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1. 发明申请

US20100288739A1 LASER PROCESSING DEVICE 审中-公开
标题翻译：激光加工设备
公开(公告)号：US20100288739A1
公开(公告)日：2010-11-18
申请号：US12579755
申请日：2009-10-15
申请人： Jae-Kwang Lee , Sung Yi , Soon-Gyu Yim
发明人： Jae-Kwang Lee , Sung Yi , Soon-Gyu Yim
IPC分类号： B23K26/38
CPC分类号： B23K26/032 , G01B9/02081 , G01B11/02 , H05K3/0035 , H05K2203/0207 , H05K2203/108 , H05K2203/163
摘要： Disclosed is a laser processing device, which includes a processing beam source configured to irradiate a processing laser towards an object, a measuring beam source configured to irradiate a modulated measuring laser, an irradiator configured to align a path of the measuring laser with a path of the processing laser directed towards the object, a beam receiver configured to receive the measuring laser reflected from the object, an I/Q demodulator configured to calculate a phase difference between the measuring laser irradiated from the measuring beam source and the measuring laser received at the beam receiver, and a data processor configured to calculate a processed length of the object by using the phase difference. The invention can be used to measure the length of a laser-processed portion at the same time as the laser processing itself, so that the laser processing may be performed with improved precision.
摘要翻译：公开了一种激光处理装置，其包括被配置为朝向物体照射处理激光的处理光束源，被配置为照射调制测量激光的测量光束源，配置成将测量激光的路径与所述处理激光器被引导到所述物体，被配置为接收从所述物体反射的所述测量激光器的光束接收器; I / Q解调器，被配置为计算从所述测量光束源照射的所述测量激光器与在所述测量激光器处接收的所述测量激光器之间的相位差以及数据处理器，被配置为通过使用所述相位差来计算所述对象的处理长度。本发明可以用于与激光加工本身同时测量激光加工部分的长度，使得可以以更高的精度执行激光加工。

2. 发明授权

US08409981B2 Semiconductor package with a metal post and manufacturing method thereof 有权
标题翻译：具有金属柱的半导体封装及其制造方法
公开(公告)号：US08409981B2
公开(公告)日：2013-04-02
申请号：US13409737
申请日：2012-03-01
申请人： Woon-Chun Kim , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
发明人： Woon-Chun Kim , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
IPC分类号： H01L21/4763
CPC分类号： H01L21/76898 , H01L23/3114 , H01L23/481 , H01L23/525 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/10 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/05548 , H01L2224/13 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/00
摘要： Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.
摘要翻译：公开了半导体封装及其制造方法。半导体封装可以包括半导体衬底，其上形成有导电焊盘的一个表面; 绝缘层，形成在所述半导体衬底的一个表面上; 穿过导电垫，半导体衬底和绝缘层的金属柱; 以及电连接到金属柱的外层电路。通过本发明，可以不需要形成用于电连接半导体基板的两个表面的附加通孔，从而简化制造工艺，降低制造成本，并提高耦合可靠性。

3. 发明申请

US20120164825A1 SEMICONDUCTOR PACKAGE WITH A METAL POST AND MANUFACTURING METHOD THEREOF 有权
标题翻译：具有金属柱的半导体封装及其制造方法
公开(公告)号：US20120164825A1
公开(公告)日：2012-06-28
申请号：US13409737
申请日：2012-03-01
申请人： Woon-Chun KIM , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
发明人： Woon-Chun KIM , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
IPC分类号： H01L21/768
CPC分类号： H01L21/76898 , H01L23/3114 , H01L23/481 , H01L23/525 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/10 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/05548 , H01L2224/13 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/00
摘要： Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.
摘要翻译：公开了半导体封装及其制造方法。半导体封装可以包括半导体衬底，其上形成有导电焊盘的一个表面; 绝缘层，形成在所述半导体衬底的一个表面上; 穿过导电垫，半导体衬底和绝缘层的金属柱; 以及电连接到金属柱的外层电路。通过本发明，可以不需要形成用于电连接半导体基板的两个表面的附加通孔，从而简化制造工艺，降低制造成本，并提高耦合可靠性。

