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11. 发明申请

US20060152694A1 Substrate processing apparatus 审中-公开
标题翻译：基板加工装置
公开(公告)号：US20060152694A1
公开(公告)日：2006-07-13
申请号：US11295216
申请日：2005-12-06
申请人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi , Tsuyoshi Okumura
发明人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi , Tsuyoshi Okumura
IPC分类号： G03B27/32
CPC分类号： G03F7/30 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67178 , H01L21/67225
摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a washing processing block, and an interface block. An exposure device is arranged adjacent to the interface block. The washing processing block comprises washing processing group. A resist film is formed in the resist film processing block. Before the substrate is subjected to exposure processing by the exposure device, the substrate is subjected to washing and drying processing in the washing processing group.
摘要翻译：基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块，洗涤处理块和接口块。曝光装置设置在接口块附近。洗涤处理块包括洗涤处理组。在抗蚀剂膜处理块中形成抗蚀剂膜。在通过曝光装置对基板进行曝光处理之前，在洗涤处理组中对基板进行洗涤和干燥处理。

12. 发明授权

US06963789B2 Substrate processing apparatus control system and substrate processing apparatus 失效
标题翻译：基板处理装置控制系统和基板处理装置
公开(公告)号：US06963789B2
公开(公告)日：2005-11-08
申请号：US10253010
申请日：2002-09-23
申请人： Tamihiro Bun , Kinya Murata , Kenji Hashinoki , Kenji Kamei , Noriaki Yokono , Kenji Sugimoto , Tsuyoshi Mitsuhashi
发明人： Tamihiro Bun , Kinya Murata , Kenji Hashinoki , Kenji Kamei , Noriaki Yokono , Kenji Sugimoto , Tsuyoshi Mitsuhashi
IPC分类号： H01L21/66 , H01L21/00 , G06F19/00
CPC分类号： H01L21/67253
摘要： A controller is connected to a substrate processing apparatus and an exposure apparatus. A pilot substrate subjected to a series of processing as preprocessing is transported to an inspection unit. An inspection result determination part compares inspection results received from the inspection unit with substrate condition data so that a condition change instruction part changes the processing condition of each processing unit when no requirement is satisfied. This operation is so repeated that a processing control part executes actual processing according to recipe data when the inspection results satisfy the requirement. Thus, the efficiency a step of changing the processing condition of each processing part in response to the inspection results in the inspection part is improved in preprocessing executed in the substrate processing apparatus.
摘要翻译：控制器连接到基板处理装置和曝光装置。经过一系列处理作为预处理的先导基板被输送到检查单元。检查结果确定部分将从检查单元接收的检查结果与基板条件数据进行比较，使得条件改变指示部分在不要求满足时改变每个处理单元的处理条件。该操作如此重复，使得当检查结果满足要求时，处理控制部分根据配方数据执行实际处理。因此，在基板处理装置中执行的预处理中，提高了响应于检查结果的检查结果改变各处理部的处理条件的效率。

13. 发明授权

US5677000A Substrate spin treating method and apparatus 失效
标题翻译：底物旋转处理方法和装置
公开(公告)号：US5677000A
公开(公告)日：1997-10-14
申请号：US699728
申请日：1996-08-19
申请人： Katsushi Yoshioka , Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Kenji Sugimoto
发明人： Katsushi Yoshioka , Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Kenji Sugimoto
IPC分类号： B05C11/08 , G03F7/16 , H01L21/00 , H01L21/027 , H01L21/304 , B05D3/12 , B05C11/00
CPC分类号： H01L21/6715 , G03F7/162
摘要： A substrate spin treating method and apparatus having a cup cleaner device for cleaning a scatter preventive cup, which cleaner device does not require attaching and/or detaching of a cleaning jig. The cleaner device is driven through engagement with a spin chuck which operates at a low torque that is provided for normal substrate spin treating operation. During the normal spin treating operation, only the spin chuck is driven by a rotary shaft, with the cup cleaner device being disengaged from the spin chuck and its driving rotary shaft. For a cup cleaning operation, the spin chuck and scatter preventive cup are vertically moved relative to each other to place the cup cleaner device at a cup cleaning height and to drivingly connect the cup cleaner device to the rotary shaft through a torque transmitter. In this state, the cup cleaner device is rotated to establish a centrifugal force that scatters a cleaning solution supplied to a cleaning solution guide of the cup cleaner device from cleaning solution supply nozzles, thereby cleaning inner surfaces of the scatter preventive cup.
摘要翻译：一种具有用于清洁散射防止杯的杯子清洁器装置的衬底旋转处理方法和装置，该清洁装置不需要附着和/或拆卸清洁夹具。清洁器装置通过与旋转卡盘啮合而被驱动，旋转卡盘以为正常的基底旋转处理操作提供的低扭矩操作。在正常的旋转处理操作期间，只有旋转卡盘由旋转轴驱动，杯子清洁器装置与旋转卡盘及其驱动旋转轴脱离。对于杯子清洁操作，旋转卡盘和防散射杯相对于彼此垂直移动，以将杯清洁器设备放置在杯清洁高度处，并且通过扭矩传递器驱动地将杯清洁器装置连接到旋转轴。在这种状态下，杯子清洁器装置被旋转以建立离心力，该离心力将供应到杯清洁器装置的清洁溶液引导件的清洁溶液从清洁溶液供应喷嘴分散，从而清洁防散射杯的内表面。

