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11. 发明申请

US20120124828A1 ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 有权
标题翻译：电子元件嵌入式印刷电路板及其制造方法
公开(公告)号：US20120124828A1
公开(公告)日：2012-05-24
申请号：US13362619
申请日：2012-01-31
申请人： Woon-Chun KIM , Soon-Gyu Yim
发明人： Woon-Chun KIM , Soon-Gyu Yim
IPC分类号： H05K3/30 , H05K3/06 , H05K3/46 , H05K3/20
CPC分类号： H05K1/186 , H01L24/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H05K3/061 , H05K3/323 , H05K3/4652 , H05K2201/0367 , H05K2201/10674 , H05K2203/0152 , H05K2203/0376 , H05K2203/063 , H05K2203/1469 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49142 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.
摘要翻译：公开了一种具有电子部件嵌入式印刷电路板的印刷电路板及其制造方法。根据本发明的实施例，制造具有在其一个表面上形成有凹槽的嵌入式电子部件和形成在凹槽内的电极的印刷电路板的制造方法包括：在第一电极的一个表面上形成第一电路图案金属层将第一金属层压在第一绝缘体上; 通过选择性地蚀刻第一金属层的另一个表面来形成第一导电突起; 以及通过设置导电粘合剂层来安装第一电子部件，使得第一电子部件的电极和第一导电突起彼此电连接。因此，可以容易且可靠地安装不具有向外突出的电极的电子部件，并且可以缩短制造时间。

12. 发明授权

US08159071B2 Semiconductor package with a metal post 有权
标题翻译：半导体封装带金属柱
公开(公告)号：US08159071B2
公开(公告)日：2012-04-17
申请号：US12405776
申请日：2009-03-17
申请人： Woon-Chun Kim , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
发明人： Woon-Chun Kim , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/053 , H01L23/12
CPC分类号： H01L21/76898 , H01L23/3114 , H01L23/481 , H01L23/525 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/10 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/05548 , H01L2224/13 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/00
摘要： Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.
摘要翻译：公开了半导体封装及其制造方法。半导体封装可以包括半导体衬底，其上形成有导电焊盘的一个表面; 绝缘层，形成在所述半导体衬底的一个表面上; 穿过导电垫，半导体衬底和绝缘层的金属柱; 以及电连接到金属柱的外层电路。通过本发明，可以不需要形成用于电连接半导体基板的两个表面的附加通孔，从而简化制造工艺，降低制造成本，并提高耦合可靠性。

13. 发明申请

US20110061727A1 DYE-SENSITIZED SOLAR CELLS AND MOBILE DEVICE INCLUDING THE SAME 审中-公开
标题翻译：透明的太阳能电池和包括它的移动装置
公开(公告)号：US20110061727A1
公开(公告)日：2011-03-17
申请号：US12650236
申请日：2009-12-30
申请人： Woon-Chun KIM , Hyun-Seop Shim , Soon-Gyu Yim
发明人： Woon-Chun KIM , Hyun-Seop Shim , Soon-Gyu Yim
IPC分类号： H01L31/00
CPC分类号： H01G9/2068 , H01G9/2031 , H01G9/2059 , H01L51/0028 , Y02E10/542 , Y02E10/549 , Y02P70/521
摘要： A dye-sensitized solar cell is disclosed. The dye-sensitized solar cell includes a first substrate, being transparent, a first electrode, formed on a rear surface of the first substrate, a second electrode, formed apart from the first electrode, a catalytic layer, formed on a rear surface of the first electrode, a light absorption layer, which is formed on a front surface of the second electrode and includes a dye absorbed into metal oxide such that the dye forms a specific pattern with the metal oxide, an electrolyte, interposed between the first electrode and the second electrode, a base layer, which is formed on a rear surface of the second electrode and forms a background against the pattern formed by the dye such that the pattern can be identified when viewed from the outside, and a second substrate, formed on a rear surface of the base layer.
摘要翻译：公开了一种染料敏化太阳能电池。染料敏化太阳能电池包括：第一基板，其是透明的，形成在第一基板的后表面上的第一电极，与第一电极分开形成的第二电极，形成在第一基板的后表面上的催化剂层第一电极，光吸收层，其形成在第二电极的前表面上，并且包括吸收到金属氧化物中的染料，使得染料与金属氧化物形成特定图案，介于第一电极和第二电极之间的电解质第二电极，基底层，其形成在第二电极的后表面上并且形成与由染料形成的图案相对的背景，使得可以从外部观察图案;以及第二基底，形成在第二电极上底层的后表面。