4. 发明授权

US08159071B2 Semiconductor package with a metal post 有权
标题翻译：半导体封装带金属柱
公开(公告)号：US08159071B2
公开(公告)日：2012-04-17
申请号：US12405776
申请日：2009-03-17
申请人： Woon-Chun Kim , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
发明人： Woon-Chun Kim , Soon-Gyu Yim , Young-Do Kweon , Jae-Kwang Lee
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/053 , H01L23/12
CPC分类号： H01L21/76898 , H01L23/3114 , H01L23/481 , H01L23/525 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/10 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/05548 , H01L2224/13 , H01L2224/13024 , H01L2224/13099 , H01L2224/131 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/00
摘要： Disclosed are a semiconductor package and a manufacturing method thereof. The semiconductor package can include a semiconductor substrate, having one surface on which a conductive pad is formed; an insulating layer, being formed on one surface of the semiconductor substrate; a metal post, penetrating through the conductive pad, the semiconductor substrate, and the insulating layer; and an outer-layer circuit, being electrically connected to the metal post. With the present invention, it can become unnecessary to form an additional via for electrically connecting both surfaces of the semiconductor substrate, thereby simplifying the manufacturing process, reducing the manufacturing cost, and improving the coupling reliability.
摘要翻译：公开了半导体封装及其制造方法。半导体封装可以包括半导体衬底，其上形成有导电焊盘的一个表面; 绝缘层，形成在所述半导体衬底的一个表面上; 穿过导电垫，半导体衬底和绝缘层的金属柱; 以及电连接到金属柱的外层电路。通过本发明，可以不需要形成用于电连接半导体基板的两个表面的附加通孔，从而简化制造工艺，降低制造成本，并提高耦合可靠性。

5. 发明申请

US20110021582A1 BENZOPHENONE THIAZOLE DERIVATIVES USEFUL FOR INHIBITING FORMATION OF MICROTUBULE AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：用于抑制微生物形成的苯并噻唑衍生物及其生产方法
公开(公告)号：US20110021582A1
公开(公告)日：2011-01-27
申请号：US12934521
申请日：2009-03-05
申请人： Nam-Song Choi , Young-Hoon Kim , Jae-Kwang Lee , Hee-Ryong Kang , Ho-Jin Choi , Seung-Kee Moon , Soo-Jin Kim , Gyu-Tae Park , Byeong-Hoon Han , Dal-Hyun Kim , Jae-Hoon Choi , Sung-Sook Lee , Soon-Kil Ahn , Kyung-Joo Lee , Su-Yeal Bae
发明人： Nam-Song Choi , Young-Hoon Kim , Jae-Kwang Lee , Hee-Ryong Kang , Ho-Jin Choi , Seung-Kee Moon , Soo-Jin Kim , Gyu-Tae Park , Byeong-Hoon Han , Dal-Hyun Kim , Jae-Hoon Choi , Sung-Sook Lee , Soon-Kil Ahn , Kyung-Joo Lee , Su-Yeal Bae
IPC分类号： A61K31/427 , C07D417/10 , A61P35/00 , A61P31/04 , A61P29/00 , A61P37/00 , A61P17/06
CPC分类号： C07D417/10 , C07D417/14
摘要： Disclosed are a novel thiazole-containing benzophenone derivative represented by formula 1, and an isomer thereof, a pharmaceutically acceptable salt thereof, a hydrate thereof and a solvate thereof, a pharmaceutical composition comprising the derivative, a use of the derivative as therapeutic agent and a method for preparing the derivative. The benzophenone thiazole derivatives inhibit formation of microtubules and eliminate actively proliferating cells of malignant tumors to control general cell proliferation. In formula 1, R, R1 and R2 are defined as above.
摘要翻译：公开了由式1表示的新型含噻唑的二苯甲酮衍生物及其异构体，其药学上可接受的盐，其水合物和溶剂合物，包含该衍生物的药物组合物，该衍生物作为治疗剂的用途和制备衍生物的方法二苯甲酮噻唑衍生物抑制微管的形成并消除恶性肿瘤的积极增殖细胞以控制一般细胞增殖。在式1中，R，R 1和R 2如上所定义。

