.
摘要翻译：根据本发明的聚酰亚胺膜满足条件（1），其中，撕裂蔓延阻力变化量C H不大于1.0g，和/或其中溶胀系数C < 浸渍在碱性溶液中之后，不超过20.0。通过满足这些条件，可以提高聚酰亚胺膜的加工性，并且可以有效地防止工作缺陷，从而提高各步骤的生产率。

22. 发明授权

US06207739B1 Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them 有权
标题翻译：含有金属的聚酰胺酸组合物，聚酰亚胺膜，柔性印刷线路板及其制造方法
公开(公告)号：US06207739B1
公开(公告)日：2001-03-27
申请号：US09196310
申请日：1998-11-20
申请人： Kuzuhiro Ono , Masaru Nishinaka , Kiyokazu Akahori
发明人： Kuzuhiro Ono , Masaru Nishinaka , Kiyokazu Akahori
IPC分类号： C08K520
CPC分类号： H05K1/0346 , C08K5/0091 , H05K2201/0154 , C08L79/04
摘要： The object of the present invention is to provide a polyimide film, a flexible printed wiring board consisting thereof, and a polyimide molding, wherein various metal compounds are added to improve their properties and to provide them with noble properties.
摘要翻译：本发明的目的是提供一种聚酰亚胺薄膜，由它们构成的柔性印刷线路板和聚酰亚胺模制品，其中加入各种金属化合物以改善它们的性能并为它们提供高贵的性能。

23. 发明授权

US6060158A Fluoro-carbon resinous laminate having a crack-resistant surface and method of producing said laminate 失效
标题翻译：具有耐裂纹表面的氟碳树脂层压板及其制造方法
公开(公告)号：US6060158A
公开(公告)日：2000-05-09
申请号：US725898
申请日：1996-10-04
申请人： Kazuhiro Ono , Eiichiro Kuribayashi , Kosuke Kataoka , Kiyokazu Akahori
发明人： Kazuhiro Ono , Eiichiro Kuribayashi , Kosuke Kataoka , Kiyokazu Akahori
IPC分类号： C08J7/04 , B32B27/06 , B32B27/08 , B32B31/12 , B32B31/26
CPC分类号： C08J7/047 , C08J2379/08 , C08J2427/00 , Y10T428/269 , Y10T428/3154 , Y10T428/31544 , Y10T428/31721
摘要： A fluoro-carbon resinous laminate has a crack-resistant surface on a fluoro-carbon resinous layer thereof produced by coating a single surface or both surfaces of a plastic film with a single layer of a fluoro-carbon resinous dispersion, and a method of producing the laminate. To produce the fluoro-carbon resinous laminate, which is a minimum of 10 .mu.m in thickness, a single surface or both surfaces of a plastic film are coating with a single layer of concentration-adjusted fluoro-carbon resinous dispersion and then dried, followed by curing the resinous dispersion in a thermal treating furnace with heated atmospheric air or by adding organic solvent to the resinous dispersion, the enabling production of a fluoro-carbon resinous laminate having a surface appearance in which cracks cannot visually be identified.
摘要翻译：氟碳树脂层叠体通过用单层氟碳树脂分散体涂覆塑料膜的单面或两面而在其氟碳树脂层上具有抗裂性表面，以及制造方法层压板。为了生产厚度最小为10μm的氟碳树脂层压板，塑料薄膜的单面或两面用单层浓度调节氟碳树脂分散体涂布，然后干燥通过在具有加热的大气空气的热处理炉中固化树脂分散体或通过向树脂分散体中加入有机溶剂，能够生产具有无法在视觉上识别裂纹的表面外观的氟碳树脂层压体。

