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11. 发明授权

US4451551A Radiation-sensitive poly(amic acid) polymer composition 失效
标题翻译：辐射敏感聚（酰胺酸）聚合物组合物
公开(公告)号：US4451551A
公开(公告)日：1984-05-29
申请号：US331875
申请日：1981-12-17
申请人： Fumio Kataoka , Fusaji Shoji , Isao Obara , Hitoshi Yokono , Tokio Isogai , Mitumasa Kojima
发明人： Fumio Kataoka , Fusaji Shoji , Isao Obara , Hitoshi Yokono , Tokio Isogai , Mitumasa Kojima
IPC分类号： C08K5/00 , C08L79/08 , G03F7/008 , G03F7/038 , G03C1/68
CPC分类号： G03F7/0387 , C08K5/0041 , C08L79/08 , G03F7/008 , Y10S430/12 , Y10S430/121 , Y10S522/904
摘要： A light- or radiation-sensitive polymer composition comprising (a) a poly(amic acid) having as a major component a repeating unit of the formula: ##STR1## (b) one or more light- or radiation-sensitive compounds having an amino group and an aromatic azide group or aromatic sulfonylazide group in one molecule, and if necessary (c) one or more photosensitizers and/or amine compounds having at least one unsaturated bonding, and/or (d) one or more compounds having at least two unsaturated bonding in one molecule, is highly sensitive to light and radiation and can give a precise relief pattern on a substrate. Further, a finally obtained polyimide film is excellent in heat resistance.
摘要翻译：一种光或辐射敏感性聚合物组合物，其包含（a）作为主要组分的具有下式的重复单元的聚（酰胺酸）：（b）一种或多种具有氨基的光或辐射敏感性化合物（c）一种或多种具有至少一个不饱和键的光敏剂和/或胺化合物，和/或（d）一种或多种具有至少两个不饱和键的化合物，在一个分子中的不饱和键，对光和辐射具有高度敏感性，并且可以在基底上给出精确的浮雕图案。此外，最终得到的聚酰亚胺膜的耐热性优异。

12. 发明授权

US6087006A Surface-protecting film and resin-sealed semiconductor device having said film 失效
标题翻译：具有所述膜的表面保护膜和树脂密封的半导体器件
公开(公告)号：US6087006A
公开(公告)日：2000-07-11
申请号：US517613
申请日：1995-08-22
申请人： Jun Tanaka , Fumio Kataoka , Haruhiko Kikkawa , Isao Obara , Keiko Isoda
发明人： Jun Tanaka , Fumio Kataoka , Haruhiko Kikkawa , Isao Obara , Keiko Isoda
IPC分类号： C08G73/10 , H01L23/31 , H01L23/495 , B32B9/00 , H01L23/00 , B29C13/00
CPC分类号： H01L23/3171 , C08G73/10 , H01L23/4951 , H01L2224/274 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/92147 , H01L24/45 , H01L24/48 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01039 , H01L2924/01046 , H01L2924/01077 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , Y10S428/901 , Y10T428/31504 , Y10T428/31721
摘要： A surface-protecting film is formed on the surface of the semiconductor element of a resin-sealed semiconductor device to prevent the peeling and cracking of the sealing member used in said device, by coating on said surface a polyimide precursor composition containing a polyimide precursor having a recurring unit constitution represented by the following general formula (1) and heat-curing the coated polyimide precursor composition: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic group; R.sup.2 and R.sup.3 are each a tetravalent organic group having 4 or more carbon atoms; R.sup.4 is a bivalent organic group having 4 or more carbon atoms; X is a bivalent organic group containing at least one member selected from the group consisting of oxygen and nitrogen: Y is a monovalent organic group having 15 or less carbon atoms; n=5-100 and m=0-95 with a proviso that n+m=100; and p is 1 or 2).
摘要翻译：在树脂密封半导体装置的半导体元件的表面上形成表面保护膜，以防止在所述装置中使用的密封构件的剥离和破裂，通过在所述表面上涂覆含有聚酰亚胺前体的聚酰亚胺前体组合物，由下述通式（1）表示的重复单元结构和热固化涂覆的聚酰亚胺前体组合物：其中R1是三价或四价芳族基团; R2和R3各自为具有4个或更多个碳原子的四价有机基团; R4是碳原子数为4以上的二价有机基团， X是含有选自氧和氮的至少一种的二价有机基团：Y是碳原子数为15以下的一价有机基团; n = 5-100和m = 0-95，条件是n + m = 100; p为1或2）。

