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1. 发明授权

US5900438A Thermosetting foamable organopolysiloxane composition and process of curing the same 失效
标题翻译：热固性发泡有机聚硅氧烷组合物及其固化方法
公开(公告)号：US5900438A
公开(公告)日：1999-05-04
申请号：US130106
申请日：1998-08-06
申请人： Kei Miyoshi , Hironao Fujiki
发明人： Kei Miyoshi , Hironao Fujiki
IPC分类号： C08J9/02
CPC分类号： C08J9/02 , C08J2383/04
摘要： There is provided a thermosetting foamable organopolysiloxane composition comprising (A) an organopolysiloxane with a viscosity of 10-100,000 cSt at 25.degree. C. containing a specified amount of an alkenyl group and/or a hydroxyl group, such as a linear dimethylpolysiloxane blocked with a vinyldimethylsiloxy group or a hydroxydimethylsiloxy group at both terminal ends of the molecular chain and not containing an alkenyl group and a hydroxyl group in the diorganosiloxane repeating unit constituting the backbone chain; (B) an organohydrogenpolysiloxane and/or organohydrogensilane each having at least two hydrogen atoms bonded to silicon atoms in the molecule, such as Me.sub.3 SiO--�SiH(Me)O!.sub.40 --SiMe.sub.3 wherein Me stands for a methyl group or C.sub.6 H.sub.5 SiH.sub.3 ; (C) a compound having an active hydrogen group, such as a hydroxyl group-containing compound, such as alcohols; (D) a platinum catalyst; and (E) an acetylenic alcohol compound. This composition has shelf-stability at normal temperature and can form a foam having homogeneous foam cells in the mass production line including a heating step.
摘要翻译：提供了一种热固性可发泡有机聚硅氧烷组合物，其包含（A）在25℃下粘度为10-100,000cSt的有机聚硅氧烷，其含有指定量的烯基和/或羟基，例如用乙烯基二甲基甲硅烷氧基或羟基二甲基甲硅烷氧基，在构成主链的二有机硅氧烷重复单元中，分子链的两个末端不含有烯基和羟基，（B）各自具有与分子中的硅原子键合的至少两个氢原子的有机氢聚硅氧烷和/或有机氢硅烷，例如Me 3 SiO - [SiH（Me）O] 40-SiMe 3，其中Me表示甲基或C 6 H 5 SiH 3; （C）具有活性氢基的化合物，例如含羟基的化合物，例如醇; （D）铂催化剂; 和（E）炔醇化合物。该组合物在常温下具有保存稳定性，并且可以在大规模生产线中形成具有均匀泡沫泡沫的泡沫，其包括加热步骤。

2. 发明授权

US6040361A Organopolysiloxane compositions 失效
标题翻译：有机聚硅氧烷组合物
公开(公告)号：US6040361A
公开(公告)日：2000-03-21
申请号：US193850
申请日：1998-11-18
申请人： Hironao Fujiki , Kei Miyoshi , Hironobu Muramatsu
发明人： Hironao Fujiki , Kei Miyoshi , Hironobu Muramatsu
IPC分类号： C08K5/00 , C08K9/10 , C08L83/07 , C08G77/08
CPC分类号： C08K5/0025 , C08K9/10
摘要： More than about 9/10 (by weight as a platinum group metal atom) of the necessary amount of a platinum group metal catalyst enclosed in a compound having a melting or softening point of 40-200.degree. C., less than about 1/10 (by weight as a platinum group metal atom) of the necessary amount of a platinum group metal catalyst, and an addition reaction retarder are blended in an organopolysiloxane composition comprising an organopolysiloxane containing alkenyl or hydroxyl radicals and an organohydrogenpolysiloxane. The composition has improved shelf stability, an increased pot life, good curing capability, and fast curing upon heating.
摘要翻译：大于+ E，fra 9/10 + EE（以铂族金属原子计的重量）所需量的铂族金属催化剂，其包含在熔点或软化点为40-200℃的化合物中，将必要量的铂族金属催化剂的小于约+ E，1/10 + EE（作为铂族金属原子的重量）和加成反应延迟剂共混在包含含有烯基的有机聚硅氧烷或羟基自由基和有机氢聚硅氧烷。该组合物具有改善的贮存稳定性，适用期延长，固化能力好，加热快速固化。

