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    • 25. 发明授权
    • Processes for producing hollow molded articles
    • 生产中空成型制品的方法
    • US06730261B2
    • 2004-05-04
    • US09873295
    • 2001-06-05
    • Masaaki Ogawa
    • Masaaki Ogawa
    • B29C4950
    • B29C49/50
    • The blow-molded articles having an open end is produced by the steps of; setting a resin parison in cavity formed by a pair of metal mold members, blowing a pressurized gas into the resin parison to form an intermediate molded article, and cutting a predetermined part of the intermediate molded article with forward or backward movement of a cutting means. The cutting means is attached to the one member of the metal mold members and movable reciprocally in a cross direction relative to the longitudinal or axial direction of the metal mold members. The cutting means may be guided movably along a groove or slit formed in the metal mold members.
    • 具有开口端的吹塑制品通过以下步骤制造: 在由一对金属模具构件形成的空腔中设置树脂型坯,将加压气体吹入树脂型坯中以形成中间模制品,并且通过切割装置的向前或向后移动来切割中间模制品的预定部分。 切割装置附接到金属模具构件的一个构件,并且相对于金属模具的纵向或轴向在横向方向上往复运动。 切割装置可以沿着形成在金属模具构件中的凹槽或狭缝可移动地引导。
    • 26. 发明授权
    • Blow molding method
    • US06660217B2
    • 2003-12-09
    • US09867539
    • 2001-05-31
    • Masaaki Ogawa
    • Masaaki Ogawa
    • B29C4950
    • B29C49/04B29C49/50
    • A blow molding method for forming a hollow resin product comprises a parison extruding step, a protrusion abutting step and a confronting rod abutting step. In the extruding step, a parison is extruded from a die head towards a position interposed between a pair of molding portions. Each molding portion has a mating surface and a parison-cutting-protrusion erected from the mating surface. In the protrusion abutting step, the protrusions are abutted from each other. In the confronting rod abutting step, the spherical surfaces formed at tip ends of the rods protruded from the mating surfaces of the molding portions are abutted from each other. These steps are simultaneously executed, to thereby remove a flash from a product when the molding portions are closed. In addition to this, the rods mounted on one of molding portions are mounted on the same so as to be adjustable in its protruding length from the mating surface.
    • 28. 发明授权
    • Electronic device testing apparatus and temperature control method in an electronic device testing apparatus
    • 电子设备测试装置中的电子设备测试装置和温度控制方法
    • US07768286B2
    • 2010-08-03
    • US11990435
    • 2005-08-25
    • Shigeru HosodaMasaaki Ogawa
    • Shigeru HosodaMasaaki Ogawa
    • G01R31/02
    • G01R1/0458G01R31/2891
    • An electronic device testing apparatus is described that includes a temperature measurement device for measuring a temperature of an IC device based on a voltage of a thermal diode provided inside the IC device, a temperature sensor and a temperature applying device provided to a pusher, and a temperature control portion for calculating a correction value from a difference of a measurement temperature of a predetermined IC device by the temperature measurement device and that by the temperature sensor. A temperature of the IC device to be tested is measured by the temperature measurement device at an actual operation, and the temperature applying device is controlled based on the obtained measurement temperature and the correction value calculated by the temperature control portion.
    • 描述了一种电子设备测试装置,其包括:温度测量装置,用于基于设置在IC器件内部的热二极管的电压,温度传感器和设置在推动器上的温度施加装置来测量IC器件的温度;以及 温度控制部分,用于根据由温度测量装置的预定IC器件的测量温度与温度传感器的测量温度的差来计算校正值。 通过实际操作中的温度测量装置测量要测试的IC器件的温度,并且基于所获得的测量温度和由温度控制部分计算的校正值来控制温度施加装置。
    • 29. 发明申请
    • Electronic Device Testing Apparatus and Temperature Control Method in an Electronic Device Testing Apparatus
    • 电子设备测试仪器和温度控制方法
    • US20090051381A1
    • 2009-02-26
    • US11990435
    • 2005-08-25
    • Shigeru HosodaMasaaki Ogawa
    • Shigeru HosodaMasaaki Ogawa
    • G01R31/02
    • G01R1/0458G01R31/2891
    • An electronic device testing apparatus 1 comprising a temperature measurement device 51 for measuring a temperature of an IC device D based on a voltage of a thermal diode provided inside the IC device D, a temperature sensor 154 and a temperature applying device 153 provided to a pusher 150, and a calibration means for calculating a correction value from a difference of a measurement temperature of a predetermined IC device D by the temperature measurement device 51 and that by the temperature sensor 154; wherein a temperature of the IC device D to be tested is measured by the temperature measurement device 51 at an actual operation, and the temperature applying device 153 is controlled based on the obtained measurement temperature and a correction value calculated by the calibration means.
    • 一种电子设备测试装置1,包括:温度测量装置51,用于基于设置在IC器件D内部的热二极管的电压测量IC器件D的温度;温度传感器154;以及设置在推动器上的温度施加装置 以及校准装置,用于根据温度测量装置51和温度传感器154的预定IC器件D的测量温度的差来计算校正值; 其中在实际操作中通过温度测量装置51测量要测试的IC器件D的温度,并且基于获得的测量温度和由校准装置计算的校正值来控制温度施加装置153。