13. 发明授权

US6025113A Photosensitve polymide precursor and its use for pattern formation 失效
标题翻译：光敏聚合物前体及其用于图案形成
公开(公告)号：US6025113A
公开(公告)日：2000-02-15
申请号：US876240
申请日：1997-06-16
申请人： Haruhiko Kikkawa , Fumio Kataoka , Issei Takemoto , Jun Tanaka , Keiko Isoda , Shunichiro Uchimura , Makoto Kaji , Minoru Sugiura
发明人： Haruhiko Kikkawa , Fumio Kataoka , Issei Takemoto , Jun Tanaka , Keiko Isoda , Shunichiro Uchimura , Makoto Kaji , Minoru Sugiura
IPC分类号： G03F7/027 , C08G73/10 , C08L79/08 , G03F7/031 , G03F7/038 , G03F7/40 , H01L21/027 , H01L21/312
CPC分类号： C08G73/1025 , C08G73/10 , G03F7/0387
摘要： A polyimide precursor having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group having 4 or more carbon atoms; R.sup.2 is a trivalent or tetravalent organic group having one or more aromatic rings; R.sup.3 is a monovalent organic group; A is a monovalent group showing acidity; and n is an integer of 1 or 2, is effective for preparing a highly sensitive negative-working photosensitive material developable with an alkaline aqueous solution in a short time with high resolution.
摘要翻译：一种具有下式重复单元的聚酰亚胺前体：其中R1是具有4个或更多个碳原子的四价有机基团; R2是具有一个或多个芳环的三价或四价有机基团; R3是一价有机基团; A是显示酸度的一价基团; n为1或2的整数，能够以高分辨率在短时间内制备用碱性水溶液显影的高敏感性负性感光性物质。

14. 发明授权

US5399758A Diacylhydrazine photo-reactive compounds 失效
标题翻译：二酰肼光反应性化合物
公开(公告)号：US5399758A
公开(公告)日：1995-03-21
申请号：US979225
申请日：1992-11-20
申请人： Toshimasa Miura , Ryoichi Sudo , Saori Matsuda , Fumio Kataoka
发明人： Toshimasa Miura , Ryoichi Sudo , Saori Matsuda , Fumio Kataoka
IPC分类号： B05C3/02 , B05D7/24 , C07C243/28 , C08G65/00 , C10M105/54 , C10M105/68 , C10M105/72 , C10N40/18 , C10N50/08 , C10N70/00 , G11B5/72 , G11B5/725 , G11B5/82 , G11B5/84
CPC分类号： C08G65/007 , C07C243/28
摘要： Disclosed are a novel azide compound represented, for example, by the formula, ##STR1## wherein R.sub.f represents a fluoroalkyl or fluoroalkylpolyether group, ##STR2## wherein R represents a divalent organic group having an ester bond, and R.sub.f ' represents a fluoroalkylpolyether group, and a novel diacylhydrazine compound having a fluoroalkylpolyether group in the side chain and lubricants containing them. When this lubricant is coated onto the carbonaceous protective film of magnetic recording media and reacted by the action of light or heat, it strongly bonds or adheres to the protective film. Thus, the durability of the lubricant improves, as a result of which a high-density magnetic recording medium having a high reliability and long life can be obtained.
摘要翻译：公开了一种新的叠氮化合物，例如由下式表示：其中R f表示氟代烷基或氟代烷基聚醚基团，其中R表示具有酯键的二价有机基团，Rf'表示氟代烷基聚醚基团，和在侧链中具有氟烷基聚醚基团的新的二酰基肼化合物和含有它们的润滑剂。当这种润滑剂涂覆在磁记录介质的碳质保护膜上并通过光或热的作用反应时，其强烈地粘合或粘附到保护膜上。因此，润滑剂的耐久性提高，结果可以获得高可靠性和长寿命的高密度磁记录介质。

