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21. 发明申请

US20050256259A1 Heat conductive silicone rubber composition and molded article 有权
标题翻译：导热硅橡胶组合物和模塑制品
公开(公告)号：US20050256259A1
公开(公告)日：2005-11-17
申请号：US11127282
申请日：2005-05-12
申请人： Tomoyuki Goto , Kei Miyoshi
发明人： Tomoyuki Goto , Kei Miyoshi
IPC分类号： C08L83/07 , C08G77/20 , C08K3/00 , C08K3/22 , C08L83/04 , C08L83/05 , C08L83/06 , C08L83/14
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20 , C08K3/22 , C08L83/14 , C08L2205/02 , C08L83/00
摘要： A heat conductive silicone rubber composition comprising (A) an organopolysiloxane containing, on the average, at least 0.1 silicon-bonded alkenyl radical and having a viscosity of 50-100,000 mPa·s at 25° C., (B) an organopolysiloxane containing, on the average, at least 2 SiH radicals and having a viscosity of 1-100,000 mPa·s at 25° C., (C) a heat conductive filler, (D) a platinum catalyst, and (E) a specific organopolysiloxane having a molecular weight of at least 10,000, is easy to handle and mold, and especially smooth in flow, even when heavily loaded with the filler.
摘要翻译：一种导热硅橡胶组合物，其包含（A）平均含有至少0.1个硅键合的烯基并且在25℃下具有50-100,000mPa.s粘度的有机聚硅氧烷，（B）含有平均来说，至少2个SiH自由基，在25℃下具有1-100,000mPa.s的粘度，（C）导热填料，（D）铂催化剂，和（E）具有分子量至少为10,000，易于处理和模塑，特别是流动平稳，甚至在重负荷填料时。

22. 发明授权

US6008290A Mildew resistant organopolysiloxane with hydrolyzable organosilane and triazolyl compound 失效
标题翻译：具有可水解有机硅烷和三唑基化合物的防霉有机聚硅氧烷
公开(公告)号：US6008290A
公开(公告)日：1999-12-28
申请号：US602449
申请日：1996-02-16
申请人： Kei Miyoshi , Tokuo Sato , Yoshio Inoue
发明人： Kei Miyoshi , Tokuo Sato , Yoshio Inoue
IPC分类号： C08K5/3472 , C08K5/5465 , C08K5/05 , C08K5/23 , C08L83/06
CPC分类号： C08K5/3472 , C08K5/5465
摘要： A room temperature curable mildew resistant organopolysiloxane composition comprises (A) a hydroxyl or hydrolyzable group-containing organopolysiloxane, (B) a hydrolyzable organosilane such as methyltrimethoxysilane, methyltris(methylethylketoxime silane) or vinyltris(methylethylketoxime silane), a partially hydrolyzed product thereof or a mixture of the hydrolyzable organosilane with the partially hydrolyzed product thereof; and (C) a triazolyl group-containing compound such as 2-(4-chlorophenyl)ethyl-.alpha.-(1,1-dimethylethyl)-1H-1,2,4-triazole-1-yl-ethanol. Preferably, the component (B) does not contain aliphatic unsaturation in the molecule, and in this case, the component (B) free of aliphatic unsaturation is used in combination with (B') a hydrolyzable silane such as tetrakis(dimethylketoxime)silane, a partially hydrolyzed product thereof or a mixture of the hydrolyzable silane and the partially hydrolyzed product thereof.
摘要翻译：室温可固化防霉有机聚硅氧烷组合物包含（A）含羟基或可水解基团的有机聚硅氧烷，（B）可水解的有机硅烷如甲基三甲氧基硅烷，甲基三（甲基乙基酮肟基硅烷）或乙烯基三（甲基乙基酮肟基硅烷），其部分水解产物或可水解的有机硅烷与其部分水解产物的混合物; 和（C）含三唑基的化合物如2-（4-氯苯基）乙基-α-（1,1-二甲基乙基）-1H-1,2,4-三唑-1-基 - 乙醇。优选地，组分（B）在分子中不含有脂族不饱和键，在这种情况下，不含脂族不饱和的组分（B）与（B'）可水解硅烷如四（二甲基酮肟）硅烷组合使用，其部分水解产物或可水解硅烷及其部分水解产物的混合物。