3. 发明授权

US6140446A Hydrosilylation catalysts and silicone compositions using the same 失效
标题翻译：氢化硅烷化催化剂和使用其的硅氧烷组合物
公开(公告)号：US6140446A
公开(公告)日：2000-10-31
申请号：US186355
申请日：1998-11-05
申请人： Hironao Fujiki , Kei Miyoshi , Hironobu Muramatsu
发明人： Hironao Fujiki , Kei Miyoshi , Hironobu Muramatsu
IPC分类号： C08K9/10 , C08L83/07 , C08G77/08 , C08G77/12 , C08G77/20
CPC分类号： C08K9/10
摘要： A hydrosilylation catalyst is provided wherein a platinum catalyst is enclosed in a heat-fusible compound having a melting point of 40-200.degree. C. and containing an aliphatic unsaturated bond, carbonyl, carboxyl or thioether radical in a molecule. The catalyst is blended in organo-polysiloxane to form a silicone composition having both shelf stability and fast-curing capability.
摘要翻译：提供了一种氢化硅烷化催化剂，其中铂催化剂被包封在熔点为40-200℃且在分子中含有脂族不饱和键，羰基，羧基或硫醚基团的热熔性化合物中。将催化剂混合在有机聚硅氧烷中以形成具有稳定性和快速固化能力的硅氧烷组合物。

4. 发明申请

US20120029229A1 METHOD FOR PRODUCING HIGH PURITY TERMINAL OLEFIN COMPOUND 有权
标题翻译：生产高纯度终端烯烃化合物的方法
公开(公告)号：US20120029229A1
公开(公告)日：2012-02-02
申请号：US13262372
申请日：2010-01-08
申请人： Kei Miyoshi , Goro Asanuma
发明人： Kei Miyoshi , Goro Asanuma
IPC分类号： C07C7/04 , C07C253/34 , C07C67/54 , C07C45/82
CPC分类号： C07C45/85 , C07C7/005 , C07C7/04 , C07C45/82 , C07C67/60 , C07C253/34 , C07C11/02 , C07C47/21 , C07C69/533 , C07C255/07
摘要： An industrially advantageous method for producing a high purity terminal olefin is disclosed, comprising the steps of (a) contacting a mixture comprising a terminal olefin represented by formula (1): and one or more corresponding internal olefins as impurities, with a brominating agent in the presence of water or an alcohol, to convert the internal olefin(s) to compound(s) having a higher boiling point than the terminal olefin; and (b) purifying the terminal olefin by distillation from the reaction mixture.
摘要翻译：公开了一种用于生产高纯度末端烯烃的工业上有利的方法，其包括以下步骤：（a）将包含由式（1）表示的末端烯烃与一种或多种相应的内部烯烃作为杂质的混合物与溴化剂存在水或醇，将内烯烃转化成沸点高于末端烯烃的化合物; 和（b）通过蒸馏从反应混合物中纯化末端烯烃。

5. 发明授权

US07838117B2 Silicone-sealed LED 有权
标题翻译：硅胶密封LED
公开(公告)号：US07838117B2
公开(公告)日：2010-11-23
申请号：US11334471
申请日：2006-01-19
申请人： Kei Miyoshi , Eiichi Tabei
发明人： Kei Miyoshi , Eiichi Tabei
IPC分类号： B32B27/00 , H01L21/56 , C08L83/00 , C08G77/04
CPC分类号： H01L33/56 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08L83/04 , Y10T428/31663 , C08L83/00
摘要： Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.
摘要翻译：本发明提供一种硅密封LED，其包括：LED芯片，涂覆LED芯片的固化硅橡胶层和涂覆固化的硅橡胶层的周边的固化的有机硅树脂层。还提供了用于制造硅树脂密封LED的工艺和用于密封LED的工艺。在硅酮密封型LED中，设置在表示密封体的有机硅树脂层和LED芯片之间的硅橡胶层用作缓冲层，意味着在代表密封体的有机硅树脂层中不容易产生裂纹，同时充分利用硅橡胶和硅树脂的优异的耐热性，耐候性和色牢度。