15. 发明授权

US5388328A Process for fabricating an interconnected multilayer board 失效
标题翻译：用于制造互连的多层板的工艺
公开(公告)号：US5388328A
公开(公告)日：1995-02-14
申请号：US187546
申请日：1994-01-28
申请人： Hitoshi Yokono , Hideo Arima , Takashi Inoue , Naoya Kitamura , Haruhiko Matsuyama , Hitoshi Oka , Fumio Kataoka , Fusaji Shoji , Hideyasu Murooka , Masayuki Kyooi
发明人： Hitoshi Yokono , Hideo Arima , Takashi Inoue , Naoya Kitamura , Haruhiko Matsuyama , Hitoshi Oka , Fumio Kataoka , Fusaji Shoji , Hideyasu Murooka , Masayuki Kyooi
IPC分类号： H01L21/48 , H01L27/01 , H05K3/10 , H05K3/24 , H05K3/46
CPC分类号： H01L21/4857 , H05K3/4647 , H01L2224/1147 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/15312 , H01L2924/16152 , H01L2924/3025 , H05K2203/0733 , H05K2203/0769 , H05K3/108 , H05K3/243 , Y10S428/901 , Y10T29/49126 , Y10T29/49165
摘要： A process for the fabrication of an interconnected multilayer board involves the steps of forming a metallic under-conductive layer on a base substrate, forming a windowed resist layer on the metallic under-conductive layer, filling windows of the resist layer with a conductor by plating thereby forming a conductor layer, forming another windowed resist layer on the conductor layer and filling windows of this resist layer with a conductor by plating, thereby forming a via-hole layer and to provide a two-level structure of the conductor layer and the via-hole layer. Thereafter, the resist layers and portions of the metallic under-conductor layer other than those in contact with a lower face of the conductor constituting the conductor layer are dissolved to form a two-level skeleton structure of conductor lines and spaces within the skeleton structure are filled with a varnish in a solventless form and the varnish is cured.
摘要翻译：制造相互连接的多层板的方法包括以下步骤：在基底基板上形成金属导电层，在金属下导电层上形成窗口化抗蚀剂层，用导体用电镀填充抗蚀剂层的窗口从而形成导体层，在导体层上形成另一个窗口化的抗蚀剂层，并通过电镀用导体填充该抗蚀剂层的窗口，从而形成通孔层，并提供导体层和通孔的两层结构井层。此后，除了与形成导体层的导体的下表面接触的金属下导体层的抗蚀剂层和部分被溶解以形成骨架结构内的导体线和空间的两级骨架结构填充无溶剂形式的清漆，并且清漆被固化。

16. 发明授权

US06200831B1 Surface-protecting film and resin-sealed semiconductor device having said film 有权
标题翻译：具有所述膜的表面保护膜和树脂密封的半导体器件
公开(公告)号：US06200831B1
公开(公告)日：2001-03-13
申请号：US09528439
申请日：2000-03-17
申请人： Jun Tanaka , Fumio Kataoka , Haruhiko Kikkawa , Isao Obara , Keiko Isoda
发明人： Jun Tanaka , Fumio Kataoka , Haruhiko Kikkawa , Isao Obara , Keiko Isoda
IPC分类号： H01L2144
CPC分类号： H01L23/3171 , C08G73/10 , H01L23/4951 , H01L24/45 , H01L24/48 , H01L2224/274 , H01L2224/32014 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/92147 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01039 , H01L2924/01046 , H01L2924/01077 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , Y10S428/901 , Y10T428/31504 , Y10T428/31721 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A surface-protecting film is formed on the surface of the semiconductor element of a resin-sealed semiconductor device to prevent the peeling and cracking of the sealing member used in said device, by coating on said surface a polyimide precursor composition containing a polyimide precursor having a recurring unit constitution represented by the following general formula (1) and heat-curing the coated polyimide precursor composition: wherein R1 is a trivalent or tetravalent aromatic group; R2 and R3 are each a tetravalent organic group having 4 or more carbon atoms; R4 is a bivalent organic group having 4 or more carbon atoms; X is a bivalent organic group containing at least one member selected from the group consisting of oxygen and nitrogen: Y is a monovalent organic group having 15 or less carbon atoms; n=5-100 and m=0-95 with a proviso that n+m=100; and p is 1 or 2).
摘要翻译：在树脂密封半导体装置的半导体元件的表面上形成表面保护膜，以防止在所述装置中使用的密封构件的剥离和破裂，通过在所述表面上涂覆含有聚酰亚胺前体的聚酰亚胺前体组合物，由下述通式（1）表示的重复单元结构和热固化涂覆的聚酰亚胺前体组合物：其中R1是三价或四价芳族基团; R2和R3各自为具有4个或更多个碳原子的四价有机基团; R4是碳原子数为4以上的二价有机基团， X是含有选自氧和氮的至少一种的二价有机基团：Y是碳原子数为15以下的一价有机基团; n = 5-100和m = 0-95，条件是n + m = 100; p为1或2）。