24. 发明授权

US09441082B2 Polyimide film and process for producing the same 有权
公开(公告)号：US09441082B2
公开(公告)日：2016-09-13
申请号：US14583009
申请日：2014-12-24
申请人： Hisayasu Kaneshiro , Toshihisa Itoh , Kiyokazu Akahori
发明人： Hisayasu Kaneshiro , Toshihisa Itoh , Kiyokazu Akahori
IPC分类号： C08G69/26 , C08J5/18 , B29C41/28 , B29D7/01 , B29C41/00 , B29C41/24 , B29C41/46 , C09D179/08 , B29K79/00 , B29K105/00 , B29L7/00
CPC分类号： C08J5/18 , B29C41/003 , B29C41/24 , B29C41/28 , B29C41/46 , B29D7/01 , B29K2079/08 , B29K2105/0005 , B29K2105/0014 , B29L2007/008 , C08J2379/08 , C09D179/08 , H05K2201/0154 , Y10T428/31721
摘要： A process includes the steps of: casting or coating a polyamic acid organic solvent solution on a support and drying the polyamic acid organic solvent solution thereon, so as to form a partially cured and/or partially dried polyamic acid film; dipping the polyamic acid film in tertiary amine or a solution of tertiary amine, or coating tertiary amine or a solution of tertiary amine on the polyamic acid film; and drying the film while imidizing the polyamic acid. In another process, a chemical converting agent and a catalyst are mixed in an organic solvent solution of polyamic acid. After casting and heating the mixture on a support, a partially cured and/or partially dried polyamic acid film is detached from the support. The film contains, with respect to the remaining volatile component, not less than 50 parts of catalyst, not more than 30 parts of solvent, and not more than 20 parts of chemical converting agent and/or a chemical converting agent derived component. The remaining amic acid is imidized and the film is dried.

25. 发明申请

US20150119534A1 POLYIMIDE FILM AND PROCESS FOR PRODUCING THE SAME 有权
公开(公告)号：US20150119534A1
公开(公告)日：2015-04-30
申请号：US14583009
申请日：2014-12-24
申请人： Hisayasu KANESHIRO , Toshihisa Itoh , Kiyokazu Akahori
发明人： Hisayasu KANESHIRO , Toshihisa Itoh , Kiyokazu Akahori
IPC分类号： B29C41/28 , C08J5/18
CPC分类号： C08J5/18 , B29C41/003 , B29C41/24 , B29C41/28 , B29C41/46 , B29D7/01 , B29K2079/08 , B29K2105/0005 , B29K2105/0014 , B29L2007/008 , C08J2379/08 , C09D179/08 , H05K2201/0154 , Y10T428/31721
摘要： A process includes the steps of: casting or coating a polyamic acid organic solvent solution on a support and drying the polyamic acid organic solvent solution thereon, so as to form a partially cured and/or partially dried polyamic acid film; dipping the polyamic acid film in tertiary amine or a solution of tertiary amine, or coating tertiary amine or a solution of tertiary amine on the polyamic acid film; and drying the film while imidizing the polyamic acid. In another process, a chemical converting agent and a catalyst are mixed in an organic solvent solution of polyamic acid. After casting and heating the mixture on a support, a partially cured and/or partially dried polyamic acid film is detached from the support. The film contains, with respect to the remaining volatile component, not less than 50 parts of catalyst, not more than 30 parts of solvent, and not more than 20 parts of chemical converting agent and/or a chemical converting agent derived component. The remaining amic acid is imidized and the film is dried.

26. 发明授权

US07267883B2 Polyimide film and laminate having metal layer and same 有权
标题翻译：聚酰亚胺膜和具有金属层的层压体
公开(公告)号：US07267883B2
公开(公告)日：2007-09-11
申请号：US10667134
申请日：2003-09-19
申请人： Kan Fujihara , Kazuhiro Ono , Kiyokazu Akahori
发明人： Kan Fujihara , Kazuhiro Ono , Kiyokazu Akahori
IPC分类号： B32B27/06 , B32B15/08
CPC分类号： B32B15/08 , C08G73/10 , C08G73/1039 , C08G73/1064 , C08G73/1067 , C08G73/1071 , C08G73/1082 , C08G73/16 , C08J5/18 , C08J2379/08 , H05K1/0346 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide film of the present invention is a polyimide film having a dynamic viscoelasticity whose tan δ peak is located in a range of not less than 310° C. but not more than 410° C., and whose tan δ value at 300° C. is not more than 0.05, or a polyimide film prepared by copolymerizing (a) an acid dianhydride component including a biphenyltetracarboxylic dianhydride and a pyromellitic dianhydride, and (b) a diamine component, and the polyimide film having such an etching speed that one side thereof is etched with a 1N potassium hydroxide solution at an etching speed of 0.1 μm/minute (one side) or higher. The polyimide film of the present invention possesses film properties that are necessary for use in an electronic raw material for flexible printed circuit boards and the like, and is suitable as an electronic raw material.
摘要翻译：本发明的聚酰亚胺膜是具有动态粘弹性的聚酰亚胺膜，其tanδ峰位于不低于310℃但不高于410℃的范围内，其tanδ值在300℃ （a）包含联苯四羧酸二酐和均苯四酸二酐的酸二酐组分和（b）二胺组分制备的聚酰亚胺膜，以及具有如下蚀刻速度的聚酰亚胺膜：以0.1mum /分钟（一侧）的蚀刻速度用1N氢氧化钾溶液蚀刻。本发明的聚酰亚胺膜具有用于柔性印刷电路板等的电子原料所必需的膜特性，并且适合作为电子原料。

