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1. 发明授权

US07786056B2 Heat dissipating silicone grease compositions 有权
标题翻译：散热硅脂组合物
公开(公告)号：US07786056B2
公开(公告)日：2010-08-31
申请号：US12059138
申请日：2008-03-31
申请人： Nobuaki Matsumoto , Kunihiro Yamada , Kei Miyoshi , Ikuo Sakurai , Kenichi Isobe
发明人： Nobuaki Matsumoto , Kunihiro Yamada , Kei Miyoshi , Ikuo Sakurai , Kenichi Isobe
IPC分类号： A61K9/00 , C10M173/02 , C10M169/04 , C10F7/02
CPC分类号： H01L23/3737 , C10M111/04 , C10M169/02 , C10M2201/0416 , C10M2201/0606 , C10M2201/0616 , C10M2201/0626 , C10M2201/1013 , C10M2203/0213 , C10M2203/022 , C10M2227/04 , C10M2229/041 , C10M2229/0415 , C10M2229/046 , C10N2210/02 , C10N2210/03 , C10N2220/022 , C10N2220/082 , C10N2230/08 , C10N2230/74 , C10N2240/20 , C10N2240/201 , C10N2240/202 , C10N2250/10 , H01L2924/0002 , C10N2220/028 , H01L2924/00
摘要： A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.
摘要翻译：包含3-30重量％的有机聚硅氧烷和60-96.9重量％的导热填料的硅润滑脂组合物用沸点为260-360℃的最不易挥发的异链烷烃进行稀释。尽管导热填料的重载，润滑脂组合物可以容易地应用于作为薄均匀涂层的散热器。组合物在室温下的储存稳定性显着提高，易于处理，并提供良好的散热性。

2. 发明申请

US20080269084A1 HEAT DISSIPATING SILICONE GREASE COMPOSITIONS 有权
标题翻译：热消散硅油组合物
公开(公告)号：US20080269084A1
公开(公告)日：2008-10-30
申请号：US12059138
申请日：2008-03-31
申请人： Nobuaki Matsumoto , Kunihiro Yamada , Kei Miyoshi , Ikuo Sakurai , Kenichi Isobe
发明人： Nobuaki Matsumoto , Kunihiro Yamada , Kei Miyoshi , Ikuo Sakurai , Kenichi Isobe
IPC分类号： C10M105/76
CPC分类号： H01L23/3737 , C10M111/04 , C10M169/02 , C10M2201/0416 , C10M2201/0606 , C10M2201/0616 , C10M2201/0626 , C10M2201/1013 , C10M2203/0213 , C10M2203/022 , C10M2227/04 , C10M2229/041 , C10M2229/0415 , C10M2229/046 , C10N2210/02 , C10N2210/03 , C10N2220/022 , C10N2220/082 , C10N2230/08 , C10N2230/74 , C10N2240/20 , C10N2240/201 , C10N2240/202 , C10N2250/10 , H01L2924/0002 , C10N2220/028 , H01L2924/00
摘要： A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.
摘要翻译：包含3-30重量％的有机聚硅氧烷和60-96.9重量％的导热填料的硅润滑脂组合物用沸点为260-360℃的最不易挥发的异链烷烃进行稀释。尽管导热填料的重载，润滑脂组合物可以容易地应用于作为薄均匀涂层的散热器。组合物在室温下的储存稳定性显着提高，易于处理，并提供良好的散热性。

3. 发明授权

US06372337B1 Thermally conductive grease composition and semiconductor device using the same 有权
公开(公告)号：US06372337B1
公开(公告)日：2002-04-16
申请号：US09318736
申请日：1999-05-26
申请人： Takayuki Takahashi , Kunihiro Yamada , Kenichi Isobe
发明人： Takayuki Takahashi , Kunihiro Yamada , Kenichi Isobe
IPC分类号： B32B516
摘要： A grease composition having high thermal conductivity and excellent dispensation suitability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 &mgr;m; wherein the aluminum powder is a mixture of fine metallic aluminum powder having an average size of 0.5 to 5 &mgr;m and coarse metallic aluminum powder having an average particle size of 10 to 40 &mgr;m; and a semiconductor device utilizing the aforesaid grease composition.