17. 发明授权

US5536584A Polyimide precursor, polyimide and metalization structure using said polyimide 失效
标题翻译：聚酰亚胺前体，聚酰亚胺和使用所述聚酰亚胺的金属化结构
公开(公告)号：US5536584A
公开(公告)日：1996-07-16
申请号：US11493
申请日：1993-01-29
申请人： Hideo Sotokawa , Fusaji Shoji , Fumio Kataoka
发明人： Hideo Sotokawa , Fusaji Shoji , Fumio Kataoka
IPC分类号： B32B15/08 , B32B27/34 , C08G73/10 , H01L23/532
CPC分类号： C08G73/1042 , B32B15/08 , B32B27/34 , H01L23/5329 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/83191 , H01L2224/92147 , H01L24/45 , H01L2924/00014 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , Y10S428/901 , Y10T428/31681 , Y10T428/31721
摘要： A metalization structure uses a surface protective film formed of a polyimide that is produced by heating and dehydrating polyimide precursor has its molecular chain composed of recurring units represented by the following general formula (1) and recurring units represented by the following general formula (2): ##STR1## (where R.sup.1 is at least one tetravalent organic group selected from among ##STR2## R.sup.2 is at least one divalent organic group of a linear structure as selected from among ##STR3## and R.sup.3 is a divalent organic group of a crooked structure that has at least two aromatic rings).
摘要翻译：金属化结构使用由聚酰亚胺前体制造的聚酰亚胺形成的表面保护膜，其具有由以下通式（1）表示的重复单元和下述通式（2）表示的重复单元构成的分子链，（1）（2）（其中R1是从 R2中选择的至少一种四价有机基团，其为选自以下的线性结构的至少一种二价有机基团：在＆lt; IMAGE＆gt; GE＆gt;中，R 3是具有至少两个芳环的弯曲结构的二价有机基团）。

18. 发明授权

US5300735A Interconnected multilayer boards and fabrication processes thereof 失效
标题翻译：互连多层板及其制造工艺
公开(公告)号：US5300735A
公开(公告)日：1994-04-05
申请号：US37543
申请日：1993-03-22
申请人： Hitoshi Yokono , Hideo Arima , Takashi Inoue , Naoya Kitamura , Haruhiko Matsuyama , Hitoshi Oka , Fumio Kataoka , Fusaji Shoji , Hideyasu Murooka , Masayuki Kyooi
发明人： Hitoshi Yokono , Hideo Arima , Takashi Inoue , Naoya Kitamura , Haruhiko Matsuyama , Hitoshi Oka , Fumio Kataoka , Fusaji Shoji , Hideyasu Murooka , Masayuki Kyooi
IPC分类号： H01L21/48 , H01L27/01 , H05K3/10 , H05K3/24 , H05K3/46 , H05K1/00
CPC分类号： H01L21/4857 , H05K3/4647 , H01L2224/1147 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12044 , H01L2924/15312 , H01L2924/16152 , H01L2924/3025 , H05K2203/0733 , H05K2203/0769 , H05K3/108 , H05K3/243 , Y10S428/901 , Y10T29/49126 , Y10T29/49165
摘要： Described herein are interconnected mutilayer boards and their fabrication processes. Multilayer conductor lines of a skeleton structure are formed by conducting multilayer metallization while including all resist layers and metallic under-conductive layers and then removing the resist layers and metallic under-conductive layers at once. Spaces between the multilayer conductor lines of the skeleton structure are then filled with a solventless varnish so that insulating layers are formed. Modules making use of such interconnected multilayer boards and computers having such modules are also described.
摘要翻译：这里描述了互连的多层板及其制造工艺。骨架结构的多层导体线通过导电多层金属化而形成，同时包括所有的抗蚀剂层和金属的低导电层，然后立即去除抗蚀剂层和金属的不良导电层。然后用无溶剂清漆填充骨架结构的多层导体线之间的空隙，从而形成绝缘层。还描述了使用这种互连的多层板的模块和具有这种模块的计算机。