14. 发明授权

US5364746A Developer for silver halide photographic light-sensitive material 失效
标题翻译：用于卤化银照相感光材料的显影剂
公开(公告)号：US5364746A
公开(公告)日：1994-11-15
申请号：US216765
申请日：1994-03-23
申请人： Kenichi Inoue , Tsuyoshi Mitsuhashi
发明人： Kenichi Inoue , Tsuyoshi Mitsuhashi
IPC分类号： G03C5/305
CPC分类号： G03C5/305
摘要： A developer for developing a silver halide photographic material is disclosed. The developer comprises a compound represented by Formula 1 or Formula 2; ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 are each a hydrogen atom or an alkyl group having 1 to 3 carbon atoms provided that both of R.sub.1 and R.sub.2 are not hydrogen atoms at the same time; R.sub.5 is a hydroxy group, an amino group or an alkyl group having 1 to 3 carbon atoms; R.sub.6 and R.sub.7 are each a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, an acyl group having 1 to 18 carbon atoms or a --COOM.sub.2 group, provided that both of R.sub.1 and R.sub.2 are not hydrogen atoms at the same time, in the above M.sub.1 is a hydrogen atom, an alkali metal atom or an ammonium group; m is an integer 0, 1 or 2; and M.sub.2 is a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkali metal atom, an aryl group or an aralkyl group having not more than 15 carbon atoms. Formation of silver sludge in the developer is prevented.
摘要翻译：公开了用于开发卤化银照相材料的显影剂。显影剂包含由式1或式2表示的化合物; （1）其中R1，R2，R3和R4各自为氢原子或具有1至3个碳原子的烷基，条件是R1和R2两者不同于氢原子时间; R5是羟基，氨基或碳原子数1〜3的烷基; R6和R7各自为氢原子，具有1至5个碳原子的烷基，具有1至18个碳原子的酰基或-COOM 2基团，条件是R1和R2两者同时不是氢原子，在上述M1中是氢原子，碱金属原子或铵基; m是整数0,1或2; M2为氢原子，碳原子数为1〜4的烷基，碱金属原子，芳基，碳原子数为15以下的芳烷基。防止在显影剂中形成银污泥。

15. 发明授权

US5322822A Ultra-high-strength refractory silicon carbide fiber and process for producing same 失效
$Ultra-high-strength refractory silicon carbide fiber and process for producing same$
标题翻译：超高强耐火碳化硅纤维及其制造方法
公开(公告)号：US5322822A
公开(公告)日：1994-06-21
申请号：US971088
申请日：1992-11-04
申请人： Tadao Seguchi , Noboru Kasai , Kiyohito Okamura , Masaki Sugimoto , Tsuyoshi Mitsuhashi
发明人： Tadao Seguchi , Noboru Kasai , Kiyohito Okamura , Masaki Sugimoto , Tsuyoshi Mitsuhashi
IPC分类号： D01F9/10 , C04B35/571 , C04B35/54 , C04B35/56
CPC分类号： C04B35/571
摘要： Ultra-high-strength refractory silicon carbide fiber having a decomposition temperature of not less than about 1800K, a breaking strength of not less than about 5 GPa, and a modulus of elasticity of not less than about 300 GPa is disclosed, which is obtained by irradiating a precursor comprising organosilicon compound fiber with an ionizing radiation in a mixed carrier gas comprising a reactive gas and a first inert gas to render the precursor infusible and calcining the irradiated precursor in a second inert gas. Irradiation damage can be minimized, and no oxygen is incorporated into the fiber.
摘要翻译：公开了具有分解温度不低于约1800K，断裂强度不小于约5GPa，弹性模量不小于约300GPa的超高强度耐火碳化硅纤维，其通过在包含反应性气体和第一惰性气体的混合载体气体中用电离辐射照射包含有机硅化合物纤维的前体，以使前体不熔融并将经辐射的前体煅烧在第二惰性气体中。照射损伤可以最小化，并且不会在纤维中掺入氧气。