6. 发明授权

US07705104B2 Addition curable silicon resin composition for light emitting diode 有权
标题翻译：用于发光二极管的加成可固化硅树脂组合物
公开(公告)号：US07705104B2
公开(公告)日：2010-04-27
申请号：US11461895
申请日：2006-08-02
申请人： Naoki Yamakawa , Kei Miyoshi
发明人： Naoki Yamakawa , Kei Miyoshi
IPC分类号： C08G77/12
CPC分类号： C08G77/44 , C08G77/12 , C08G77/14 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/70 , C08G77/80 , C08L83/04 , C08L2205/02 , C08L2205/035 , C08L83/00
摘要： An addition curable silicone resin composition for a light emitting diode is provided The composition includes an organopolysiloxane that includes a straight-chain segment represented by a formula: —(R12SiO)n— wherein, R1 is an unsaturated aliphatic bonding-free monovalent hydrocarbon group, and n is an integer of 1 or greater, and a resin-like segment consisting of R23SiO1/2 units wherein, R2 is a monovalent hydrocarbon group, an alkoxy group, or a hydroxyl group, SiO2 units, and/or R2SiO3/2 units wherein, R2 is as defined above, in which at least two of all the R2 groups are alkenyl groups. The composition exhibits strong resistance to thermal shock, and is resistant to cracking even under severe temperature cycling.
摘要翻译：提供了一种用于发光二极管的可加成固化的有机硅树脂组合物。该组合物包括有机聚硅氧烷，其包括由下式表示的直链链段： - （R 12 SiO）n - ，其中，R 1是不饱和的无脂族键结的一价烃基，和n为1以上的整数，以及由R 23 SiO 1/2单元构成的树脂状链段，其中，R 2为一价烃基，烷氧基或羟基，SiO 2单元和/或R 2 SiO 3/2单元其中R2如上所定义，其中所有R2基团中的至少两个是烯基。该组合物显示出对热冲击的强耐受性，并且即使在剧烈的温度循环下也能耐裂纹。

7. 发明申请

US20060159937A1 Silicone-sealed LED 有权
标题翻译：硅胶密封LED
公开(公告)号：US20060159937A1
公开(公告)日：2006-07-20
申请号：US11334471
申请日：2006-01-19
申请人： Kei Miyoshi , Eiichi Tabei
发明人： Kei Miyoshi , Eiichi Tabei
IPC分类号： B32B27/00 , H01L21/56 , C08L83/00
CPC分类号： H01L33/56 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08L83/04 , Y10T428/31663 , C08L83/00
摘要： Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.
摘要翻译：本发明提供一种硅密封LED，其包括：LED芯片，涂覆LED芯片的固化硅橡胶层和涂覆固化的硅橡胶层的周边的固化的有机硅树脂层。还提供了用于制造硅树脂密封LED的方法和用于密封LED的工艺。在硅酮密封型LED中，设置在表示密封体的有机硅树脂层和LED芯片之间的硅橡胶层用作缓冲层，意味着在代表密封体的有机硅树脂层中不容易产生裂纹，同时充分利用硅橡胶和硅树脂的优异的耐热性，耐候性和色牢度。