14. 发明授权

US08064215B2 Semiconductor chip package and printed circuit board 有权
标题翻译：半导体芯片封装和印刷电路板
公开(公告)号：US08064215B2
公开(公告)日：2011-11-22
申请号：US12230872
申请日：2008-09-05
申请人： Yul-Kyo Chung , Sung Yi , Soon-Gyu Yim , Seog-Moon Choi , Jin-Gu Kim , Young-Do Kweon
发明人： Yul-Kyo Chung , Sung Yi , Soon-Gyu Yim , Seog-Moon Choi , Jin-Gu Kim , Young-Do Kweon
IPC分类号： H05K1/18
CPC分类号： H05K1/162 , H01L23/3114 , H01L23/50 , H01L23/5389 , H01L23/642 , H01L24/25 , H01L2224/05001 , H01L2224/05548 , H01L2224/12105 , H01L2224/24227 , H01L2224/2518 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/19015 , H01L2924/19041 , H05K1/185 , H05K3/4602 , H05K2201/09763 , H05K2201/10674 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the other side of the semiconductor chip.
摘要翻译：公开了一种半导体芯片封装和具有嵌入式半导体芯片封装的印刷电路板。半导体芯片封装可以包括在一侧形成有至少一个芯片焊盘的半导体芯片和形成在半导体芯片的另一侧上的电容器。

15. 发明申请

US20100288739A1 LASER PROCESSING DEVICE 审中-公开
标题翻译：激光加工设备
公开(公告)号：US20100288739A1
公开(公告)日：2010-11-18
申请号：US12579755
申请日：2009-10-15
申请人： Jae-Kwang Lee , Sung Yi , Soon-Gyu Yim
发明人： Jae-Kwang Lee , Sung Yi , Soon-Gyu Yim
IPC分类号： B23K26/38
CPC分类号： B23K26/032 , G01B9/02081 , G01B11/02 , H05K3/0035 , H05K2203/0207 , H05K2203/108 , H05K2203/163
摘要： Disclosed is a laser processing device, which includes a processing beam source configured to irradiate a processing laser towards an object, a measuring beam source configured to irradiate a modulated measuring laser, an irradiator configured to align a path of the measuring laser with a path of the processing laser directed towards the object, a beam receiver configured to receive the measuring laser reflected from the object, an I/Q demodulator configured to calculate a phase difference between the measuring laser irradiated from the measuring beam source and the measuring laser received at the beam receiver, and a data processor configured to calculate a processed length of the object by using the phase difference. The invention can be used to measure the length of a laser-processed portion at the same time as the laser processing itself, so that the laser processing may be performed with improved precision.
摘要翻译：公开了一种激光处理装置，其包括被配置为朝向物体照射处理激光的处理光束源，被配置为照射调制测量激光的测量光束源，配置成将测量激光的路径与所述处理激光器被引导到所述物体，被配置为接收从所述物体反射的所述测量激光器的光束接收器; I / Q解调器，被配置为计算从所述测量光束源照射的所述测量激光器与在所述测量激光器处接收的所述测量激光器之间的相位差以及数据处理器，被配置为通过使用所述相位差来计算所述对象的处理长度。本发明可以用于与激光加工本身同时测量激光加工部分的长度，使得可以以更高的精度执行激光加工。

16. 发明申请

US20090073667A1 Semiconductor chip package and printed circuit board 有权
标题翻译：半导体芯片封装和印刷电路板
公开(公告)号：US20090073667A1
公开(公告)日：2009-03-19
申请号：US12230872
申请日：2008-09-05
申请人： Yul-Kyo Chung , Sung Yi , Soon-Gyu Yim , Seog-Moon Choi , Jin-Gu Kim , Young-Do Kweon
发明人： Yul-Kyo Chung , Sung Yi , Soon-Gyu Yim , Seog-Moon Choi , Jin-Gu Kim , Young-Do Kweon
IPC分类号： H05K1/18 , H01L27/06
CPC分类号： H05K1/162 , H01L23/3114 , H01L23/50 , H01L23/5389 , H01L23/642 , H01L24/25 , H01L2224/05001 , H01L2224/05548 , H01L2224/12105 , H01L2224/24227 , H01L2224/2518 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/19015 , H01L2924/19041 , H05K1/185 , H05K3/4602 , H05K2201/09763 , H05K2201/10674 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the other side of the semiconductor chip.
摘要翻译：公开了一种半导体芯片封装和具有嵌入式半导体芯片封装的印刷电路板。半导体芯片封装可以包括在一侧形成有至少一个芯片焊盘的半导体芯片和形成在半导体芯片的另一侧上的电容器。

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