4. 发明授权

US06174841B1 Heat-reducing silicone grease composition and semiconductor device using the same 有权
标题翻译：减热硅脂组合物及使用其的半导体装置
公开(公告)号：US06174841B1
公开(公告)日：2001-01-16
申请号：US09409902
申请日：1999-10-01
申请人： Kunihiro Yamada , Kenichi Isobe , Takayuki Takahashi
发明人： Kunihiro Yamada , Kenichi Isobe , Takayuki Takahashi
IPC分类号： C10M11308
CPC分类号： C10M111/04 , C10M2201/0613 , C10M2201/0623 , C10M2229/0415 , C10M2229/0475 , C10M2229/0525 , C10N2220/082 , C10N2240/20 , C10N2250/10 , H01L23/3737 , H01L2224/32245 , H01L2924/09701 , H01L2924/12044 , C10N2210/04 , C10N2210/03 , C10N2210/02 , H01L2924/00
摘要： A heat-reducing silicone grease composition comprising a mixture of (A) 50-95 weight % of aluminum nitride powder having an average particle size of 0.5-10 &mgr;m and containing no particles 100 &mgr;m or greater in size, (B) 5-50 weight % of liquid silicone having a viscosity of 50-500,000 cs at 25° C. and (C) 0-30 weight % of at least one powder selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders; and a semiconductor device to which the foregoing silicone grease composition is applied.
摘要翻译：一种减热硅油组合物，其包含（A）50-95重量％的平均粒径为0.5-10μm的氮化铝粉末并且不含粒径为100μm或更大的颗粒的混合物，（B）5-50 在25℃下粘度为50-500,000cs的液体硅氧烷的重量％和（C）0-30重量％的选自氧化锌，氧化铝，氮化硼和碳化硅粉末的至少一种粉末; 以及应用上述硅氧烷润滑脂组合物的半导体装置。

5. 发明授权

US6136758A Aluminum nitride powder and thermally conductive grease composition using the same 有权
标题翻译：氮化铝粉末和使用其的导热油脂组合物
公开(公告)号：US6136758A
公开(公告)日：2000-10-24
申请号：US209455
申请日：1998-12-11
申请人： Kunihiro Yamada , Takayuki Takahashi , Kenichi Isobe
发明人： Kunihiro Yamada , Takayuki Takahashi , Kenichi Isobe
IPC分类号： C01B21/072 , C10M113/16 , C10M169/00 , C10M169/02 , C10M107/50
CPC分类号： C10M169/02 , C01B21/0728 , C10M113/16 , C10M169/00 , C10M2201/0613 , C10M2201/0616 , C10M2201/0626 , C10M2227/045 , C10N2210/02 , C10N2210/03 , C10N2250/10 , C10N2260/00
摘要： An aluminum nitride powder having the surface treated with an organosilane represented by formula, R.sup.I.sub.a R.sup.II.sub.b SiY.sub.4-1-b, and/or a partial hydrolysis condensate thereof to acquire excellent moisture-proof, wherein R.sup.I represents a 6-20C alkyl group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 6-20C alkyl group, R.sup.II represents a 1-20C hydrocarbon group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 1-20C hydrocarbon group, Y represents a hydrolyzable group, a is an integer of 1 to 3 and b is an integer of 0 to 2, provided that a+b is an integer of 1 to 3; and a thermally conductive grease composition comprising (A) 50-95 weight % of the aforementioned surface-treated aluminum nitride powder and (B) 5 to 50 weight % of at least one base oil selected from the group consisting of liquid silicones, liquid hydrocarbons and fluorohydrocarbon oils, and further, if desired, (C) 0-30 weight % of a thicknener selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders.
摘要翻译：具有用式表示的有机硅烷表面处理的氮化铝粉末，RIaRIIbSiY4-1-b和/或其部分水解缩合物，以获得优异的防湿性，其中RI表示6-20C烷基或由用卤原子或原子取代与6-20C烷基的碳原子连接的部分或全部氢原子，RII表示1-20C的烃基或通过用卤原子或原子取代部分或全部氢附着于1-20C烃基的碳原子的原子，Y表示可水解基团，a表示1〜3的整数，b表示0〜2的整数，条件是a + b为1〜3的整数。和导热性润滑脂组合物，其包含（A）50-95重量％的上述表面处理的氮化铝粉末和（B）5至50重量％的至少一种基础油，其选自液体硅酮，液体烃和氟代烃油，并且如果需要，（C）0-30重量％的选自氧化锌，氧化铝，氮化硼和碳化硅粉末的增稠剂。