16. 发明授权

US08851008B2 Parallel substrate treatment for a plurality of substrate treatment lines 有权
标题翻译：用于多个基板处理线的平行基板处理
公开(公告)号：US08851008B2
公开(公告)日：2014-10-07
申请号：US12163951
申请日：2008-06-27
申请人： Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
发明人： Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Hiroyuki Ogura , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
IPC分类号： B05C13/00 , B05C5/00 , H01L21/31 , H01L21/00 , H01L21/67 , B05D5/12 , B05B15/12 , B05D3/04
CPC分类号： H01L21/67178 , B05B14/43 , B05B14/44 , B05C13/00 , B05C13/02 , B05D3/0486 , G03F7/26 , H01L21/67017 , H01L21/6715 , H01L21/67173 , H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67225 , H01L23/34 , H01L2924/0002 , Y10S414/135 , H01L2924/00
摘要： A substrate treating apparatus includes a plurality of substrate treatment lines arranged vertically. Each substrate treatment line has a plurality of main transport mechanisms arranged horizontally, and a plurality of treating units provided for each main transport mechanism for treating substrates. A series of treatments is carried out for the substrates, with each main transport mechanism transporting the substrates to the treating units associated therewith, and transferring the substrates to the other main transport mechanism horizontally adjacent thereto. The substrate treating apparatus realizes increased processing capabilities by treating the substrates in parallel through the substrate treatment lines.
摘要翻译：基板处理装置包括垂直布置的多个基板处理线。每个基板处理线具有水平布置的多个主传送机构，以及为每个用于处理基板的主传送机构设置的多个处理单元。对于基板进行一系列处理，每个主传送机构将基板传送到与其相关联的处理单元，并将基板传送到与其水平相邻的另一主传送机构。基板处理装置通过基板处理线平行地处理基板来实现增加的处理能力。

17. 发明授权

US08040488B2 Substrate processing apparatus 有权
标题翻译：基板加工装置
公开(公告)号：US08040488B2
公开(公告)日：2011-10-18
申请号：US11294727
申请日：2005-12-06
申请人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi , Tsuyoshi Okumura
发明人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi , Tsuyoshi Okumura
IPC分类号： G03B27/32 , G03B27/52 , G03D5/00
CPC分类号： G03F7/70991 , H01L21/67051 , H01L21/67173 , H01L21/67178
摘要： A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a processing block for liquid immersion exposure processing, and an interface block. An exposure device is arranged adjacent to the interface block. The processing block for liquid immersion exposure processing comprises a coating processing group for resist cover film and a removal processing group for resist cover film. The resist cover film is formed in the processing block for liquid immersion exposure processing before the exposure processing. The resist cover film is removed in the processing block for liquid immersion exposure processing after the exposure processing.
摘要翻译：基板处理装置包括分度器块，抗反射膜处理块，抗蚀剂膜处理块，显影处理块，用于液浸曝光处理的处理块和界面块。曝光装置设置在接口块附近。用于液浸曝光处理的处理块包括用于抗蚀剂覆盖膜的涂覆处理组和抗蚀剂覆盖膜的去除处理组。在曝光处理之前，在用于液浸曝光处理的处理块中形成抗蚀剂覆盖膜。在曝光处理之后，在用于液浸曝光处理的处理块中去除抗蚀剂覆盖膜。

