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    • 1. 发明授权
    • Heat conductive cured product and making method
    • 导热固化产品及制作方法
    • US08334054B2
    • 2012-12-18
    • US12918528
    • 2009-02-20
    • Akihiro EndoMasaya AsaineTakahiro Maruyama
    • Akihiro EndoMasaya AsaineTakahiro Maruyama
    • B32B9/04
    • C09D183/04Y10T428/31663
    • A heat conductive cured product which can be handled even in a single layer or thin film form, can be readily attached to a heat-generating component or heat-dissipating member, and exhibits an appropriate tack and heat conductivity in a thin film form is provided as well as a method for preparing the same. A heat conductive cured product is prepared by applying a heat conductive composition as a thin film to a substrate which has been treated to have a silicone pressure-sensitive adhesive releasable surface, and curing the composition, the composition comprising as essential components, (a) an organopolysiloxane having alkenyl radicals, (b) a heat conductive filler, the filler containing at least 30 vol % of aluminum powder based on its total volume, (c) an organohydrogenpolysiloxane, (d) a platinum group metal catalyst, (e) a reaction regulator, and (f) a silicone resin.
    • 即使以单层或薄膜形式即可处理的导热固化产品也可以容易地附着在发热部件或散热部件上,并提供薄膜形式的合适的粘性和导热性 以及其制备方法。 通过将导热组合物作为薄膜施加到已经被处理以具有硅氧烷压敏粘合剂可释放表面的基底并且固化该组合物,该组合物包含作为必要成分的组合物,(a) 具有烯基的有机聚硅氧烷,(b)导热填料,所述填料含有至少30体积%的铝粉基于其总体积,(c)有机氢聚硅氧烷,(d)铂族金属催化剂,(e) 反应调节剂,和(f)有机硅树脂。
    • 4. 发明申请
    • HEAT-CONDUCTIVE SILICONE COMPOSITION
    • 导热硅胶组合物
    • US20100006798A1
    • 2010-01-14
    • US12491417
    • 2009-06-25
    • Akihiro ENDO
    • Akihiro ENDO
    • C09K5/00
    • C09K5/14
    • A heat-conductive silicone composition comprising (A) a silicone resin, (B) a heat-conductive filler, and (C) a volatile solvent is disposed between a heat-generating electronic part and a heat sink part. It is a grease-like composition at room temperature prior to application to the electronic or heat sink part. It becomes a non-flowable composition as the solvent volatilizes off after application, and this composition, when heated during operation of the electronic part, reduces its viscosity, softens or melts so that it may fill in between the electronic and heat sink parts.
    • 包含(A)有机硅树脂,(B)导热填料和(C)挥发性溶剂的导热硅氧烷组合物设置在发热电子部件和散热部件之间。 在应用于电子或散热部件之前,它是室温下的类似润滑脂的组合物。 随着溶剂在使用后挥发而变成不可流动的组合物,并且当组合物在电子部件的操作期间被加热时,其降低粘度,软化或熔化,从而可以填充在电子部件和散热部件之间。