27. 发明申请

US20060138707A1 Polyimide film, process for preparing the same and controlling isotropy of the same 审中-公开
标题翻译：聚酰亚胺膜，其制备方法及其各向同性的控制
公开(公告)号：US20060138707A1
公开(公告)日：2006-06-29
申请号：US11357275
申请日：2006-02-17
申请人： Hidehito Nishimura , Kazuhiro Ono , Masaru Nishinaka , Kiyokazu Akahori
发明人： Hidehito Nishimura , Kazuhiro Ono , Masaru Nishinaka , Kiyokazu Akahori
IPC分类号： B29C71/00
CPC分类号： C08J5/18 , B29C71/02 , B29C2071/0027 , B29K2079/08 , B29L2007/008 , C08J2379/08
摘要： To provide a polyimide film having an original film width of at least 500 mm, whose isotropy in a width direction is improved to have uniform properties, which polyimide film has been apt to cause property difference in the width direction by continuous molding. The polyimide film has an original film width of at least 500 mm and a thickness of at most 50 μm, wherein the maximum value of MOR-c is at most 1.35 and a tensile elastic modulus is at least 5.0 GPa at any part of the film. The polyimide film is prepared by the method which comprises steps of: forming a green sheet containing a volatile component, and heating the green sheet by transferring the same through a furnace with both ends of the green sheet being fixed, wherein at the heating step, the original film has an orientation axis angle θ of a positive value at both ends in the original film width direction, and temperature is lower than the boiling point of a main volatile component in a zone where the original film is transferred for a distance equal to the film width between both fixed ends.
摘要翻译：为了提供具有至少500mm的原始膜宽度的聚酰亚胺膜，其在宽度方向上的各向同性被改善以具有均匀的性质，该聚酰亚胺膜已经通过连续成型容易导致宽度方向上的性能差异。聚酰亚胺薄膜的原始薄膜宽度为至少500mm，厚度最多为50μm，其中MOR-c的最大值为1.35以下，拉伸弹性模量为5.0GPa以上。聚酰亚胺膜的制备方法包括以下步骤：形成含有挥发性成分的生片，并通过将生片的两端固定而通过转炉加热生片，其中在加热步骤中，原始膜在原始膜宽度方向上的两端具有正值的取向轴角度θ，并且温度低于原始膜转移距离等于的区域中的主挥发性成分的沸点两个固定端之间的胶片宽度。

28. 发明授权

US06852826B2 Manufacturing method of polyamic acid, and polyamic acid solution 有权
标题翻译：聚酰胺酸和聚酰胺酸溶液的制备方法
公开(公告)号：US06852826B2
公开(公告)日：2005-02-08
申请号：US10326799
申请日：2002-12-19
申请人： Kan Fujihara , Kazuhiro Ono , Kiyokazu Akahori
发明人： Kan Fujihara , Kazuhiro Ono , Kiyokazu Akahori
IPC分类号： C08G73/10 , C08G69/28
CPC分类号： C08G73/1007
摘要： In a step of polymerizing polyamic acid by mixing tetracarboxylic acid dianhydride and diamine and polycondensating the tetracarboxylic acid dianhydride and diamine under the presence of a polymerization-use solvent, a tetracarboxylic acid dianhydride slurry in which a tetracarboxylic acid dianhydride is dispersed in a dispersion medium is used. According to this, it is possible to directly manufacture a polyamic acid solution having a high concentration of polyamic acid more than or equal to 10% by weight. Especially, even if a tetracarboxylic acid dianhydride having low solubility in the polymerization-use solvent, it is possible to effectively manufacture a polyamic acid solution having high solids content, by a simple process and in a short time.
摘要翻译：在聚四甲酸二酐和二胺混合并在四聚羧酸二酐和二胺在聚合用溶剂的存在下缩聚的步骤中，将四羧酸二酐分散在分散介质中的四羧酸二酐浆料是用过的。据此，可以直接制造聚酰胺酸浓度高于10重量％的聚酰胺酸溶液。特别是即使在聚合用溶剂中溶解性低的四羧酸二酐也可以通过简单的工艺和短时间有效地制造固体含量高的聚酰胺酸溶液。