6. 发明申请

US20090275575A1 BENZOPHENONE DERIVATIVES USEFUL FOR INHIBITING FORMATION OF MICROTUBULE 有权
标题翻译：用于抑制MICROTUBULE形成的苯并噻吩衍生物
公开(公告)号：US20090275575A1
公开(公告)日：2009-11-05
申请号：US12441601
申请日：2007-09-21
申请人： Nam-Song Choi , Young-Mi Kim , Young-Hoon Kim , Jae-Kwang Lee , In-Taek Lim , Ho-Jin Choi , Hyun-Mo Yang , Seung-Kee Moon , Soo-Jin Kim , Hyun-Jung Yu , Jae-Su Shin , Young-Min Kwon , Sung-Sook Lee , Soon-Kil Ahn
发明人： Nam-Song Choi , Young-Mi Kim , Young-Hoon Kim , Jae-Kwang Lee , In-Taek Lim , Ho-Jin Choi , Hyun-Mo Yang , Seung-Kee Moon , Soo-Jin Kim , Hyun-Jung Yu , Jae-Su Shin , Young-Min Kwon , Sung-Sook Lee , Soon-Kil Ahn
IPC分类号： A61K31/5377 , C07D213/50 , A61K31/4406 , A61K31/12 , C07C49/255 , C07D413/10 , A61P35/00
CPC分类号： C07D207/333 , C07C49/84 , C07D207/335 , C07D213/50 , C07D213/64 , C07D231/12 , C07D233/54 , C07D233/64 , C07D239/26 , C07D249/08 , C07D261/08 , C07D263/32 , C07D277/24 , C07D277/28 , C07D277/30 , C07D277/40 , C07D307/46 , C07D307/52 , C07D333/20 , C07D333/22 , C07D401/10 , C07D403/10 , C07D405/10 , C07D405/12 , C07D407/10 , C07D409/10 , C07D413/10 , C07D417/04 , C07D417/10
摘要： Disclosed herein are novel benzophenone derivatives represented by formula I, a pharmaceutically acceptable salt thereof, a hydrate thereof or a solvate thereof, a pharmacological composition containing the same, and a use of the composition as therapeutic drugs. The benzophenone derivatives have an inhibition activity of microtubule formation and can be used to treat a normal proliferative state of a malignant tumor by killing the actively proliferating cells.
摘要翻译：本文公开了由式I表示的新型二苯甲酮衍生物，其药学上可接受的盐，其水合物或其溶剂合物，含有该二苯甲酮衍生物的药理学组合物，以及该组合物作为治疗药物的用途。二苯甲酮衍生物具有微管形成的抑制活性，可用于通过杀死活性增殖细胞来治疗恶性肿瘤的正常增殖状态。