23. 发明授权

US5900438A Thermosetting foamable organopolysiloxane composition and process of curing the same 失效
标题翻译：热固性发泡有机聚硅氧烷组合物及其固化方法
公开(公告)号：US5900438A
公开(公告)日：1999-05-04
申请号：US130106
申请日：1998-08-06
申请人： Kei Miyoshi , Hironao Fujiki
发明人： Kei Miyoshi , Hironao Fujiki
IPC分类号： C08J9/02
CPC分类号： C08J9/02 , C08J2383/04
摘要： There is provided a thermosetting foamable organopolysiloxane composition comprising (A) an organopolysiloxane with a viscosity of 10-100,000 cSt at 25.degree. C. containing a specified amount of an alkenyl group and/or a hydroxyl group, such as a linear dimethylpolysiloxane blocked with a vinyldimethylsiloxy group or a hydroxydimethylsiloxy group at both terminal ends of the molecular chain and not containing an alkenyl group and a hydroxyl group in the diorganosiloxane repeating unit constituting the backbone chain; (B) an organohydrogenpolysiloxane and/or organohydrogensilane each having at least two hydrogen atoms bonded to silicon atoms in the molecule, such as Me.sub.3 SiO--�SiH(Me)O!.sub.40 --SiMe.sub.3 wherein Me stands for a methyl group or C.sub.6 H.sub.5 SiH.sub.3 ; (C) a compound having an active hydrogen group, such as a hydroxyl group-containing compound, such as alcohols; (D) a platinum catalyst; and (E) an acetylenic alcohol compound. This composition has shelf-stability at normal temperature and can form a foam having homogeneous foam cells in the mass production line including a heating step.
摘要翻译：提供了一种热固性可发泡有机聚硅氧烷组合物，其包含（A）在25℃下粘度为10-100,000cSt的有机聚硅氧烷，其含有指定量的烯基和/或羟基，例如用乙烯基二甲基甲硅烷氧基或羟基二甲基甲硅烷氧基，在构成主链的二有机硅氧烷重复单元中，分子链的两个末端不含有烯基和羟基，（B）各自具有与分子中的硅原子键合的至少两个氢原子的有机氢聚硅氧烷和/或有机氢硅烷，例如Me 3 SiO - [SiH（Me）O] 40-SiMe 3，其中Me表示甲基或C 6 H 5 SiH 3; （C）具有活性氢基的化合物，例如含羟基的化合物，例如醇; （D）铂催化剂; 和（E）炔醇化合物。该组合物在常温下具有保存稳定性，并且可以在大规模生产线中形成具有均匀泡沫泡沫的泡沫，其包括加热步骤。

24. 发明授权

US08119758B2 Heat-conductive silicone composition and cured product thereof 有权
标题翻译：导热硅氧烷组合物及其固化产物
公开(公告)号：US08119758B2
公开(公告)日：2012-02-21
申请号：US11846862
申请日：2007-08-29
申请人： Ikuo Sakurai , Nobuaki Matsumoto , Kei Miyoshi , Kunihiro Yamada
发明人： Ikuo Sakurai , Nobuaki Matsumoto , Kei Miyoshi , Kunihiro Yamada
IPC分类号： C08G77/12 , C08L83/04 , C08K3/00 , C08K5/541 , C08K5/5419
CPC分类号： C09J183/04 , C08G77/045 , C08G77/18 , C08G77/20 , C08K3/22 , C08K5/56 , C08L83/00 , Y10T428/31663
摘要： Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler. Heat generated by a heat-generating electronic component can be dissipated into a heat-radiating component by sandwiching the cured product between the heat-generating electronic component and the heat-radiating component.
摘要翻译：提供一种导热性有机硅组合物，其包含：（A）100体积份的具有特定结构的有机聚硅氧烷，（B）0.1〜50体积份作为润湿剂的有机硅化合物，并且含有三有机氧基甲硅烷基键合通过可以被支链的亚烷基连接到一个末端，（C）100-2,500体积份的导热填料，和（D）有效量的固化剂。还提供了通过固化该组合物获得的导热硅氧烷固化产物。即使填充有大量导热填料以提供优异的导热性，导热硅氧烷组合物的粘度或塑性的增加也最小，并保持良好的操作性和成型性。即使填充有大量的导热性填料，导热性硅酮固化物也具有优异的柔软性。由发热电子部件产生的热可以通过将固化物夹在发热电子部件和散热部件之间而散发到散热部件中。