29. 发明授权

US06586081B1 POLYIMIDE/METAL LAMINATE, AND ELECTRIC/ELECTRONIC EQUIPMENT BASES, MAGNETIC RECORDING BASES, SOLAR BATTERY BASES, COATING FILM FOR AEROSPACE MATERIALS AND FILMY RESISTANCE ELEMENTS WITH THE USE THEREOF 有权
标题翻译：聚酰亚胺/金属层压板和电子电子设备基础，磁记录基础，太阳能电池基，用于航空材料的涂层膜和其使用的电阻元件
公开(公告)号：US06586081B1
公开(公告)日：2003-07-01
申请号：US09522469
申请日：2000-03-09
申请人： Masaru Nishinaka , Kiyokazu Akahori
发明人： Masaru Nishinaka , Kiyokazu Akahori
IPC分类号： B32B300
CPC分类号： B32B15/08 , H05K1/0346 , H05K3/389 , H05K2201/0154 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： Polyimide/metal laminates having a polyimide film and a metal layer laminated thereon, wherein the polyimide film contains titanium element and flexible print wiring boards with the use of the same are disclosed. The polyimide/metal laminates are excellent in adhesion under the ordinary conditions and, moreover, can sustain the adhesive strength at a high ratio after exposure to high temperature or high temperature and high humidity. Owing to these characteristics, these polyimide/metal laminates are appropriately usable in flexible print wiring boards, multi-layered print wiring boards, rigid flex wiring boards, tapes for TAP, semiconductor packages such as CFOs and multi chip modules (MCMs), magnetic recording films, coating films for aerospace materials and filmy resistance elements.
摘要翻译：公开了具有聚酰亚胺膜和层压在其上的金属层的聚酰亚胺/金属层压体，其中聚酰亚胺膜含有钛元素和使用其的柔性印刷布线板。聚酰亚胺/金属层压体在常规条件下的粘附性优异，并且在暴露于高温或高温和高湿度之后可以以高比例维持粘合强度。由于这些特性，这些聚酰亚胺/金属层叠体适用于柔性印刷布线板，多层印刷布线板，刚性柔性布线板，TAP带，CFO等多种半导体封装，多芯片模块（MCM），磁记录薄膜，航空航天材料涂膜和耐电膜元件。

30. 发明授权

US06403757B1 Modified polyamide resin and heat-resistant composition containing the same 失效
标题翻译：改性聚酰胺树脂和含有它的耐热组合物
公开(公告)号：US06403757B1
公开(公告)日：2002-06-11
申请号：US09462382
申请日：2000-01-07
申请人： Katsunori Yabuta , Kiyokazu Akahori , Yasushi Nishikawa
发明人： Katsunori Yabuta , Kiyokazu Akahori , Yasushi Nishikawa
IPC分类号： C08G6948
CPC分类号： C08G69/48 , C08G59/186 , C08G59/28 , C08L77/00 , H05K1/0346 , Y10T428/28
摘要： A reaction between epoxy-terminated polyamide and an acid anhydride compound can yield a modified polyamide resin, into resin skeleton of which carboxy groups to react with epoxy resin are introduced. An adhesive agent having excellent heat-resistance can be provided by the use of a composition of this modified polyamide resin and epoxy resin. Furthermore, an adhesive tape for a semiconductor device having excellent properties can be produced by laminating the adhesive agent and the protective layer on one surface of an organic insulated film.
摘要翻译：环氧封端的聚酰胺与酸酐化合物之间的反应可以得到改性的聚酰胺树脂，引入其中与环氧树脂反应的羧基的树脂骨架。通过使用该改性聚酰胺树脂和环氧树脂的组合物，可以提供耐热性优异的粘合剂。此外，通过在有机绝缘膜的一个表面上层压粘合剂和保护层，可以制造具有优异性能的半导体器件用胶带。

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