7. 发明授权

US08053439B2 Benzophenone derivatives useful for inhibiting formation of microtubule 有权
标题翻译：用于抑制微管形成的二苯甲酮衍生物
公开(公告)号：US08053439B2
公开(公告)日：2011-11-08
申请号：US12441601
申请日：2007-09-21
申请人： Nam-Song Choi , Young-Mi Kim , Young-Hoon Kim , Jae-Kwang Lee , In-Taek Lim , Ho-Jin Choi , Hyun-Mo Yang , Seung-Kee Moon , Soo-Jin Kim , Hyun-Jung Yu , Jae-Su Shin , Young-Min Kwon , Sung-Sook Lee , Soon-Kil Ahn , Sun-Ju Kong
发明人： Nam-Song Choi , Young-Mi Kim , Young-Hoon Kim , Jae-Kwang Lee , In-Taek Lim , Ho-Jin Choi , Hyun-Mo Yang , Seung-Kee Moon , Soo-Jin Kim , Hyun-Jung Yu , Jae-Su Shin , Young-Min Kwon , Sung-Sook Lee , Soon-Kil Ahn , Sun-Ju Kong
IPC分类号： A61K31/341 , A61K31/381 , A61K31/40 , A61K31/415 , A61K31/4164 , A61K31/4196 , A61K31/421 , A61K31/426 , A61K31/4418 , A61K31/454 , A61K31/505 , A61K31/12 , C07C49/786 , C07D307/46 , C07D333/22 , C07D207/333 , C07D231/12 , C07D233/64 , C07D277/24 , C07D263/32 , C07D231/46 , C07D239/26
CPC分类号： C07D207/333 , C07C49/84 , C07D207/335 , C07D213/50 , C07D213/64 , C07D231/12 , C07D233/54 , C07D233/64 , C07D239/26 , C07D249/08 , C07D261/08 , C07D263/32 , C07D277/24 , C07D277/28 , C07D277/30 , C07D277/40 , C07D307/46 , C07D307/52 , C07D333/20 , C07D333/22 , C07D401/10 , C07D403/10 , C07D405/10 , C07D405/12 , C07D407/10 , C07D409/10 , C07D413/10 , C07D417/04 , C07D417/10
摘要： Disclosed herein are novel benzophenone derivatives represented by formula I, a pharmaceutically acceptable salt thereof, a hydrate thereof or a solvate thereof, a pharmacological composition containing the same, and a use of the composition as therapeutic drugs. The benzophenone derivatives have an inhibition activity of microtubule formation and can be used to treat a normal proliferative state of a malignant tumor by killing the actively proliferating cells.
摘要翻译：本文公开了由式I表示的新型二苯甲酮衍生物，其药学上可接受的盐，其水合物或其溶剂合物，含有该二苯甲酮衍生物的药理学组合物，以及该组合物作为治疗药物的用途。二苯甲酮衍生物具有微管形成的抑制活性，可用于通过杀死活性增殖细胞来治疗恶性肿瘤的正常增殖状态。

8. 发明申请

US20090253259A1 Solder ball attachment jig and method for manufacturing semiconductor device using the same 审中-公开
标题翻译：焊球附着夹具及其制造方法
公开(公告)号：US20090253259A1
公开(公告)日：2009-10-08
申请号：US12222967
申请日：2008-08-20
申请人： Jingli Yuan , Young-Do Kweon , Jae-Kwang Lee , Jong-Hwan Baek , Hyung-Jin Jeon , Seung-Wook Park
发明人： Jingli Yuan , Young-Do Kweon , Jae-Kwang Lee , Jong-Hwan Baek , Hyung-Jin Jeon , Seung-Wook Park
IPC分类号： H01L21/60 , B23K37/04
CPC分类号： B23K1/0016 , H01L21/6835 , H01L24/11 , H01L2224/0231 , H01L2224/02333 , H01L2224/0401 , H01L2224/11003 , H01L2224/11334 , H01L2224/13022 , H01L2224/13099 , H01L2224/16 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/014
摘要： Disclosed are a solder attachment jig and a method of manufacturing a semiconductor device using the same. The solder ball attachment jig, which arranges a solder ball to be aligned with a conductive post of a semiconductor wafer, can include a body and a receiving hole, which is formed on the body to hold the solder ball. Internal walls of the receiving hole that face each other are symmetrically inclined. Using the solder ball attachment jig in accordance with an embodiment of the present invention, the alignment of the solder ball can be improved while reducing the cost and simplifying the processes.
摘要翻译：公开了焊接附着夹具和使用其的半导体器件的制造方法。布置焊球与半导体晶片的导电柱对准的焊球附着夹具可以包括主体和容纳孔，其形成在主体上以保持焊球。相互面对的接收孔的内壁对称地倾斜。使用根据本发明的实施例的焊球附着夹具，可以提高焊球的对准，同时降低成本并简化工艺。