6. 发明授权

US6114429A Thermally conductive silicone composition 有权
标题翻译：导热硅胶组合物
公开(公告)号：US6114429A
公开(公告)日：2000-09-05
申请号：US153334
申请日：1998-09-15
申请人： Kunihiro Yamada , Takayuki Takahashi , Kenichi Isobe
发明人： Kunihiro Yamada , Takayuki Takahashi , Kenichi Isobe
IPC分类号： C08L83/04 , H01B1/04
CPC分类号： C08L83/04 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/20 , C08G77/24 , C08G77/26 , C08G77/46 , C08G77/70
摘要： A thermally conductive silicone composition which comprises (A) 5 to 30 weight % of a liquid silicone, (B) 50 to 94.98 weight % of at least one thickener selected from the group consisting of a zinc oxide powder, an aluminum powder, an aluminum nitride powder, a boron nitride powder and a silicon carbide powder, (C) 0.01 to 10 weight % of an organopolysiloxane having at least one per molecule of hydroxyl group attached directly to a silicon atom, and (D) 0.01 to 10 weight % of an alkoxysilane, thereby retainining satisfactory thermal conductive properties and hardly causing oil bleeding over a long time.
摘要翻译：一种导热硅氧烷组合物，其包含（A）5至30重量％的液体硅氧烷，（B）50至94.98重量％的至少一种增稠剂，其选自氧化锌粉末，铝粉末，铝氮化物粉末，氮化硼粉末和碳化硅粉末，（C）0.01〜10重量％的每分子羟基至少一个羟基直接与硅原子连接的有机聚硅氧烷，（D）0.01〜10重量％烷氧基硅烷，从而保持令人满意的导热性能，并且长时间难以引起油渗出。

7. 发明授权

US06649258B2 Heat conductive silicone composition and semiconductor device 有权
公开(公告)号：US06649258B2
公开(公告)日：2003-11-18
申请号：US10133312
申请日：2002-04-29
申请人： Kunihiro Yamada , Kenichi Isobe
发明人： Kunihiro Yamada , Kenichi Isobe
IPC分类号： B32B2520
CPC分类号： H01L23/3737 , C08G77/12 , C08G77/20 , C08K3/08 , C08K3/22 , C08K2003/0812 , C08K2003/2296 , C08L83/04 , H01L2224/16 , H01L2224/32245 , H01L2224/73253 , H01L2924/00014 , Y10T428/263 , Y10T428/31663 , C08L83/00 , H01L2224/0401
摘要： A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having Si—H groups on side chains, (C) an organohydrogenpolysiloxane having an Si—H group at either end, (D) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (E) a platinum catalyst, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.