18. 发明申请

US20100129526A1 SUBSTRATE PROCESSING APPARATUS 审中-公开
标题翻译：基板加工设备
公开(公告)号：US20100129526A1
公开(公告)日：2010-05-27
申请号：US12698876
申请日：2010-02-02
申请人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi , Tsuyoshi Okumura
发明人： Shuichi Yasuda , Masashi Kanaoka , Koji Kaneyama , Tadashi Miyagi , Kazuhito Shigemori , Toru Asano , Yukio Toriyama , Takashi Taguchi , Tsuyoshi Mitsuhashi , Tsuyoshi Okumura
IPC分类号： B05D5/12
CPC分类号： H01L21/67034 , G03F7/38 , H01L21/67028 , H01L21/67051 , H01L21/67178 , H01L21/67207
摘要： A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes the steps of forming a film made of a photosensitive material on the substrate by said first processing unit before exposure processing by said exposure device. The method also includes applying drying processing to the substrate by said second processing unit after the exposure processing by said exposure device and applying development processing to the substrate by said third processing unit after the drying processing by said second processing unit
摘要翻译：一种在与曝光装置相邻并且包括第一，第二和第三处理单元的基板处理装置中处理基板的方法，包括以下步骤：在所述基板上由所述第一处理单元形成由感光材料制成的膜，曝光装置的曝光处理。该方法还包括在所述曝光装置的曝光处理之后通过所述第二处理单元对所述基板进行干燥处理，并且在所述第二处理单元进行干燥处理之后，通过所述第三处理单元对所述基板施加显影处理

19. 发明申请

US20090165711A1 SUBSTRATE TREATING APPARATUS WITH SUBSTRATE REORDERING 审中-公开
标题翻译：基板处理装置与底板相关
公开(公告)号：US20090165711A1
公开(公告)日：2009-07-02
申请号：US12343302
申请日：2008-12-23
申请人： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
发明人： Hiroyuki Ogura , Tsuyoshi Mitsuhashi , Yoshiteru Fukutomi , Kenya Morinishi , Yasuo Kawamatsu , Hiromichi Nagashima
IPC分类号： B05C11/00
CPC分类号： H01L21/67745 , H01L21/6715 , H01L21/67178 , H01L21/67276 , H01L21/67754 , H01L21/6776
摘要： A treating section has substrate treatment lines arranged one over the other for treating substrates while transporting the substrates substantially horizontally. An IF section transports the substrates fed from each substrate treatment line to an exposing machine provided separately from this apparatus. The substrates are transported to the exposing machine in the order in which the substrates are loaded into the treating section. The throughput of this apparatus can be improved greatly, without increasing the footprint, since the substrate treatment lines are arranged one over the other. Each substrate can be controlled easily since the order of the substrates transported to the exposing machine is in agreement with the order of the substrates loaded into the treating section.
摘要翻译：一个处理部分具有一个相互排列的衬底处理线，用于处理衬底，同时基本上水平地传送衬底。 IF部分将从每个基板处理线馈送的基板输送到与该装置分开设置的曝光机。将基板按照将基板装入处理部的顺序输送到曝光机。由于基板处理线彼此排列，因此能够大大提高该装置的生产量，而不增加占用面积。可以容易地控制每个基板，因为输送到曝光机的基板的顺序与装载到处理部中的基板的顺序一致。

20. 发明申请

US20090107519A1 METHOD AND SYSTEM FOR CHEMICALLY ENHANCED LASER TRIMMING OF SUBSTRATE EDGES 审中-公开
标题翻译：用于化学加速激光切割基板边缘的方法和系统
公开(公告)号：US20090107519A1
公开(公告)日：2009-04-30
申请号：US11929186
申请日：2007-10-30
申请人： Tetsuya Ishikawa , Tsuyoshi Mitsuhashi , Ming Xi
发明人： Tetsuya Ishikawa , Tsuyoshi Mitsuhashi , Ming Xi
IPC分类号： B08B7/04
CPC分类号： B08B7/0042 , H01L21/02087 , H01L21/67051 , H01L21/6708
摘要： An apparatus for processing a peripheral portion of a substrate includes a housing and a spin chuck mounted within the housing and configured to support the substrate in a substantially horizontal orientation. The apparatus also includes a fluid dispense nozzle coupled to the housing and proximate to the peripheral portion of the substrate. The fluid dispense nozzle is in fluid communication with a source of a chemical and configured to direct a flow of the chemical to the peripheral portion of the substrate located at a first radial distance from a center of the substrate. The apparatus further includes a light guide optically coupled to a laser source. The light guide is configured to direct radiation to the peripheral portion of the substrate located at a second radial distance from the center of the substrate greater than the first radial distance.
摘要翻译：用于处理衬底的周边部分的设备包括壳体和安装在壳体内并被配置为以基本上水平的方向支撑衬底的旋转卡盘。该设备还包括流体分配喷嘴，其连接到壳体并且靠近基板的周边部分。流体分配喷嘴与化学物质的源流体连通，并被配置为将化学物质的流引导到位于距衬底中心的第一径向距离的衬底的周边部分。该装置还包括光学耦合到激光源的光导。光导被配置为将辐射引导到位于距离基板中心的第二径向距离的基板的周边部分大于第一径向距离。

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