会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 22. 发明申请
    • Phase-changeable memory devices and methods of forming the same
    • 相变存储器件及其形成方法
    • US20060072370A1
    • 2006-04-06
    • US11205742
    • 2005-08-17
    • Bong-Jin KuhYong-Ho HaJi-Hye Yi
    • Bong-Jin KuhYong-Ho HaJi-Hye Yi
    • G11C8/02
    • G11C13/0004H01L27/2436H01L45/06H01L45/1233H01L45/126H01L45/144H01L45/1608Y10S438/90
    • A phase-changeable memory device includes a substrate having a contact region on an upper surface thereof. An insulating interlayer on the substrate has an opening therein, and a lower electrode is formed in the opening. The lower electrode has a nitrided surface portion and is in electrical contact with the contact region of the substrate. A phase-changeable material layer pattern is on the lower electrode, and an upper electrode is on the phase-changeable material layer pattern. The insulating interlayer may have a nitrided surface portion and the phase-changeable material layer may be at least partially on the nitrided surface portion of the insulating interlayer. A nitride layer may be formed on the insulating interlayer. The lower electrode may have a nitrided surface portion and the phase-changeable material layer may be at least partially on the nitrided surface portion of the lower electrode. Methods of forming phase-changeable memory devices are also disclosed.
    • 相变型存储器件包括在其上表面具有接触区域的衬底。 衬底上的绝缘中间层具有开口,并且在开口中形成下电极。 下电极具有氮化表面部分并且与衬底的接触区域电接触。 相变材料层图案位于下电极上,上电极位于相变材料层图案上。 绝缘中间层可以具有氮化表面部分,并且相变材料层可以至少部分地在绝缘中间层的氮化表面部分上。 可以在绝缘中间层上形成氮化物层。 下部电极可以具有氮化表面部分,并且相变材料层可以至少部分地位于下部电极的氮化表面部分上。 还公开了形成相变存储器件的方法。
    • 23. 发明授权
    • Semiconductor memory device having a multiple tunnel junction layer pattern and method of fabricating the same
    • 具有多重隧道结层图案的半导体存储器件及其制造方法
    • US06686240B2
    • 2004-02-03
    • US10394030
    • 2003-03-24
    • Ji-Hye YiWoo-Sik Kim
    • Ji-Hye YiWoo-Sik Kim
    • H01L218242
    • H01L21/28273H01L21/32134H01L27/11521H01L29/42324H01L29/7881H01L29/88
    • A semiconductor memory device and fabricating method thereof, wherein the semiconductor memory device includes first and second conductive regions formed in parallel at predetermined regions of a semiconductor substrate, a storage node and a multiple tunnel junction layer pattern sequentially stacked on a channel region between the first and second conductive regions, a data line stacked on the multiple tunnel junction layer pattern, and a wordline covering both sidewalls of the storage node and of the multiple tunnel junction layer pattern, wherein both sidewalls of the storage node have undercut regions for increasing the overlapping area of the storage node and a wordline. The storage node is formed by alternately and repeatedly stacking first and second conductive layers having different etch rates, successively patterning the conductive layers to form a storage node pattern, and selectively and isotropically etching the first or second conductive layer of the storage node pattern.
    • 一种半导体存储器件及其制造方法,其中半导体存储器件包括在半导体衬底,存储节点和多个隧道结层图案的预定区域处并行形成的第一和第二导电区域, 以及第二导电区域,堆叠在所述多个隧道结层图案上的数据线,以及覆盖所述存储节点和所述多重隧道结层图案的两个侧壁的字线,其中所述存储节点的两个侧壁具有用于增加所述重叠的底切区域 存储节点的区域和字线。 存储节点通过交替地且重复地堆叠具有不同蚀刻速率的第一和第二导电层,连续地图案化导电层以形成存储节点图案,并且选择性地和各向同性地蚀刻存储节点图案的第一或第二导电层。
    • 26. 发明授权
    • Method of manufacturing a semiconductor device
    • 制造半导体器件的方法
    • US07879668B2
    • 2011-02-01
    • US12343134
    • 2008-12-23
    • Hwa-Sung RheeHo LeeMyung-Sun KimJi-Hye Yi
    • Hwa-Sung RheeHo LeeMyung-Sun KimJi-Hye Yi
    • H01L21/8238
    • H01L21/823807H01L21/26506H01L21/823814H01L29/165H01L29/665H01L29/66628H01L29/66636H01L29/7848
    • In a method of manufacturing a semiconductor device, a first gate electrode and a second gate electrode are formed in a first area and a second area of a substrate. Non-crystalline regions are formed in the first area of the substrate adjacent the first gate electrode. A layer having a first stress is formed on the substrate and the first and the second gate electrodes. A mask is formed on a first portion of the layer in the first area of the substrate to expose a second portion of the layer in the second area. The second portion is etched to form a sacrificial spacer on a sidewall of the second gate electrode. The second area of the substrate is partially etched using the mask, the second gate electrode and the sacrificial spacer, to form recesses in the second area of the substrate adjacent the second gate electrode. Patterns having a second stress are formed in the recesses.
    • 在制造半导体器件的方法中,第一栅电极和第二栅电极形成在衬底的第一区域和第二区域中。 在与第一栅电极相邻的衬底的第一区域中形成非结晶区域。 在基板和第一和第二栅电极上形成具有第一应力的层。 掩模在衬底的第一区域中的该层的第一部分上形成以暴露第二区域中该层的第二部分。 蚀刻第二部分以在第二栅电极的侧壁上形成牺牲间隔物。 使用掩模,第二栅电极和牺牲隔离物部分蚀刻衬底的第二区域,以在与第二栅电极相邻的衬底的第二区域中形成凹陷。 在凹部中形成具有第二应力的图案。