8. 发明授权

US5482992A Room temperature quick curable organopolysiloxane composition excellent in water resistance 失效
标题翻译：室温快速固化有机聚硅氧烷组合物耐水性优良
公开(公告)号：US5482992A
公开(公告)日：1996-01-09
申请号：US328515
申请日：1994-10-25
申请人： Tsuneo Kimura , Kei Miyoshi , Masatoshi Arai
发明人： Tsuneo Kimura , Kei Miyoshi , Masatoshi Arai
IPC分类号： C08K5/04 , C08G65/336 , C08K5/07 , C08K5/17 , C08L71/02 , C08L83/04 , C08L83/06 , C08J3/00 , C08K3/20 , C08L83/00 , C08G77/00
CPC分类号： C08G65/336 , C08K5/07
摘要： A room temperature curable rubber composition of a condensation curing type that comprises as a base polymer a diorganopolysiloxane or a polyoxyalkylene in which both ends of the molecular chain are blocked with a hydrolyzable silyl group, and a .beta.-dicarbonyl compound and an amino group containing organic compound that are blended with the base polymer. Since the room temperature curable rubber composition is cured with water in the air and at the same time the dehydration condensation of the .beta.-carbonyl group and the amino group produces water in the composition, the quick curability and deep curability are improved remarkably. In addition, since this dehydration condensation reaction is an irreversible reaction, the product produced by the condensation dehydration is hydrolyzed to prevent the amino group containing compound from being regenerated, and as a result the hydrophilic nature of the cured product is prevented from increasing not to damage the water resistance.
摘要翻译：一种缩合固化型室温可固化橡胶组合物，其包含作为基础聚合物的二有机聚硅氧烷或分子链两端用可水解甲硅烷基封端的聚氧化烯，以及β-二羰基化合物和含氨基的有机物与基础聚合物共混的化合物。由于室温固化橡胶组合物在空气中用水固化，同时β-羰基和氨基的脱水缩合在组合物中产生水，因此快速固化性和深度固化性显着提高。此外，由于该脱水缩合反应是不可逆反应，所以通过缩合脱水生成的产物被水解以防止含氨基化合物再生，结果，防止了固化产物的亲水性增加，不会增加损坏防水性。

9. 发明授权

US5371116A Vulcanizable organopolysiloxane composition 失效
标题翻译：可硫化的有机聚硅氧烷组合物
公开(公告)号：US5371116A
公开(公告)日：1994-12-06
申请号：US90374
申请日：1993-07-13
申请人： Takafumi Sakamoto , Masatoshi Arai , Kei Miyoshi
发明人： Takafumi Sakamoto , Masatoshi Arai , Kei Miyoshi
IPC分类号： C08K3/16 , C08F2/46 , C08K5/057 , C08K5/098 , C08K5/54 , C08K5/5419 , C08K5/5425 , C08K5/57 , C08L83/04 , C08L83/06
CPC分类号： C08K5/5425 , C08K5/5419 , C08K5/57 , C08L83/04 , C08G77/16
摘要： Vulcanizable organopolysiloxane compositions comprise a hydroxy-terminated organopolysiloxane, an acrylic or methacryllc functional alkoxy silane, a divalent tin compound, an alkoxy-.alpha.-silyl ester, a photopolymerization initiator, and a curing catalyst whereby the composition is cured by UV irradiation and/or by the action of moisture in air. The composition has good shelf stability and can yield rubber elastomers having good physical properties.
摘要翻译：可硫化的有机聚硅氧烷组合物包含羟基封端的有机聚硅氧烷，丙烯酸或甲基丙烯酸官能的烷氧基硅烷，二价锡化合物，烷氧基-α-甲硅烷基酯，光聚合引发剂和固化催化剂，由此组合物通过UV照射和/或通过空气中的水分作用。该组合物具有良好的贮存稳定性并且可以产生具有良好物理性能的橡胶弹性体。

10. 发明授权

US07951891B2 Silicone resin composition for die bonding 有权
标题翻译：用于芯片粘合的硅树脂组合物
公开(公告)号：US07951891B2
公开(公告)日：2011-05-31
申请号：US11447100
申请日：2006-06-06
申请人： Kei Miyoshi , Tomoyuki Goto , Naoki Yamakawa
发明人： Kei Miyoshi , Tomoyuki Goto , Naoki Yamakawa
IPC分类号： C08G77/00 , C08G77/04 , C08G77/12 , C08G77/20 , C08F283/00
CPC分类号： C08L83/04 , C08G77/12 , C08G77/20 , C08L2666/14 , C08L83/00
摘要： A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23° C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.
摘要翻译：提供了用于芯片接合的有机硅树脂组合物。该组合物包括（A）具有硅键合链烯基并且粘度不超过1000mPa·s的直链有机聚硅氧烷，（B）三维网状有机聚硅氧烷树脂，其为蜡状或固体（C）具有SiH基团的有机氢聚硅氧烷，（D）铂族金属类催化剂。组合物在低波长区域产生具有高硬度，良好的耐热性，透明性和透光性的固化产物。

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