19. 发明授权

US5272247A Polyimide precursor, cured product thereof, and processes for producing them 失效
标题翻译：聚酰亚胺前体，其固化物及其制造方法
公开(公告)号：US5272247A
公开(公告)日：1993-12-21
申请号：US779986
申请日：1991-10-21
申请人： Hideo Sotokawa , Fusaji Shoji , Fumio Kataoka , Hidetaka Satou
发明人： Hideo Sotokawa , Fusaji Shoji , Fumio Kataoka , Hidetaka Satou
IPC分类号： C08G73/10 , C08G77/455 , H05K1/00 , H05K1/03 , C08G69/26
CPC分类号： C08G73/106 , C08G73/10 , C08G73/1039 , C08G73/1042 , C08G77/455 , H05K1/0346 , H05K3/4676
摘要： The present invention provides a polyimide having all of small dielectric constant, small thermal expansion coefficient, high heat resistance, high glass transition temperature and high mechanical properties, a precursor of the polyimide, and processes for producing them. A polyimide precursor whose molecular chain comprises repeating units represented by the following general formula (1) and repeating units represented by the following general formula (2): ##STR1## wherein R.sup.1 is at least one kind of tetravalent organic group selected from the group consisting of ##STR2## R.sup.2 is at least one kind of divalent organic group having a linear structure which is selected from the group consisting of ##STR3## m is an integer of 1 to 4, and R.sup.3 is a divalent organic group having a non-linear structure which contains at least two aromatic rings.
摘要翻译：本发明提供了具有小介电常数，小热膨胀系数，高耐热性，高玻璃化转变温度和高机械性能的聚酰亚胺，聚酰亚胺的前体及其制备方法。其分子链包含由以下通式（1）表示的重复单元和由以下通式（2）表示的重复单元的聚酰亚胺前体：其中R 1为至少一种选自和 R2的四价有机基团中的至少一种是具有线性结构的至少一种二价有机基团，其选自由以下组成的组： >和＆lt; IMAGE＆gt; m为1〜4的整数，R 3为含有至少2个芳香环的非线性结构的二价有机基团。

20. 发明授权

US4748228A Process for producing organic silicon-terminated polyimide precursor and polyimide 失效
标题翻译：有机硅封端聚酰亚胺前体和聚酰亚胺的制备方法
公开(公告)号：US4748228A
公开(公告)日：1988-05-31
申请号：US863241
申请日：1986-05-14
申请人： Fusaji Shoji , Haruhiko Matsuyama , Akio Fujiwara , Fumio Kataoka , Teruji Aizawa
发明人： Fusaji Shoji , Haruhiko Matsuyama , Akio Fujiwara , Fumio Kataoka , Teruji Aizawa
IPC分类号： C08G73/00 , C08G73/10 , C08G77/00
CPC分类号： C08G73/1017
摘要： An organic silicon-terminated polyimide precursor having a very stable solution viscosity is produced by polycondensing 100 parts by weight of a mixture composed of 90 to 99.5% by mole of an organic diamine represented by the following general formula (I) and 10 to 0.5% by weight by mole of an organic silyl represented by the following general formula (II): ##STR1## wherein R.sup.1 and R.sup.2 are divalent organic groups; R.sup.3 and R.sup.4 are monovalent organic groups; m is 0, 1, 2, or 3, with an organic tetracarboxylic acid dianhydride represented by the following general formula (III) in a molar amount corresponding to the 100 parts by weight of the mixture of the organic diamine and the organic silyl represented by the said general formulae (I) and (II), respectively, in an organic polar solvent at 0.degree. to 40.degree. C., thereby obtaining a solution of organic silicon-terminated polyimide precursor, and heating the solution at 50.degree. to 80.degree. C.: ##STR2## wherein R.sup.5 is a tetravelent organic group. The polyimide having good adhesion and mechanical characteristics is obtained by further heating the precursor solution at 100.degree. to 450.degree. C.
摘要翻译：通过将100重量份由以下通式（I）表示的有机二胺和90至99.5摩尔％的由下列通式（I）表示的混合物和10至0.5重量％的混合物进行缩聚来制备具有非常稳定的溶液粘度的有机硅封端的聚酰亚胺前体，（II）表示的有机甲硅烷基：其中R 1和R 2是二价有机基团;其中R 1和R 2是二价有机基团; R3和R4是一价有机基团; m为0,1,2或3，与由以下通式（III）表示的有机四羧酸二酐的摩尔量相当于有机二胺和有机甲硅烷基的混合物的100重量份，由所述通式（I）和（II）分别在有机极性溶剂中在0至40℃下进行，从而获得有机硅封端的聚酰亚胺前体溶液，并在50℃至80℃下加热该溶液（III）其中R5是四价有机基团。通过在100〜450℃下进一步加热前体溶液得到具有良好粘附性和机械特性的聚酰亚胺

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