9. 发明申请

US20050083792A1 Data reproducing apparatus capable of reproducing an arbitrarily selected part of audio data and method thereof 审中-公开
标题翻译：能够再现音频数据的任意选择部分的数据再生装置及其方法
公开(公告)号：US20050083792A1
公开(公告)日：2005-04-21
申请号：US10918488
申请日：2004-08-16
申请人： Jae-Kwang Lee
发明人： Jae-Kwang Lee
IPC分类号： G11B20/10 , G11B21/08 , G11B27/00
CPC分类号： G11B20/10 , G11B27/007 , G11B2020/10537 , G11B2020/10546 , G11B2220/2562
摘要： A data reproducing apparatus and a control method thereof which is provided to store audio data of a selected section when a user inputs a section selection during a data reproduction, and then selectively reproduce only the audio data of the selected section according to a user's request. The apparatus includes a reproduction processing part for processing and reproducing the data recorded in an optical recording medium, a storage part for storing address information of an audio entity which corresponds to the selected section of the audio data, and a control part for controlling the reproduction processing part to reproduce the audio entity if a user's selection and reproduction request for the audio entity is input through an interface part.
摘要翻译：一种数据再现装置及其控制方法，用于当用户在数据再现期间输入片段选择时存储所选部分的音频数据，然后根据用户的请求有选择地仅再现所选部分的音频数据。该装置包括用于处理和再现记录在光学记录介质中的数据的再现处理部分，用于存储对应于音频数据的所选部分的音频实体的地址信息的存储部分和用于控制再现的控制部分如果通过接口部分输入了音频实体的用户选择和再现请求，则处理部分再现音频实体。

10. 发明授权

US07760932B2 Method for reconstructing three-dimensional structure using silhouette information in two-dimensional image 失效
标题翻译：使用二维图像中的轮廓信息重建三维结构的方法
公开(公告)号：US07760932B2
公开(公告)日：2010-07-20
申请号：US11511732
申请日：2006-08-29
申请人： Jae-Kwang Lee , Chang-Joon Park , In-Ho Lee , Hyun-Bin Kim
发明人： Jae-Kwang Lee , Chang-Joon Park , In-Ho Lee , Hyun-Bin Kim
IPC分类号： G06K9/00 , G06T17/00
CPC分类号： G06K9/20 , G06K2209/40
摘要： A method for reconstructing a three-dimensional structure using silhouette information on a two-dimensional plane is provided. The method includes: obtaining silhouette images; creating a cube on a three-dimensional space using the silhouette images; calculating vertex coordinates on a two-dimensional image plane by projecting eight vertices of the three-dimensional cube on a two-dimensional image plane of a first camera; dividing into multiple inner voxels by dividing sides formed by the eight vertices by a divider; dividing into a predetermined number of regions by dividing sides connecting the coordinates by a predetermined divider; assigning indices by matching cubes of the three-dimensional cube to square regions on the two-dimensional image plane in one to one manner; storing indices of regions where the square regions meets with a first silhouette image; and reconstructing three-dimensional structure by finding common indices through repeatedly performing the steps using other silhouette images.
摘要翻译：提供了使用二维平面上的轮廓信息来重建三维结构的方法。该方法包括：获得剪影图像; 使用剪影图像在三维空间上创建立方体; 通过在第一相机的二维图像平面上投影三维立方体的八个顶点来计算二维图像平面上的顶点坐标; 通过将由八个顶点形成的边划分成分隔线，将其划分成多个内部体素; 通过将连接该坐标的一侧划分预定的分割器来划分为预定数量的区域; 通过将三维立方体的立方体与二维图像平面上的方形区域一一对应地分配索引; 存储所述正方形区域与第一轮廓图像相交的区域的索引; 并通过重复执行使用其他轮廓图像的步骤来找到共同的索引来重建三维结构。

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