25. 发明授权

US08017684B2 Heat conductive silicone grease compositions 有权
标题翻译：导热硅油组合物
公开(公告)号：US08017684B2
公开(公告)日：2011-09-13
申请号：US11616185
申请日：2006-12-26
申请人： Akihiro Endo , Kei Miyoshi , Kunihiro Yamada , Hiroaki Kizaki
发明人： Akihiro Endo , Kei Miyoshi , Kunihiro Yamada , Hiroaki Kizaki
IPC分类号： A23J7/00 , C10L1/16
CPC分类号： C10M169/02 , C08G77/14 , C08G77/18 , C08G77/20 , C08K3/013 , C08K5/5419 , C08L83/04 , C10M111/04 , C10M2201/0416 , C10M2201/0606 , C10M2201/0616 , C10M2201/0626 , C10M2201/1013 , C10M2203/0213 , C10M2203/102 , C10M2227/04 , C10M2227/045 , C10M2229/0415 , C10M2229/0425 , C10M2229/0435 , C10M2229/0445 , C10M2229/0455 , C10M2229/0465 , C10M2229/0485 , C10N2210/01 , C10N2210/02 , C10N2210/03 , C10N2210/04 , C10N2210/08 , C10N2220/022 , C10N2220/082 , C10N2230/08 , C10N2240/20 , C10N2240/201 , C10N2240/202 , C10N2250/10 , H01L23/3737 , H01L2924/0002 , C08L2666/44 , C08L2666/54 , H01L2924/00
摘要： Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.
摘要翻译：本发明提供一种导热硅脂组合物，其包括：（A）100体积％的具有特定结构且25℃下的运动粘度为10〜10,000mm 2 / s的有机聚硅氧烷，（B）为0.1〜50份体积的具有特定结构的烷氧基硅烷，（C）100-2,500体积份的导热填料。该组合物显示出高导热性，保持了优异的流动性，这意味着组合物表现出良好的加工性，并且能够填充细小的凹痕，从而降低接触电阻并提供优异的散热性能。此外，在高温高湿条件下的组合物的耐久性得到改善，从而提高了实际使用中组合物的可靠性。由发热体产生的热量可以通过将组合物夹在发热体和散热体之间而散发到散热体中。

26. 发明授权

US07786056B2 Heat dissipating silicone grease compositions 有权
标题翻译：散热硅脂组合物
公开(公告)号：US07786056B2
公开(公告)日：2010-08-31
申请号：US12059138
申请日：2008-03-31
申请人： Nobuaki Matsumoto , Kunihiro Yamada , Kei Miyoshi , Ikuo Sakurai , Kenichi Isobe
发明人： Nobuaki Matsumoto , Kunihiro Yamada , Kei Miyoshi , Ikuo Sakurai , Kenichi Isobe
IPC分类号： A61K9/00 , C10M173/02 , C10M169/04 , C10F7/02
CPC分类号： H01L23/3737 , C10M111/04 , C10M169/02 , C10M2201/0416 , C10M2201/0606 , C10M2201/0616 , C10M2201/0626 , C10M2201/1013 , C10M2203/0213 , C10M2203/022 , C10M2227/04 , C10M2229/041 , C10M2229/0415 , C10M2229/046 , C10N2210/02 , C10N2210/03 , C10N2220/022 , C10N2220/082 , C10N2230/08 , C10N2230/74 , C10N2240/20 , C10N2240/201 , C10N2240/202 , C10N2250/10 , H01L2924/0002 , C10N2220/028 , H01L2924/00
摘要： A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.
摘要翻译：包含3-30重量％的有机聚硅氧烷和60-96.9重量％的导热填料的硅润滑脂组合物用沸点为260-360℃的最不易挥发的异链烷烃进行稀释。尽管导热填料的重载，润滑脂组合物可以容易地应用于作为薄均匀涂层的散热器。组合物在室温下的储存稳定性显着提高，易于处理，并提供良好的散热性。

27. 发明申请

US20090258216A1 SILICONE ADHESIVE FOR SEMICONDUCTOR ELEMENT 审中-公开
标题翻译：硅胶用于半导体元件
公开(公告)号：US20090258216A1
公开(公告)日：2009-10-15
申请号：US12421876
申请日：2009-04-10
申请人： Naoki YAMAKAWA , Kei Miyoshi , Toshiyuki Ozai , Yoshinori Ogawa
发明人： Naoki YAMAKAWA , Kei Miyoshi , Toshiyuki Ozai , Yoshinori Ogawa
IPC分类号： B32B7/12 , C09J183/00 , C09J183/06
CPC分类号： H01L33/56 , C09J183/14
摘要： A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 μm, and (c) a white or colorless and transparent powder having an average particle size of at least 1 μm but less than 10 μm. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.
摘要翻译：一种用于半导体元件的硅粘合剂，其适合作为用于将发光二极管芯片固定到基板的芯片接合材料。粘合剂包括（a）在25℃下的粘度不大于100Pa.s的加成反应固化性有机硅树脂组合物，并且在150℃加热3小时时产生固化产物，其具有类型 JIS K6253规定的D硬度为30以上，（b）平均粒径小于1μm的白色颜料粉末，（c）平均粒径为1μm以上的白色或无色透明粉末但少于10个妈妈。粘合剂显示出高水平的隐蔽性，有效地反映了从LED芯片发出的光，并且还显示出有利的芯片定位性能，优异的粘合强度和优异的耐久性。