8. 发明授权

US06255257B1 Silicone grease composition 有权
标题翻译：硅油组合物
公开(公告)号：US06255257B1
公开(公告)日：2001-07-03
申请号：US09453469
申请日：1999-12-02
申请人： Kunihiro Yamada , Takayuki Takahashi , Kenichi Isobe
发明人： Kunihiro Yamada , Takayuki Takahashi , Kenichi Isobe
IPC分类号： C10M10750
CPC分类号： C10M169/02 , C10M169/00 , C10M2201/061 , C10M2201/0613 , C10M2201/062 , C10M2201/087 , C10M2201/10 , C10M2229/04 , C10M2229/0405 , C10N2210/02 , C10N2210/03 , C10N2220/021 , C10N2220/082 , C10N2240/00 , C10N2250/10
摘要： A silicone grease composition having high thermal conductivity, comprising (A) 50 to 95 weight % of a mixture of an aluminum nitride powder &agr; having an average particle size of 0.5 to 5 &mgr;m and an aluminum nitride powder &bgr; having an average particle size of 6 to 20 &mgr;m, wherein the aluminum nitride powders &agr; and &bgr; are mixed so that the &agr;/(&agr;+&bgr;) ratio by weight is from 0.1 to 0.9 and the average particle size after mixing is from 1 to 10 &mgr;m, (B) 5 to 15 weight % of organopolysiloxanes having a viscosity of from 50 to 50,000 cs at 25° C. and represented by formula R1aSiO(4−a)/2, wherein R1 represents at least one group selected from saturated or unsaturated univalent hydrocarbon groups containing 1 to 18 carbon atoms and 1.8≦a≦2.2, and (C) 0 to 35 weight % of at least one inorganic compound powder having an average particle size of 0.5 to 100 &mgr;m selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders.
摘要翻译：一种具有高导热性的硅氧烷润滑脂组合物，其包含（A）50至95重量％的平均粒度为0.5至5μm的氮化铝粉末α和平均粒径为6的氮化铝粉末β的混合物至20微米，其中将氮化铝粉末α和β混合，使得α/（α+β）重量比为0.1至0.9，混合后的平均粒度为1至10微米，（B）5 至15重量％的有机聚硅氧烷，其在25℃下具有50至50,000cs的粘度并由式R 1a SiO（4-a）/ 2表示，其中R 1表示选自饱和或不饱和的一价烃基中的至少一个基团，至18个碳原子和1.8 <= a <= 2.2，和（C）0-35重量％的至少一种平均粒度为0.5-100微米的无机化合物粉末，选自氧化锌，氧化铝，氮化硼和碳化硅粉末。

9. 发明授权

US06555905B2 Heat conductive silicone composition and semiconductor device 有权
公开(公告)号：US06555905B2
公开(公告)日：2003-04-29
申请号：US09887266
申请日：2001-06-25
申请人： Kunihiro Yamada , Kazuhiro Toba , Takayuki Takahashi , Kenichi Isobe
发明人： Kunihiro Yamada , Kazuhiro Toba , Takayuki Takahashi , Kenichi Isobe
IPC分类号： H01L2334
CPC分类号： C10M111/04 , C08G77/12 , C08G77/20 , C08K3/08 , C08K3/22 , C08K5/5419 , C08K2003/0812 , C08K2003/2296 , C08L83/04 , C10M2201/053 , C10M2201/0623 , C10M2207/021 , C10M2227/04 , C10M2229/0435 , C10M2229/0445 , C10N2240/20 , C10N2250/10 , H01L23/3737 , H01L23/4334 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/01019 , H01L2924/01078 , C08L83/00 , C08L2666/28 , C08L2666/54 , C10N2210/03 , C10N2210/02 , C10N2210/07
摘要： A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having at least two Si—H groups, (C) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (D) an organosilane having a long-chain alkyl groups, (E) platinum or a platinum compound, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.

10. 发明授权

US5256754A Hydrogenpolysiloxanes and methods of making 失效
标题翻译：氢聚硅氧烷和制备方法
公开(公告)号：US5256754A
公开(公告)日：1993-10-26
申请号：US867464
申请日：1992-04-13
申请人： Mitsuhiro Takarada , Yuji Yoshikawa , Kenichi Isobe
发明人： Mitsuhiro Takarada , Yuji Yoshikawa , Kenichi Isobe
IPC分类号： C08G77/12 , C08G77/20 , C08G77/38 , C08G77/10
CPC分类号： C08G77/38 , C08G77/12 , C08G77/20
摘要： Hydrogenpolysiloxanes having a (meth)acryloxypropyl group on a side chain are useful intermediates. They are prepared by equilibration reaction of siloxane compounds.
摘要翻译：在侧链上具有（甲基）丙烯酰氧基丙基的氢聚硅氧烷是有用的中间体。它们通过硅氧烷化合物的平衡反应制备。

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