28. 发明授权

US07547743B2 Heat conductive silicone rubber composition and molded article 有权
标题翻译：导热硅橡胶组合物和模塑制品
公开(公告)号：US07547743B2
公开(公告)日：2009-06-16
申请号：US11127282
申请日：2005-05-12
申请人： Tomoyuki Goto , Kei Miyoshi
发明人： Tomoyuki Goto , Kei Miyoshi
IPC分类号： C08K3/14 , C08K3/22
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/18 , C08G77/20 , C08K3/22 , C08L83/14 , C08L2205/02 , C08L83/00
摘要： A heat conductive silicone rubber composition comprising (A) an organopolysiloxane containing, on the average, at least 0.1 silicon-bonded alkenyl radical and having a viscosity of 50-100,000 mPa·s at 25° C., (B) an organopolysiloxane containing, on the average, at least 2 SiH radicals and having a viscosity of 1-100,000 mPa·s at 25° C., (C) a heat conductive filler, (D) a platinum catalyst, and (E) a specific organopolysiloxane having a molecular weight of at least 10,000, is easy to handle and mold, and especially smooth in flow, even when heavily loaded with the filler.
摘要翻译：一种导热硅橡胶组合物，其包含（A）平均含有至少0.1个硅键合的烯基并且在25℃下具有50-100,000mPa.s粘度的有机聚硅氧烷，（B）含有平均来说，至少2个SiH自由基，在25℃下具有1-100,000mPa.s的粘度，（C）导热填料，（D）铂催化剂，和（E）具有分子量至少为10,000，易于处理和模塑，特别是流动平稳，甚至在重负荷填料时。

29. 发明申请

US20080269084A1 HEAT DISSIPATING SILICONE GREASE COMPOSITIONS 有权
标题翻译：热消散硅油组合物
公开(公告)号：US20080269084A1
公开(公告)日：2008-10-30
申请号：US12059138
申请日：2008-03-31
申请人： Nobuaki Matsumoto , Kunihiro Yamada , Kei Miyoshi , Ikuo Sakurai , Kenichi Isobe
发明人： Nobuaki Matsumoto , Kunihiro Yamada , Kei Miyoshi , Ikuo Sakurai , Kenichi Isobe
IPC分类号： C10M105/76
CPC分类号： H01L23/3737 , C10M111/04 , C10M169/02 , C10M2201/0416 , C10M2201/0606 , C10M2201/0616 , C10M2201/0626 , C10M2201/1013 , C10M2203/0213 , C10M2203/022 , C10M2227/04 , C10M2229/041 , C10M2229/0415 , C10M2229/046 , C10N2210/02 , C10N2210/03 , C10N2220/022 , C10N2220/082 , C10N2230/08 , C10N2230/74 , C10N2240/20 , C10N2240/201 , C10N2240/202 , C10N2250/10 , H01L2924/0002 , C10N2220/028 , H01L2924/00
摘要： A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.
摘要翻译：包含3-30重量％的有机聚硅氧烷和60-96.9重量％的导热填料的硅润滑脂组合物用沸点为260-360℃的最不易挥发的异链烷烃进行稀释。尽管导热填料的重载，润滑脂组合物可以容易地应用于作为薄均匀涂层的散热器。组合物在室温下的储存稳定性显着提高，易于处理，并提供良好的散热性。

30. 发明申请

US20080260957A1 Method for adhering a thermally-conductive silicone composition, a primer for adhering a thermally-conductive silicone composition and a method for manufacturing a bonded complex of a thermally-conductive silicone composition 审中-公开
标题翻译：粘合导热性有机硅组合物的方法，用于粘合导热硅酮组合物的底漆和导热性硅氧烷组合物的粘合复合体的制造方法
公开(公告)号：US20080260957A1
公开(公告)日：2008-10-23
申请号：US11977577
申请日：2007-10-25
申请人： Kunihiro Yamada , Akihiro Endo , Kei Miyoshi
发明人： Kunihiro Yamada , Akihiro Endo , Kei Miyoshi
IPC分类号： B05D3/00 , C09D4/00
CPC分类号： C09D4/00 , B05D7/16 , B05D7/52 , C08F230/08
摘要： A method for adhering a thermally-conductive silicone composition to a coated surface in which a primer containing a platinum type compound and a solvent but not containing an alkoxy silane is applied and dried on the surface of a metal or an alloy containing at least one metal selected from a group of gold, silver and platinum group, and the thermally-conductive silicone composition is subsequently adhered to the coated surface.
摘要翻译：将导热性有机硅组合物粘合到涂布表面上的方法，其中在含有铂类化合物和溶剂但不含烷氧基硅烷的底漆的底漆上涂布并干燥含有至少一种金属的金属或合金选自一组金，银和铂基，并且导热硅氧烷组合物随后粘附到涂布表面。

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